Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, a first plating portion disposed on the electrode layer and having a thickness ranging from 0.3 ?m to 1 ?m, and a second plating portion disposed on the first plating portion.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and a first internal electrode and a second internal electrode disposed in a stacking direction to face each other with the dielectric layer interposed therebetween; and a first external electrode electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode. Where a length of the first electrode layer in a length direction of the ceramic body is denoted by A and a length of the second electrode layer in a length direction of the ceramic body is denoted by B, B is shorter than A.

Abstract: A multilayer ceramic electronic part includes a body portion including an internal electrode and a dielectric layer, a first electrode layer disposed on at least one surface of the body portion and electrically connected to the internal electrode, and a conductive resin layer disposed on the first electrode layer and including a first conductivity-type metal particle, a second conductivity-type metal, and a base resin. The second conductivity-type metal has a melting point lower than a curing temperature of the base resin.

Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, a first plating portion disposed on the electrode layer and having a thickness ranging from 0.3 ?m to 1 ?m, and a second plating portion disposed on the first plating portion.

Abstract: A multilayer ceramic electronic component includes a ceramic body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween, and first and second external electrodes disposed on outer surfaces of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers and first and second plating layers. The first and second plating or base electrodes layers have at least one hole positioned in at least one corner of the ceramic body, and the hole includes a point of a respective edge of the ceramic body at which the respective edge meets a virtual line extending ina thickness direction and drawn through an end in a width direction of an exposed edge of one of the first and second internal electrodes exposed in a surface in which first or second internal electrodes contact first or second external electrodes.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with each of the dielectric layers interposed therebetween. First and second external electrodes are disposed on outer surfaces of the ceramic body, connected to the first and second internal electrodes respectively, and disposed to cover at least five of eight corners of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers at least partially in contact with the outer surfaces of the ceramic body and first and second plating layers disposed to cover the first and second base electrode layers, respectively. The first and second plating or base electrode layers have one or more to three or less holes positioned adjacent to one or more to three or less of the eight corners of the ceramic body.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with each of the dielectric layers interposed therebetween. First and second external electrodes are disposed on outer surfaces of the ceramic body, connected to the first and second internal electrodes respectively, and disposed to cover at least five of eight corners of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers at least partially in contact with the outer surfaces of the ceramic body and first and second plating layers disposed to cover the first and second base electrode layers, respectively. The first and second plating or base electrode layers have one or more to three or less holes positioned adjacent to one or more to three or less of the eight corners of the ceramic body.

Abstract: A multilayer ceramic electronic component includes a ceramic body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween, and first and second external electrodes disposed on outer surfaces of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers and first and second plating layers. The first and second plating or base electrodes layers have at least one hole positioned in at least one corner of the ceramic body, and the hole includes a point of a respective edge of the ceramic body at which the respective edge meets a virtual line extending in a thickness direction and drawn through an end in a width direction of an exposed edge of one of the first and second internal electrodes exposed in a surface in which first or second internal electrodes contact first or second external electrodes.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the ceramic body, wherein the external electrodes include seed layers disposed on at least one surface of the ceramic body in a thickness direction, first electrode layers electrically connected to the internal electrodes and the seed layers, and plating layers disposed on the seed layers and the first electrode layers, respectively, and 0.8?T2/T1?1.2, where T1 is a thickness of each of the first electrode layers in a central region of the ceramic body in the thickness direction, and T2 is a thickness of each of the first electrode layers at a point at which an outermost internal electrode, among the internal electrodes, is positioned.

