Patents by Inventor Hung Yu

Hung Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11770987
    Abstract: A ReRAM device includes a dielectric layer, a bottom electrode, a data storage layer, a metal covering layer, and a top electrode. The dielectric layer has a recess. At least a portion of the bottom electrode is exposed through the recess. The data storage layer is disposed on a sidewall and a bottom surface of the recess, electrically contacts with the bottom electrode, and has a top portion lower than an opening of the recess. The metal covering layer blanket covers the data storage layer, has an extension portion covering the top portion, and connects to the sidewall of the recess. The top electrode is disposed in the recess, and is electrically contact with the metal covering layer.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: September 26, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Shu-Hung Yu, Chun-Hung Cheng, Chuan-Fu Wang
  • Publication number: 20230291318
    Abstract: A switch mode power supply circuit with high voltage output, an electrostatic spray apparatus and agricultural plant protection apparatus using the same are provided. The switch mode power supply circuit is electrically connected in series with at least a pre-stage power converter and a post-stage power converter. In order to simplify the control, the switch of the pre-stage power converter is omitted, only one switch of the post-stage power converter is adopted to perform synchronous control. Since the multiple sets of power conversion circuits in the previous stage are connected in series, the turn ratio of the transformer in the power converter in the subsequent stage can be reduced. Therefore, the transformer can be miniaturized and the power supply circuit would be more suitable for agricultural plant protection machine and electrostatic spray apparatus.
    Type: Application
    Filed: October 4, 2022
    Publication date: September 14, 2023
    Inventors: YU-KAI CHEN, CHAU-CHUNG SONG, HUNG-YU CHEN
  • Publication number: 20230284055
    Abstract: A method of inter-cell coordination for intelligent reflecting surface (IRS) assisted wireless network is provided. The method includes: receiving mode information corresponding to a first intelligent reflecting surface and a second intelligent reflecting surface; performing a channel measurement according to the mode information to generate a measurement report; transmitting the measurement report to a serving base station; and performing data transmission via the first intelligent reflecting surface and the second intelligent reflecting surface configured according to the measurement report.
    Type: Application
    Filed: March 7, 2022
    Publication date: September 7, 2023
    Applicant: Acer Incorporated
    Inventor: Hung-Yu Wei
  • Publication number: 20230283357
    Abstract: A method of channel measurement for intelligent reflecting surface assisted wireless network and a base station (BS) using the same method are provided. The method includes: transmitting a measurement configuration comprising mode information of an intelligent reflecting surface to a user equipment; receiving a measurement report corresponding to the measurement configuration from the user equipment, wherein the measurement report corresponds to a channel between the user equipment and the intelligent reflecting surface; and outputting a command according to the measurement report.
    Type: Application
    Filed: March 2, 2022
    Publication date: September 7, 2023
    Applicant: Acer Incorporated
    Inventor: Hung-Yu Wei
  • Patent number: 11747671
    Abstract: A display device enabling external objects to be shown therein comprises a main body formed with a space, a backlight module disposed in the space and a display module disposed in the space. The backlight module comprises a light projection surface, the display and backlight modules are separately disposed by a spacing for at least one external object to locate therein. The display module comprises a transparent display structure, a first optical film disposed on one side of the transparent display structure facing the surface, and a second optical film disposed on the other side. The first optical film enables a light projected by the backlight module and a light reflected by the main body to pass through. The second optical film enables a light from the transparent display structure to pass through, and reflects an ambient light outside the main body.
    Type: Grant
    Filed: August 31, 2022
    Date of Patent: September 5, 2023
    Assignee: HIGGSTEC INC.
    Inventors: Tzu-Chien Lin, Chun-Wei Yeh, Hung-Yu Tsai
  • Publication number: 20230274932
    Abstract: A method for processing a substrate includes treating the substrate with a small molecular inhibitor (SMI), the substrate including a recess formed in a dielectric layer and a first metal layer in the recess, the SMI covering a surface of the first metal layer. The method further includes, after treating the substrate with the SMI, treating the substrate with a large molecular inhibitor (LMI), the LMI covering sidewalls of the dielectric layer in the recess. The method further includes heating the substrate to remove the SMI from the first metal layer and to expose the first metal layer in the recess, where the LMI remains on the sidewalls after removing the SMI from the first metal layer. The method further includes depositing a second metal over the first metal layer in the recess, where the LMI covering the sidewalls prevents deposition of the second metal on the dielectric layer.
