Patents by Inventor Hyun Bang

Hyun Bang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10241348
    Abstract: An actuator and a camera module including the same are provided. The actuator driving apparatus includes a detector configured to apply a reference signal to a driving coil of an actuator and detect a coil current flowing in the driving coil, a calculator configured to determine a position of a lens carrier based on the coil current, and a driver configured to drive the actuator based on the position of the lens carrier and a position control signal.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: March 26, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Je Hyun Bang, Byung Gi An, Hoon Heo, Shin Young Cheong, Dae Hyun Jeong
  • Publication number: 20190072008
    Abstract: An oil drain preventing device for a continuously variable valve timing apparatus includes: an advance angle oil passage connected to a continuously variable valve timing (CVVT) journal from an an oil control valve (OCV) groove to which an oil control valve (OCV) is mounted to supply an oil supplied from a hydraulic pump to a continuously variable valve timing (CVVT) apparatus; a retard angle oil passage connected to the CVVT journal from the OCV groove; and a valve unit mounted to the advance angle oil passage and the retard angle oil passage between the oil control valve and the CVVT journal for preventing the oil supplied to the continuously variable valve timing apparatus from being drained by selectively opening/closing the advance angle oil passage and the retard angle oil passage according to a starting ON or a starting OFF of the engine.
    Type: Application
    Filed: December 7, 2017
    Publication date: March 7, 2019
    Inventor: Sang Hyun Bang
  • Publication number: 20190042655
    Abstract: An apparatus that provides a feedback effect regarding on a social network service includes a post generation unit configured to receive a post that has a tag associated with a feedback effect from a user device and post the post on the social network service, a feedback collection unit configured to collect feedback in response to the post from another user device that accesses the post, and an effect providing unit configured to apply a predetermined feedback effect corresponding to the tag included in the post according to predetermined condition, wherein the predetermined feedback effect is selected from among multiple feedback effects preset for one or more of tags, and the predetermined condition includes at least one of a type of the feedback and a quantity of the feedback.
    Type: Application
    Filed: August 3, 2018
    Publication date: February 7, 2019
    Inventors: Youn Woo KIM, Ji Soo YOUK, Jeong Hyeon LEE, Ji Hyun BANG, Ji Hye KIM
  • Publication number: 20180356609
    Abstract: A camera module comprises a lens barrel, a lens driving device including a focusing unit moving a lens barrel in an optical axis direction and a movement correction unit moving the lens barrel in a direction perpendicular to the optical axis direction, and a housing accommodating the lens barrel and the lens driving device. A focus sensing portion of the focusing unit is disposed in an area not including a planar surface on which a focusing magnet and a focusing coil are mounted.
    Type: Application
    Filed: December 21, 2017
    Publication date: December 13, 2018
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Woo KIM, Je Hyun BANG, Young Bok YOON, Dong Yeon SHIN, Hong Joo LEE
  • Publication number: 20180350734
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.
    Type: Application
    Filed: July 23, 2018
    Publication date: December 6, 2018
    Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
  • Patent number: 10144634
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: December 4, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Jae Ung Lee, Byong Jin Kim, Young Seok Kim, Wook Choi, Seung Jae Yoo, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang
  • Publication number: 20180299644
    Abstract: A sensing unit of a camera module includes a detection target provided on a side surface of a lens module, one or more sensing coils disposed to face the detection target, and a calculator. The calculator may determine a displacement of the detection target translated in any of an optical axis direction, a first direction perpendicular to the optical axis direction, and a second direction perpendicular to the optical axis direction, based on inductances of the one or more sensing coils.
    Type: Application
    Filed: March 7, 2018
    Publication date: October 18, 2018
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hong Joo LEE, Nam Ki PARK, Je Hyun BANG, Young Bok YOON, Dong Yeon SHIN
  • Publication number: 20180284568
    Abstract: An actuator of a camera module includes: a detection target; and a position detecting unit disposed to face the detection target and including at least two sensing coils respectively forming at least two oscillation circuits, wherein the position detecting unit detects a position of the detection target depending on at least two oscillation signals generated by the at least two oscillation circuits and having different frequency ranges.
    Type: Application
    Filed: April 2, 2018
    Publication date: October 4, 2018
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Young OH, Je Hyun BANG, Hong Joo LEE, Young Bok YOON, Hoon HEO, Jung Seok LEE, Ick Chan SHIM
  • Patent number: 10032705
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.
