Patents by Inventor Hye-Young Choi

Hye-Young Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10978250
    Abstract: A capacitor includes a body having a first surface, a second surface, and a third surface and a fourth surface connecting the first surface to the second surface, and including a first internal electrode and a second internal electrode respectively having a first lead portion and a second lead portion exposed to the second surface, a first external electrode and a second external electrode formed on the second surface of the body, and electrically connected to the first internal electrode and the second internal electrode, respectively, and dummy electrodes formed on the third surface and the fourth surface of the body and extending from edges at which the second surface meets the third surface and the fourth surface.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: April 13, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Young Choi, Jae Yeol Choi, Hyun Hee Gu, Bum Su Kim
  • Publication number: 20210012967
    Abstract: A capacitor component includes a body including a dielectric layer, a first electrode and a second internal electrode, laminated in a first direction, opposing each other, and a first cover portion and a second cover portion, disposed on outermost surfaces of the first and second internal electrodes, each having a thickness of 25 ?m or less, a first electrode layer and a second electrode layer, respectively disposed on both external surfaces of the body in a second direction perpendicular to the first direction and respectively, and plating layers, respectively disposed on the first and second electrode layers. A metal oxide is disposed on a boundary between the first electrode layer and the plating layer and a boundary between the second electrode layer and the plating layer.
    Type: Application
    Filed: May 21, 2020
    Publication date: January 14, 2021
    Inventors: Jang Yeol LEE, Ji Hong JO, Yoo Jeong LEE, Myung Jun PARK, Jong Ho LEE, Hye Young CHOI, Jae Hyun LEE, Hyun Hee GU
  • Publication number: 20210012965
    Abstract: A capacitor component includes a body including dielectric layers, first and second internal electrodes, laminated in a first direction, facing each other, and first and second cover portions, disposed on outermost portions of the first and second internal electrodes, and first and second external electrodes, respectively disposed on both external surfaces of the body in a second direction, perpendicular to the first direction, and respectively connected to the first and second internal electrodes. An indentation is disposed at at least one of boundaries between the first internal electrodes and the first external electrode or one of boundaries between the second internal electrodes and the second external electrode.
    Type: Application
    Filed: May 14, 2020
    Publication date: January 14, 2021
    Inventors: Jang Yeol Lee, Ji Hong Jo, Yoo Jeong Lee, Myung Jun Park, Jong Ho Lee, Hye Young Choi, Jae Hyun Lee, Hyun Hee Gu
  • Publication number: 20210012964
    Abstract: A capacitor component includes a body including dielectric layers, first and second internal electrodes, laminated in a first direction, facing each other, and first and second cover portions, disposed on outermost portions of the first and second internal electrodes, and first and second external electrodes, respectively disposed on both external surfaces of the body in a second direction, perpendicular to the first direction, and respectively connected to the first and second internal electrodes. An indentation including a glass is disposed at at least one of boundaries between the first internal electrodes and the first external electrode or one of boundaries between the second internal electrodes and the second external electrode.
    Type: Application
    Filed: May 19, 2020
    Publication date: January 14, 2021
    Inventors: Jang Yeol Lee, Ji Hong Jo, Yoo Jeong Lee, Myung Jun Park, Jong Ho Lee, Hye Young Choi, Jae Hyun Lee, Hyun Hee Gu
  • Patent number: 10892101
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, a first plating portion disposed on the electrode layer and having a thickness ranging from 0.3 ?m to 1 ?m, and a second plating portion disposed on the first plating portion.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: January 12, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Lee, Hyun Hee Gu, Eui Hyun Jo, Jong Ho Lee, Eun Jin Kim, Hye Young Choi
  • Patent number: 10861650
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and a first internal electrode and a second internal electrode disposed in a stacking direction to face each other with the dielectric layer interposed therebetween; and a first external electrode electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode. Where a length of the first electrode layer in a length direction of the ceramic body is denoted by A and a length of the second electrode layer in a length direction of the ceramic body is denoted by B, B is shorter than A.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: December 8, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Young Choi, Jae Hyun Lee, Hyun Hee Gu, Sun Woong Kim
  • Patent number: 10790087
    Abstract: A multilayer ceramic electronic part includes a body portion including an internal electrode and a dielectric layer, a first electrode layer disposed on at least one surface of the body portion and electrically connected to the internal electrode, and a conductive resin layer disposed on the first electrode layer and including a first conductivity-type metal particle, a second conductivity-type metal, and a base resin. The second conductivity-type metal has a melting point lower than a curing temperature of the base resin.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: September 29, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byoung Jin Chun, Hye Jin Jeong, Chung Yeol Lee, Sang Moon Lee, Hye Young Choi, Myung Jun Park, Young Sook Lee
  • Publication number: 20200082987
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, a first plating portion disposed on the electrode layer and having a thickness ranging from 0.3 ?m to 1 ?m, and a second plating portion disposed on the first plating portion.