    Type: Application
    Filed: January 18, 2023
    Publication date: August 31, 2023
    Inventors: Kai-Hung Yu, Robert D. Clark, Ryota Yonezawa, Hiroaki Niimi, Hidenao Suzuki, Kandabara Tapily, Takahiro Miyahara, Cory Wajda
  • Publication number: 20230276031
    Abstract: A filter element and a projection device are provided. The filter element is configured on the transmission path of at least one light beam, and includes a substrate and a film. The film is located on a surface of the substrate, and includes a first area and a second area. The first area includes a center, corresponding to the central axis of the at least one light beam. The distance between the second area and the center of the first area is greater than the distance between any point in the first area and the center. The average thickness of the second area of the film is greater than the average thickness of the first area of the film. The filter element of the disclosure may still have a similar filter effect when the incident angle is relatively large.
    Type: Application
    Filed: February 23, 2023
    Publication date: August 31, 2023
    Applicant: Coretronic Corporation
    Inventors: Chi-Fu Liu, Tsung-Hsin Liao, Kun-Liang Jao, Hung-Yu Lin
  • Patent number: 11742265
    Abstract: In some examples, a semiconductor package comprises a lead frame. The lead frame includes a first row of leads; a first pad coupled to the first row of leads; a second row of leads; and a second pad coupled to the second row of leads, the first and second pads separated by a gap. The semiconductor package includes a heat-generating device coupled to the first and second pads and exposed to an exterior of the semiconductor package.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: August 29, 2023
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Hung-Yu Chou, Chi-Chen Chien, Yuh-Harng Chien, Steven Alfred Kummerl, Bo-Hsun Pan, Fu-Hua Yu
  • Publication number: 20230265956
    Abstract: A quick release coupling includes male and female connector assemblies releasably secured together. The male connector assembly includes two parallel male connectors and the female connector assembly includes two parallel female connectors. A sleeve assembly is releasably connected to one ends of the female connectors. A plunger assembly is provided in each of the sleeve assembly and female connector. A sleeving assembly is provided on each of the female connector and the sleeve assembly. The parallel female connectors can be disconnected from the parallel male connectors or connected together at the same time. After the female connectors have disengaged from the male connectors, leakproof arrangements in the female connector assembly act to prevent water in the female connector assembly from leaking.
    Type: Application
    Filed: February 24, 2022
    Publication date: August 24, 2023
    Inventor: Hung-Yu Hsieh
  • Publication number: 20230265957
    Abstract: A latch coupling includes male and female connector assemblies releasably secured together. The male connector assembly includes two parallel male connectors and first latches. The female connector assembly includes two parallel female connectors and second latches. A sleeve is releasably connected to an end of the female connector. Force is exerted on the second latches to hook the first latches so as to connect the female and male connector assemblies together. The parallel female connectors can be disconnected from the parallel male connectors or connected together at the same time. After the female connectors have disengaged from the male connectors, leakproof arrangements in the female connector assembly act to prevent water in the female connector assembly from leaking.
    Type: Application
    Filed: February 24, 2022
    Publication date: August 24, 2023
    Inventor: Hung-Yu Hsieh
  • Patent number: 11735506
    Abstract: In an example, an apparatus comprises a lead frame that includes a first row of leads, a first pad coupled to the first row of leads, and a second row of leads parallel to the first row of leads. The lead frame also includes a second pad coupled to the second row of leads. The first and second pads are separated by a gap, and each of the first and second pads has a substantially uniform thickness. The apparatus also includes a device coupled to the first and second pads. The first and second pads are exposed to an exterior of the apparatus.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: August 22, 2023
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Hung-Yu Chou, Bo-Hsun Pan, Yuh-Harng Chien, Fu-Hua Yu, Steven Alfred Kummerl, Jie Chen, Rajen M. Murugan
  • Patent number: 11736804
    Abstract: An image processing method includes: analyzing, by a white balance gain estimation circuit, a plurality of exposure frames with different exposures to generate a plurality of sets of white balance gain settings; combining the plurality of sets of white balance gain settings to generate a white balance gain table; applying the white balance gain table to the plurality of exposure frames to generate a plurality of white balance compensated frames; and generating a high dynamic range (HDR) frame by performing pixel fusion according to pixel data derived from the plurality of white balance compensated frames.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: August 22, 2023
    Assignee: MEDIATEK INC.
    Inventors: Jen-Hung Yu, Ming-Chang Chuang, Po-Yu Yeh
  • Publication number: 20230260239
    Abstract: Aspects of the present disclosure are directed to creating a skybox for an artificial reality (“XR”) world from a two-dimensional (“2D”) image. The 2D image is scanned and split into at least two portions. The portions are mapped onto the interior of a virtual enclosed 3D shape, for example, a virtual cube. A generative adversarial network (GAN) interpolates from the information in the areas mapped from the portions to fill in at least some unmapped areas of the interior of the 3D shape. The 3D shape can be placed in a user's XR world to become the skybox surrounding that world.
