Patents by Inventor Hyun Bang

Hyun Bang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210387024
    Abstract: An ultrasound apparatus of a body cavity insertable type includes: a handpiece; a supporting rod that is elongated from the handpiece; an ultrasound probe that includes a housing that is connected to the supporting rod and an ultrasound transducer that is fixed to the housing; and an ultrasound transmission medium circulation mechanism that is configured to discharge an ultrasound transmission medium filled in an ultrasound transmission space that is formed at a front of the ultrasound transducer and to inflow the discharged ultrasound transmission medium to the ultrasound transmission space again. The housing and the ultrasound transducer are configured such that the ultrasound transmission medium filled in the ultrasound transmission space is prevented from inflowing to a rear space of the ultrasound transducer.
    Type: Application
    Filed: November 5, 2018
    Publication date: December 16, 2021
    Applicant: KORUST CO.,LTD.
    Inventors: Sung-Chan CHO, Jung Woo LEE, Hyun Du JEONG, Jin Hyun BANG
  • Patent number: 11163211
    Abstract: An actuator includes a magnet, a driving coil facing the magnet, a driver, and a position calculation processor. The driver is configured to move the magnet in at least one of an optical axis direction and a direction perpendicular to the optical axis by applying a driving signal to the driving coil. The position calculation processor includes sensing coils, and is configured to calculate a position of the magnet according to inductance levels of an inductor of the sensing coils. The inductance levels vary according to movements of the magnet.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: November 2, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong Joo Lee, Dong Yeon Shin, Nam Ki Park, Shin Young Cheong, Byung Gi Ahn, Hoon Heo, Je Hyun Bang, Yun Tae Lee, Ick Chan Shim, Young Bok Yoon
  • Patent number: 11152296
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: October 19, 2021
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD.
    Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
  • Publication number: 20210204447
    Abstract: Disclosed is a containerized heating, ventilation, and air-conditioning (HVAC) system comprising an HVAC unit and one or more ducts from the HVAC unit to an equipment rack. The ducts prevent mixing between the fresh and exhaust airflow, thus improving efficiency. Sensors located at sources of heat generating equipment within the racks may be used by controllers to monitor temperatures of the components at the source of heat generation, typically at the highest temperatures. The temperatures may be aggregated to determine the temperatures of devices, modules, racks, and the container interior cavity. Dampers on the ducts, at the rack inlets, at the module inlets, at the devices inlets, and such may assist in regulating airflow preferentially to the hottest components, devices, modules, or racks.
    Type: Application
    Filed: December 23, 2020
    Publication date: July 1, 2021
    Inventors: Ho-June Yu, Jeong-Hyun Bang, Jong-Sik Park
  • Patent number: 11004801
    Abstract: In one example, a semiconductor device comprises a substrate, a first electronic component on a top side of the substrate, a second electronic component on the top side of the substrate, an encapsulant on the top side of the substrate, contacting a lateral side of the first electronic component and a lateral side of the second electronic component, a conformal shield on a top side of the encapsulant over the first electronic component and having a side shield contacting a lateral side of the encapsulant, and a compartment wall between the first electronic component and the second electronic component and contacting the conformal shield to define a compartment containing the first electronic component and excluding the second electronic component. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: May 11, 2021
    Assignee: Amkor Technology Singapore Holding PTE. Ltd.
    Inventors: Ji Hoon Oh, Dong Hyun Bang, Soo Jin Shin, Young Ik Kwon, Tae Kyeong Hwang, Min Jae Lee
  • Publication number: 20210066206
    Abstract: In one example, a semiconductor device comprises a substrate comprising a conductive structure, a first electronic component over the substrate, an encapsulant over the substrate and contacting a lateral side of the first electronic component, a shield over the encapsulant and contacting a lateral side of the encapsulant and a portion of a lateral side of the substrate, and a communication structure coupled with the substrate. The substrate comprises a vertical groove side and a horizontal groove side defining a groove in the substrate, wherein a portion of the groove is uncovered by the shield. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: August 25, 2020
    Publication date: March 4, 2021
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Ji Hoon Oh, Dong Hyun Bang, Soo Jin Shin, Young Ik Kwon, Tae Kyeong Hwang, Min Jae Lee, Min Jae Kong
  • Publication number: 20210066204
    Abstract: In one example, a semiconductor device comprises a substrate, a first electronic component on a top side of the substrate, a second electronic component on the top side of the substrate, an encapsulant on the top side of the substrate, contacting a lateral side of the first electronic component and a lateral side of the second electronic component, a conformal shield on a top side of the encapsulant over the first electronic component and having a side shield contacting a lateral side of the encapsulant, and a compartment wall between the first electronic component and the second electronic component and contacting the conformal shield to define a compartment containing the first electronic component and excluding the second electronic component. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: August 28, 2019
    Publication date: March 4, 2021
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Ji Hoon Oh, Dong Hyun Bang, Soo Jin Shin, Young Ik Kwon, Tae Kyeong Hwang, Min Jae Lee
  • Publication number: 20210047172
    Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.