    Type: Application
    Filed: November 8, 2018
    Publication date: March 12, 2020
    Inventors: Jin Woo LEE, Hyun Hee GU, Eui Hyun JO, Jong Ho LEE, Eun Jin KIM, Hye Young CHOI
  • Publication number: 20200075255
    Abstract: A multilayer ceramic electronic component includes a ceramic body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween, and first and second external electrodes disposed on outer surfaces of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers and first and second plating layers. The first and second plating or base electrodes layers have at least one hole positioned in at least one corner of the ceramic body, and the hole includes a point of a respective edge of the ceramic body at which the respective edge meets a virtual line extending ina thickness direction and drawn through an end in a width direction of an exposed edge of one of the first and second internal electrodes exposed in a surface in which first or second internal electrodes contact first or second external electrodes.
    Type: Application
    Filed: February 13, 2019
    Publication date: March 5, 2020
    Inventors: Gwang Hyeon PARK, Jang Yeol LEE, Yong PARK, Hye Young CHOI, Jong Ho LEE, Ji Hong JO
  • Publication number: 20200075248
    Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with each of the dielectric layers interposed therebetween. First and second external electrodes are disposed on outer surfaces of the ceramic body, connected to the first and second internal electrodes respectively, and disposed to cover at least five of eight corners of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers at least partially in contact with the outer surfaces of the ceramic body and first and second plating layers disposed to cover the first and second base electrode layers, respectively. The first and second plating or base electrode layers have one or more to three or less holes positioned adjacent to one or more to three or less of the eight corners of the ceramic body.
    Type: Application
    Filed: April 2, 2019
    Publication date: March 5, 2020
    Inventors: Hye Young CHOI, Jong Ho LEE, Eui Hyun JO, Jang Yeol LEE, Jin Woo LEE, Hyun Hee GU
  • Patent number: 10580578
    Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with each of the dielectric layers interposed therebetween. First and second external electrodes are disposed on outer surfaces of the ceramic body, connected to the first and second internal electrodes respectively, and disposed to cover at least five of eight corners of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers at least partially in contact with the outer surfaces of the ceramic body and first and second plating layers disposed to cover the first and second base electrode layers, respectively. The first and second plating or base electrode layers have one or more to three or less holes positioned adjacent to one or more to three or less of the eight corners of the ceramic body.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Young Choi, Jong Ho Lee, Eui Hyun Jo, Jang Yeol Lee, Jin Woo Lee, Hyun Hee Gu
  • Patent number: 10580583
    Abstract: A multilayer ceramic electronic component includes a ceramic body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween, and first and second external electrodes disposed on outer surfaces of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers and first and second plating layers. The first and second plating or base electrodes layers have at least one hole positioned in at least one corner of the ceramic body, and the hole includes a point of a respective edge of the ceramic body at which the respective edge meets a virtual line extending in a thickness direction and drawn through an end in a width direction of an exposed edge of one of the first and second internal electrodes exposed in a surface in which first or second internal electrodes contact first or second external electrodes.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gwang Hyeon Park, Jang Yeol Lee, Yong Park, Hye Young Choi, Jong Ho Lee, Ji Hong Jo
  • Patent number: 10559428
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the ceramic body, wherein the external electrodes include seed layers disposed on at least one surface of the ceramic body in a thickness direction, first electrode layers electrically connected to the internal electrodes and the seed layers, and plating layers disposed on the seed layers and the first electrode layers, respectively, and 0.8?T2/T1?1.2, where T1 is a thickness of each of the first electrode layers in a central region of the ceramic body in the thickness direction, and T2 is a thickness of each of the first electrode layers at a point at which an outermost internal electrode, among the internal electrodes, is positioned.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: February 11, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Young Choi, Jae Yeol Choi, Hyun Hee Gu, Bum Su Kim
  • Patent number: 10504653
    Abstract: A multilayer ceramic electronic component includes a ceramic body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween, and first and second external electrodes disposed on outer surfaces of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers and first and second plating layers. The first and second plating or base electrodes layers have at least one hole positioned in at least one corner of the ceramic body, and the hole includes a point of a respective edge of the ceramic body at which the respective edge meets a virtual line extending in a thickness direction and drawn through an end in a width direction of an exposed edge of one of the first and second internal electrodes exposed in a surface in which first or second internal electrodes contact first or second external electrodes.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: December 10, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gwang Hyeon Park, Jang Yeol Lee, Yong Park, Hye Young Choi, Jong Ho Lee, Ji Hong Jo
  • Publication number: 20190362894
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and a first internal electrode and a second internal electrode disposed in a stacking direction to face each other with the dielectric layer interposed therebetween; and a first external electrode electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode. Where a length of the first electrode layer in a length direction of the ceramic body is denoted by A and a length of the second electrode layer in a length direction of the ceramic body is denoted by B, B is shorter than A.