Abstract: A multilayer ceramic electronic component includes a ceramic body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween, and first and second external electrodes disposed on outer surfaces of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers and first and second plating layers. The first and second plating or base electrodes layers have at least one hole positioned in at least one corner of the ceramic body, and the hole includes a point of a respective edge of the ceramic body at which the respective edge meets a virtual line extending in a thickness direction and drawn through an end in a width direction of an exposed edge of one of the first and second internal electrodes exposed in a surface in which first or second internal electrodes contact first or second external electrodes.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and a first internal electrode and a second internal electrode disposed in a stacking direction to face each other with the dielectric layer interposed therebetween; and a first external electrode electrically connected to the first internal electrode and a second external electrode electrically connected to the second internal electrode. Where a length of the first electrode layer in a length direction of the ceramic body is denoted by A and a length of the second electrode layer in a length direction of the ceramic body is denoted by B, B is shorter than A.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with each of the dielectric layers interposed therebetween. First and second external electrodes are disposed on outer surfaces of the ceramic body, connected to the first and second internal electrodes respectively, and disposed to cover at least five of eight corners of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers at least partially in contact with the outer surfaces of the ceramic body and first and second plating layers disposed to cover the first and second base electrode layers, respectively. The first and second plating or base electrode layers have one or more to three or less holes positioned adjacent to one or more to three or less of the eight corners of the ceramic body.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the ceramic body, wherein the external electrodes include seed layers disposed on at least one surface of the ceramic body in a thickness direction, first electrode layers electrically connected to the internal electrodes and the seed layers, and plating layers disposed on the seed layers and the first electrode layers, respectively, and 0.8?T2/T1?1.2, where T1 is a thickness of each of the first electrode layers in a central region of the ceramic body in the thickness direction, and T2 is a thickness of each of the first electrode layers at a point at which an outermost internal electrode, among the internal electrodes, is positioned.

Abstract: A capacitor includes a capacitor body having upper and lower surfaces and end surfaces connecting the upper and lower surfaces; and an external electrode disposed on a surface of the capacitor body and having a first electrode layer, a second electrode layer, and a third electrode layer. The second electrode layer includes metal and resin and is interposed between the first electrode layer and the third electrode layer, and a portion of the second electrode layer covering the end surface of the capacitor body has a thickness less than that of a portion of the first electrode layer covering the end surface of the capacitor body.

Abstract: A multilayer ceramic electronic part includes a body portion including an internal electrode and a dielectric layer, a first electrode layer disposed on at least one surface of the body portion and electrically connected to the internal electrode, and a conductive resin layer disposed on the first electrode layer and including a first conductivity-type metal particle, a second conductivity-type metal, and a base resin. The second conductivity-type metal has a melting point lower than a curing temperature of the base resin.

Abstract: A method of manufacturing a multilayer ceramic electronic component includes forming external electrodes on end surfaces of a ceramic body, and more particularly, to forming external electrodes by attaching a sheet for forming an external electrode on a ceramic body. A multilayer ceramic electronic component thus formed has external electrodes with a thin and uniform thickness.

Abstract: A capacitor includes a body having a first surface, a second surface, and a third surface and a fourth surface connecting the first surface to the second surface, and including a first internal electrode and a second internal electrode respectively having a first lead portion and a second lead portion exposed to the second surface, a first external electrode and a second external electrode formed on the second surface of the body, and electrically connected to the first internal electrode and the second internal electrode, respectively, and dummy electrodes formed on the third surface and the fourth surface of the body and extending from edges at which the second surface meets the third surface and the fourth surface.

Abstract: A capacitor includes a body having a first surface, a second surface, and a third surface and a fourth surface connecting the first surface to the second surface, and including a first internal electrode and a second internal electrode respectively having a first lead portion and a second lead portion exposed to the second surface, a first external electrode and a second external electrode formed on the second surface of the body, and electrically connected to the first internal electrode and the second internal electrode, respectively, and dummy electrodes formed on the third surface and the fourth surface of the body and extending from edges at which the second surface meets the third surface and the fourth surface.

Abstract: A method and apparatus for switching a connection in a wireless communication system is provided. A source cell decides radio resource control (RRC) connection switching to a target cell, transmits an aggregated user equipment (UE) context transfer message to the target cell, and transmits an RRC connection switching message to a UE in coverage of the source cell. The RRC connection switching message includes information on an identity of the target cell and a period during which the UE should finish the RRC connection switching to the target cell.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a plurality of dielectric layers stacked on each other and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, parallel to a stacking direction and connected to the first and second surfaces, and fifth and sixth surfaces opposing each other in a third direction and connected to the first to fourth surfaces, first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively, first and second conductive thin films disposed on at least one of the third and fourth surfaces, connected to the first and second external electrodes, respectively, and having a thickness lower than that of the first and second external electrodes, and first and second solder preventing films disposed on the first and second external electrodes, respectively.