Abstract: An apparatus and method for measuring air currents on the surface of a substrate, which can accurately measure the magnitude and direction of air currents on the surface of a wafer with wafer-type air current measurement sensors, are provided. The apparatus includes: a first air current measurement module measuring a magnitude of air currents on a surface of a first substrate, which is processed in accordance with a semiconductor manufacturing process; a second air current measurement module measuring a movement direction of the air currents; and a power module supplying power to the first and second air current measurement modules, wherein the first air current measurement module, the second air current measurement module, and the power module are mounted on a second substrate, which has the same shape as the first substrate.

Abstract: The electronic device for recommending an AI-based melanoma biopsy site according to an exemplary embodiment of the present invention includes a processor which classifies a skin image that is input by using a classification model as melanoma or nevus, identifies melanoma features in the skin image by using a generation model when the skin image is classified as melanoma to generate an image from which the melanoma features are removed, and compares the skin image with the generated image to identify at least one candidate biopsy site.

Abstract: A display device, includes: a display panel including a pixel electrically coupled to a gate line and a data line; a gate driver configured to provide a gate signal to the gate line; and a data driver configured to provide a data signal to the data line, wherein the gate driver is configured to sequentially provide a first gate signal and a second gate signal to the gate line during a first frame period, wherein the data driver is configured to provide a first data signal to the data line in response to the first gate signal, and to provide a second data signal to the data line in response to the second gate signal, and wherein the second data signal is different from the first data signal and varies dependent on the first data signal.

Abstract: A system and method includes upgrading a metamodel for friction coefficient prediction of a brake, in which the metamodel for friction coefficient prediction may be constructed using various derivative parameters relating to the speed, temperature and pressure of a brake disc in addition to basic parameters, such as the speed, temperature and pressure of the brake disc, to greatly improve performance and accuracy in friction coefficient prediction using the metamodel for friction coefficient prediction and to improve accuracy in evaluation of the driving performance of a vehicle through an increase in accuracy of determination of brake torque.

Abstract: Provided is a ceiling storage system capable of correcting a working position and constantly checking stability of a structure by detecting an amount of change in a facility. According to the ceiling storage system, a transport vehicle moves to an upper portion of a first storage area of a plurality of storage areas in a state of gripping an article, and the transport vehicle measures a first distance value between the transport vehicle and the first storage area using a distance sensor and measures a relative position value between the transport vehicle and the first storage area using a vision sensor, before unloading the article from the first storage area.

Abstract: A dry etching apparatus includes a process chamber; a support provided in the process chamber and configured to support a substrate; a gas supply configured to supply a process gas including a hydrogen gas (H2) and a fluorocarbon gas (CxFy) into the process chamber; a plasma source configured to generate plasma using the process gas in the process chamber, wherein the support includes: an electrostatic chuck on which the substrate is disposed; an edge ring provided along a circumference of the electrostatic chuck and supporting an edge region of the substrate; an adhesive gel pad provided between the electrostatic chuck and the edge ring; and a coating layer formed only on a surface of the edge ring, which is exposed to the plasma.

Abstract: A display device includes: a base layer including a display area (DA) and a non-DA; a circuit element layer on the base layer and including: a power supply electrode (PSE) overlapping the non-DA, circuit elements, and a shielding electrode connected to the PSE and overlapping some of the circuit elements; a display element layer on the circuit element layer and including: a light emitting element including a first electrode, a light emitting unit, and a second electrode, and a connection electrode connecting the second electrode to the PSE and including first through-holes; a thin film encapsulation layer (TFEL) on the display element layer and including an organic layer overlapping the DA; and an input sensing layer on the TFEL and including sensing electrodes and sensing signal lines connected to the sensing electrodes. The sensing signal lines overlap the connection electrode. Some of the first through-holes overlap the shielding electrode.

Abstract: In one example, a semiconductor device comprises a substrate comprising a conductive structure, a first electronic component over the substrate, an encapsulant over the substrate and contacting a lateral side of the first electronic component, a shield over the encapsulant and contacting a lateral side of the encapsulant and a portion of a lateral side of the substrate, and a communication structure coupled with the substrate. The substrate comprises a vertical groove side and a horizontal groove side defining a groove in the substrate, wherein a portion of the groove is uncovered by the shield. Other examples and related methods are also disclosed herein.