    Type: Application
    Filed: October 23, 2018
    Publication date: November 28, 2019
    Inventors: Hye Young CHOI, Jae Hyun LEE, Hyun Hee GU, Sun Woong KIM
  • Patent number: 10373759
    Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with each of the dielectric layers interposed therebetween. First and second external electrodes are disposed on outer surfaces of the ceramic body, connected to the first and second internal electrodes respectively, and disposed to cover at least five of eight corners of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers at least partially in contact with the outer surfaces of the ceramic body and first and second plating layers disposed to cover the first and second base electrode layers, respectively. The first and second plating or base electrode layers have one or more to three or less holes positioned adjacent to one or more to three or less of the eight corners of the ceramic body.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: August 6, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Young Choi, Jong Ho Lee, Eui Hyun Jo, Jang Yeol Lee, Jin Woo Lee, Hyun Hee Gu
  • Publication number: 20190180941
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the ceramic body, wherein the external electrodes include seed layers disposed on at least one surface of the ceramic body in a thickness direction, first electrode layers electrically connected to the internal electrodes and the seed layers, and plating layers disposed on the seed layers and the first electrode layers, respectively, and 0.8?T2/T1?1.2, where T1 is a thickness of each of the first electrode layers in a central region of the ceramic body in the thickness direction, and T2 is a thickness of each of the first electrode layers at a point at which an outermost internal electrode, among the internal electrodes, is positioned.
    Type: Application
    Filed: February 21, 2019
    Publication date: June 13, 2019
    Inventors: Hye Young CHOI, Jae Yeol CHOI, Hyun Hee GU, Bum Su KIM
  • Patent number: 10312022
    Abstract: A capacitor includes a capacitor body having upper and lower surfaces and end surfaces connecting the upper and lower surfaces; and an external electrode disposed on a surface of the capacitor body and having a first electrode layer, a second electrode layer, and a third electrode layer. The second electrode layer includes metal and resin and is interposed between the first electrode layer and the third electrode layer, and a portion of the second electrode layer covering the end surface of the capacitor body has a thickness less than that of a portion of the first electrode layer covering the end surface of the capacitor body.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: June 4, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Moon Lee, Myung Jun Park, Hye Jin Jeong, Chung Yeol Lee, Young Sook Lee, Jae Yeol Choi, Hye Young Choi, Byoung Jin Chun
  • Publication number: 20190148076
    Abstract: A multilayer ceramic electronic part includes a body portion including an internal electrode and a dielectric layer, a first electrode layer disposed on at least one surface of the body portion and electrically connected to the internal electrode, and a conductive resin layer disposed on the first electrode layer and including a first conductivity-type metal particle, a second conductivity-type metal, and a base resin. The second conductivity-type metal has a melting point lower than a curing temperature of the base resin.
    Type: Application
    Filed: January 15, 2019
    Publication date: May 16, 2019
    Inventors: Byoung Jin CHUN, Hye Jin JEONG, Chung Yeol LEE, Sang Moon LEE, Hye Young CHOI, Myung Jun PARK, Young Sook LEE
  • Patent number: 10256044
    Abstract: A method of manufacturing a multilayer ceramic electronic component includes forming external electrodes on end surfaces of a ceramic body, and more particularly, to forming external electrodes by attaching a sheet for forming an external electrode on a ceramic body. A multilayer ceramic electronic component thus formed has external electrodes with a thin and uniform thickness.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: April 9, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Bong Jun Juhng, Doo Young Kim, Ki Pyo Hong, You Na Kim, Hye Young Choi