    Type: Application
    Filed: February 13, 2023
    Publication date: August 17, 2023
    Inventors: Vincent Charles CHEUNG, Jiemin ZHANG, Salvatore CANDIDO, Hung-Yu TSENG
  • Publication number: 20230253500
    Abstract: A semiconductor device includes a fin extending along a first direction over a substrate, and a gate structure extending in a second direction overlying the fin. The gate structure includes a gate dielectric layer overlying the fin, a gate electrode overlying the gate dielectric layer, and insulating gate sidewalls on opposing lateral surfaces of the gate electrode extending along the second direction. A source/drain region is formed in the fin in a region adjacent the gate electrode structure, and a stressor layer is between the source/drain region and the semiconductor substrate. The stressor layer includes GeSn or SiGeSn containing 1019 atoms cm?3 or less of a dopant, and a portion of the fin under the gate structure is a channel region.
    Type: Application
    Filed: April 17, 2023
    Publication date: August 10, 2023
    Inventors: Huang-Siang LAN, CheeWee Liu, Chi-Wen Liu, Shih-Hsien Huang, I-Hsieh WONG, Hung-Yu YEH, Chung-En TSAI
  • Patent number: 11719371
    Abstract: A latch coupling includes male and female connector assemblies releasably secured together. The male connector assembly includes two parallel male connectors and first latches. The female connector assembly includes two parallel female connectors and second latches. A sleeve is releasably connected to an end of the female connector. Force is exerted on the second latches to hook the first latches so as to connect the female and male connector assemblies together. The parallel female connectors can be disconnected from the parallel male connectors or connected together at the same time. After the female connectors have disengaged from the male connectors, leakproof arrangements in the female connector assembly act to prevent water in the female connector assembly from leaking.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: August 8, 2023
    Inventor: Hung-Yu Hsieh
  • Patent number: 11705381
    Abstract: A method of forming a semiconductor structure includes: attaching a semiconductor device to a first surface of a substrate; placing a thermal interface material (TIM) film over a first side of the semiconductor device distal from the substrate, where the TIM film is pre-formed before the placing, where after the placing, a peripheral portion of the TIM film extends laterally beyond sidewalls of the semiconductor device; and attaching a lid to the first surface of the substrate to form an enclosed space between the lid and the substrate, where after attaching the lid, the semiconductor device and the TIM film are disposed in the enclosed space, where a first side of the TIM film distal from the substrate contacts the lid.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: July 18, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Hao Chen, Hung-Yu Chen, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Patent number: 11700724
    Abstract: A semiconductor structure includes a semiconductor substrate including a first active region and a chop region. The semiconductor structure also includes a source/drain region disposed in the first active region, an isolation structure disposed in the chop region, and a gate structure extending at least across the isolation structure in the chop region. The gate structure includes a gate electrode layer and a gate lining layer lining on the gate electrode layer. The gate lining layer includes a first portion having an upper surface that is lower than a bottom surface of the source/drain region.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: July 11, 2023
    Assignee: WINBOND ELECTRONICS CORP.
    Inventor: Hung-Yu Wei
  • Publication number: 20230215803
    Abstract: An anti-fuse device including a substrate, a doped region, a dielectric layer, a first contact, an anti-fuse material layer, and a second contact is provided. The doped region is located in the substrate. The dielectric layer is located on the substrate and has a first opening and a second opening. The first opening and the second opening respectively expose the doped region. The first contact is located in the first opening. The anti-fuse material layer is located between the first contact and the doped region. The second contact is located in the second opening and is electrically connected to the doped region.
    Type: Application
    Filed: December 30, 2021
    Publication date: July 6, 2023
    Applicant: Winbond Electronics Corp.
    Inventor: Hung-Yu Wei
  • Patent number: 11690571
    Abstract: A wristband biosensing system, a wristband biosensing apparatus, and a biological sensing method are provided. The system includes a wristband body worn on a wrist of a user, at least one physiological signal sensor, at least one deformation sensor, and a processing device coupled to the physiological signal sensor and the deformation sensor. The physiological signal sensor is disposed on the wristband body at a position corresponding to at least one sensing portion of the wrist to detect a physiological signal of each sensing portion. The deformation sensor is disposed around each physiological signal sensor to detect deformation of each sensing portion and output a deformation signal. The processing device receives the physiological signal and the deformation signal, inquires a compensation signal corresponding to the deformation signal, and corrects the physiological signal by using the compensation signal, so as to output a corrected physiological signal of each sensing portion.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: July 4, 2023
    Assignee: Industrial Technology Research Institute
    Inventors: Cheng-Hung Yu, Ming-Huan Yang, Kuang-Ching Fan
  • Patent number: D999765
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: September 26, 2023
    Assignee: HTC CORPORATION
    Inventors: Shu-Kuen Chang, Natalia Amijo, Ian James McGillivray, Chin-Wei Chou, Yi-Shen Wang, Chih-Sung Fang, Hung-Yu Chen