    Type: Application
    Filed: November 2, 2020
    Publication date: February 18, 2021
    Inventors: Yung Woo Lee, Byung Jun Kim, Dong Hyun Bang, EunNaRa Cho, Adrian Arcedera, Jae Ung Lee
  • Patent number: 10830983
    Abstract: A camera module actuator is described including a magnet, a coil disposed to face the magnet, and a driver configured to apply a driving signal to the coil to move the magnet. The camera module actuator also includes a detector configured to detect a position of the magnet from a change in inductance of the coil, based on the movement of the magnet.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: November 10, 2020
    Assignee: Samusng Electro-Mechanics Co., Ltd.
    Inventors: Je Hyun Bang, Hoon Heo, Shin Young Cheong, Byung Gi An, Dae Hyun Jeong
  • Patent number: 10822226
    Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: November 3, 2020
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Yung Woo Lee, Byung Jun Kim, Dong Hyun Bang, EunNaRa Cho, Adrian Arcedera, Jae Ung Lee
  • Patent number: 10789317
    Abstract: An apparatus that provides a feedback effect regarding on a social network service includes a post generation unit configured to receive a post that has a tag associated with a feedback effect from a user device and post the post on the social network service, a feedback collection unit configured to collect feedback in response to the post from another user device that accesses the post, and an effect providing unit configured to apply a predetermined feedback effect corresponding to the tag included in the post according to predetermined condition, wherein the predetermined feedback effect is selected from among multiple feedback effects preset for one or more of tags, and the predetermined condition includes at least one of a type of the feedback and a quantity of the feedback.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: September 29, 2020
    Assignee: KAKAO CORP.
    Inventors: Youn Woo Kim, Ji Soo Youk, Jeong Hyeon Lee, Ji Hyun Bang, Ji Hye Kim
  • Patent number: 10698174
    Abstract: A sensing unit of a camera module includes a detection target provided on a side surface of a lens module, one or more sensing coils disposed to face the detection target, and a calculator. The calculator may determine a displacement of the detection target translated in any of an optical axis direction, a first direction perpendicular to the optical axis direction, and a second direction perpendicular to the optical axis direction, based on inductances of the one or more sensing coils.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: June 30, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong Joo Lee, Nam Ki Park, Je Hyun Bang, Young Bok Yoon, Dong Yeon Shin
  • Patent number: 10689735
    Abstract: A high strength steel sheet comprises 0.02 to 0.12 wt % of carbon (C), 0.5 to 2.0 wt % of manganese (Mn), 0.05 to 0.5 wt % of silicon (Si), 0.05 to 1.0 wt % of nickel (Ni), 0.005 to 0.1 wt % of titanium (Ti), 0.005 to 0.5 wt % of aluminum (Al), 0.015 wt % or less of phosphorus (P), 0.015 wt % or less of sulfur (S), and the balance of Fe and other inevitable impurities. The microstructure thereof includes 70% to 90% of ultrafine ferrite and 10% to 30% of MA (martensite/austenite) structure by area fraction, and the yield ratio (YS/TS) thereof is 0.8 or less.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: June 23, 2020
    Assignee: POSCO
    Inventors: Sung-Ho Jang, Woo-Gyeom Kim, Ki-Hyun Bang
  • Publication number: 20200084060
    Abstract: Disclosed are a method of controlling an IOT device using a cloud platform, a cloud server and a system for controlling an IOT device, including receiving a device identifier (ID) extracted from an image code recognized by a mobile terminal, determining an IOT device corresponding to the received device ID among a plurality of IOT devices capable of being connected to a wide area network, recognizing one or more state items and one or more control items corresponding to the determined IOT device, and transmitting state information, including one or more state items of the determined IOT device and control state information including one or more control items capable of controlling the determined IOT device and indicative of a current control state, to the mobile terminal.