Abstract: A chain tensioner transmits power of a crankshaft provided in an engine to peripheral auxiliary devices and guides a chain belt that transfers engine oil. The chain tensioner includes a body portion that tensions the chain belt through a pivot, the upper surface of the body portion includes an oil guiding rib that collects the engine oil scattered from the chain belt to the upper part, one surface of the body portion in contact with the upper surface includes a pivot journal, and one surface of the body portion includes a first oil flow path that guides the engine oil to flow down to the pivot journal.

Abstract: In one example, a semiconductor device comprises a substrate comprising a conductive structure, a first electronic component over the substrate, an encapsulant over the substrate and contacting a lateral side of the first electronic component, a shield over the encapsulant and contacting a lateral side of the encapsulant and a portion of a lateral side of the substrate, and a communication structure coupled with the substrate. The substrate comprises a vertical groove side and a horizontal groove side defining a groove in the substrate, wherein a portion of the groove is uncovered by the shield. Other examples and related methods are also disclosed herein.

Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.

Abstract: A hard coating composition includes a norbomene-based compound represented by a Chemical Formula 1 and a polymer including at least one of an epoxy-based resin, a polyurethane-based resin, or an acrylic resin.

Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.

Abstract: A chain tensioner transmits power of a crankshaft provided in an engine to peripheral auxiliary devices and guides a chain belt that transfers engine oil. The chain tensioner includes a body portion that tensions the chain belt through a pivot, the upper surface of the body portion includes an oil guiding rib that collects the engine oil scattered from the chain belt to the upper part, one surface of the body portion in contact with the upper surface includes a pivot journal, and one surface of the body portion includes a first oil flow path that guides the engine oil to flow down to the pivot journal.

Abstract: In one example, a semiconductor device comprises a substrate comprising a conductive structure, a first electronic component over the substrate, an encapsulant over the substrate and contacting a lateral side of the first electronic component, a shield over the encapsulant and contacting a lateral side of the encapsulant and a portion of a lateral side of the substrate, and a communication structure coupled with the substrate. The substrate comprises a vertical groove side and a horizontal groove side defining a groove in the substrate, wherein a portion of the groove is uncovered by the shield. Other examples and related methods are also disclosed herein.

Abstract: The present invention relates to structural steel that can be desirably used in offshore structures and the like, more specifically, to a thin steel plate having excellent low-temperature toughness and CTOD properties, and to a method for manufacturing the same.

Abstract: In one example, a semiconductor device comprises a substrate comprising a conductive structure, a first electronic component over the substrate, an encapsulant over the substrate and contacting a lateral side of the first electronic component, a shield over the encapsulant and contacting a lateral side of the encapsulant and a portion of a lateral side of the substrate, and a communication structure coupled with the substrate. The substrate comprises a vertical groove side and a horizontal groove side defining a groove in the substrate, wherein a portion of the groove is uncovered by the shield. Other examples and related methods are also disclosed herein.

Abstract: The present invention relates to a method of manufacturing a hyaluronate film and a hyaluronate film manufactured thereby, and more particularly to a method of manufacturing a hyaluronate film through a solvent-casting process or using an automatic film applicator that facilitates mass production and to a hyaluronate film manufactured thereby, which is useful as a mask pack for cosmetics, a patch for medicaments and medical devices, a film-type adhesion inhibitor, etc. Unlike conventional liquid products, the hyaluronate film according to the present invention has a dry surface and thus entails no concern about microbial contamination, is easy to produce/manage/distribute/use, and has superior mechanical properties, whereby it can be utilized for various applications such as packs, patches, artificial skin and the like for cosmetics, medicaments, and medical devices.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.

Abstract: The present invention relates to a structural steel sheet suitable for ships or steel structures and, more particularly, to a high-strength steel sheet having excellent ductility and low-temperature toughness and a method for manufacturing same.