    Type: Application
    Filed: August 22, 2019
    Publication date: March 12, 2020
    Applicant: WIZnet Co., LTD.
    Inventors: Bo Hyun Bang, Bong Jun Hur, Hyuk Joo Kweon, Young In Kim
  • Publication number: 20200016795
    Abstract: The present invention relates to a method of manufacturing a hyaluronate film and a hyaluronate film manufactured thereby, and more particularly to a method of manufacturing a hyaluronate film through a solvent-casting process or using an automatic film applicator that facilitates mass production and to a hyaluronate film manufactured thereby, which is useful as a mask pack for cosmetics, a patch for medicaments and medical devices, a film-type adhesion inhibitor, etc. Unlike conventional liquid products, the hyaluronate film according to the present invention has a dry surface and thus entails no concern about microbial contamination, is easy to produce/manage/distribute/use, and has superior mechanical properties, whereby it can be utilized for various applications such as packs, patches, artificial skin and the like for cosmetics, medicaments, and medical devices.
    Type: Application
    Filed: March 7, 2018
    Publication date: January 16, 2020
    Inventors: Dong Keon KWEON, Ju Yeon HONG, Ji Hyun BANG, Seung Taik LIM, So Mang CHOI, Seul Ki KIM, Man HA, Young Mo LEE
  • Patent number: 10536256
    Abstract: Disclosed is a 5G or pre-5G communication system for supporting a data transmission rate higher than that of a 4G communication system, such as LTE, and subsequent systems, and a method for transmitting an uplink control signal in a wireless communication system comprises the steps of: transmitting information indicating a first frequency domain to which an uplink control signal is transmitted from a base station, which has determined to perform full-duplex based communication; and performing downlink reception through the remaining frequency domains excluding the first frequency domain.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: January 14, 2020
    Assignees: Samsung Electronics Co., Ltd., Yonsei University-Industry Foundation
    Inventors: Hyoung-Ju Ji, Dae-Sik Hong, Youn-Sun Kim, Jong-Hyun Bang, Hyun-Soo Kim
  • Patent number: 10422974
    Abstract: A camera module comprises a lens barrel, a lens driving device including a focusing unit moving a lens barrel in an optical axis direction and a movement correction unit moving the lens barrel in a direction perpendicular to the optical axis direction, and a housing accommodating the lens barrel and the lens driving device. A focus sensing portion of the focusing unit is disposed in an area not including a planar surface on which a focusing magnet and a focusing coil are mounted.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: September 24, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung Woo Kim, Je Hyun Bang, Young Bok Yoon, Dong Yeon Shin, Hong Joo Lee
  • Patent number: 10415438
    Abstract: An oil drain preventing device for a continuously variable valve timing apparatus includes: an advance angle oil passage connected to a continuously variable valve timing (CVVT) journal from an an oil control valve (OCV) groove to which an oil control valve (OCV) is mounted to supply an oil supplied from a hydraulic pump to a continuously variable valve timing (CVVT) apparatus; a retard angle oil passage connected to the CVVT journal from the OCV groove; and a valve unit mounted to the advance angle oil passage and the retard angle oil passage between the oil control valve and the CVVT journal for preventing the oil supplied to the continuously variable valve timing apparatus from being drained by selectively opening/closing the advance angle oil passage and the retard angle oil passage according to a starting ON or a starting OFF of the engine.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: September 17, 2019
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Sang Hyun Bang
  • Patent number: 10331013
    Abstract: An actuator of a camera module includes: a detection target; and a position detecting unit disposed to face the detection target and including at least two sensing coils respectively forming at least two oscillation circuits, wherein the position detecting unit detects a position of the detection target depending on at least two oscillation signals generated by the at least two oscillation circuits and having different frequency ranges.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: June 25, 2019
    Assignee: Samsung EIectro-Mechanics Co., Ltd.
    Inventors: Suk Young Oh, Je Hyun Bang, Hong Joo Lee, Young Bok Yoon, Hoon Heo, Jung Seok Lee, Ick Chan Shim
  • Patent number: D926538
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: August 3, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun Hye Kim, Tae Hwan Kim, Ji Hyun Bang, Dong Min Shin, Mi-Seon Hwang