    Type: Grant
    Filed: May 8, 2016
    Date of Patent: July 24, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
  • Publication number: 20180097607
    Abstract: Disclosed is a 5G or pre-5G communication system for supporting a data transmission rate higher than that of a 4G communication system, such as LTE, and subsequent systems, and a method for transmitting an uplink control signal in a wireless communication system comprises the steps of: transmitting information indicating a first frequency domain to which an uplink control signal is transmitted from a base station, which has determined to perform full-duplex based communication; and performing downlink reception through the remaining frequency domains excluding the first frequency domain.
    Type: Application
    Filed: March 31, 2016
    Publication date: April 5, 2018
    Inventors: Hyoung-Ju JI, Dae-Sik HONG, Youn-Su KIM, Jong-Hyun BANG, Hyun-Soo KIM
  • Publication number: 20180095341
    Abstract: An actuator includes a magnet, a driving coil facing the magnet, a driver, and a position calculation processor. The driver is configured to move the magnet in at least one of an optical axis direction and a direction perpendicular to the optical axis by applying a driving signal to the driving coil. The position calculation processor includes sensing coils, and is configured to calculate a position of the magnet according to inductance levels of an inductor of the sensing coils. The inductance levels vary according to movements of the magnet.
    Type: Application
    Filed: September 7, 2017
    Publication date: April 5, 2018
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hong Joo LEE, Dong Yeon SHIN, Nam Ki PARK, Shin Young CHEONG, Byung Gi AHN, Hoon HEO, Je Hyun BANG, Yun Tae LEE, Ick Chan SHIM, Young Bok YOON
  • Publication number: 20180067277
    Abstract: A camera module actuator is described including a magnet, a coil disposed to face the magnet, and a driver configured to apply a driving signal to the coil to move the magnet. The camera module actuator also includes a detector configured to detect a position of the magnet from a change in inductance of the coil, based on the movement of the magnet.
    Type: Application
    Filed: March 2, 2017
    Publication date: March 8, 2018
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Hyun BANG, Hoon HEO, Shin Young CHEONG, Byung Gi AN, Dae Hyun JEONG
  • Publication number: 20180057353
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.
    Type: Application
    Filed: November 7, 2017
    Publication date: March 1, 2018
    Inventors: Jae Ung Lee, Byong Jin Kim, Young Seok Kim, Wook Choi, Seung Jae Yoo, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang
  • Publication number: 20170320723
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.
    Type: Application
    Filed: May 9, 2016
    Publication date: November 9, 2017
    Inventors: Jae Ung Lee, Byong Jin Kim, Young Seok Kim, Wook Choi, Seung Jae Yoo, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang
  • Patent number: 9809446
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.
    Type: Grant
    Filed: May 9, 2016
    Date of Patent: November 7, 2017
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Jae Ung Lee, Byong Jin Kim, Young Seok Kim, Wook Choi, Seung Jae Yoo, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang
  • Patent number: 9804477
    Abstract: An actuator driving apparatus includes an inductor disposed on a housing to face a magnetic body attached to a lens carrier, a detector configured to apply a reference signal to the inductor and detect an inductor current flowing through the inductor, a calculator configured to determine a position of the lens carrier based on the inductor current, and a driver configured to drive an actuator based on the position of the lens carrier and a position control signal.
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: October 31, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Je Hyun Bang, Shin Young Cheong, Byung Gi An, Hoon Heo
  • Publication number: 20170160557
    Abstract: An actuator and a camera module including the same are provided. The actuator driving apparatus includes a detector configured to apply a reference signal to a driving coil of an actuator and detect a coil current flowing in the driving coil, a calculator configured to determine a position of a lens carrier based on the coil current, and a driver configured to drive the actuator based on the position of the lens carrier and a position control signal.
    Type: Application
    Filed: July 14, 2016
    Publication date: June 8, 2017
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Hyun BANG, Byung Gi AN, Hoon HEO, Shin Young CHEONG
  • Publication number: 20170146889
    Abstract: An actuator driving apparatus includes an inductor disposed on a housing to face a magnetic body attached to a lens carrier, a detector configured to apply a reference signal to the inductor and detect an inductor current flowing through the inductor, a calculator configured to determine a position of the lens carrier based on the inductor current, and a driver configured to drive an actuator based on the position of the lens carrier and a position control signal.
    Type: Application
    Filed: August 22, 2016
    Publication date: May 25, 2017
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Je Hyun BANG, Shin Young CHEONG, Byung Gi AN, Hoon HEO
  • Patent number: 9647450
    Abstract: This specification relates to fault current limiter (FCL). More particularly, to solve problems of protecting and designing current limiting impedance in a protective coordination system, as limitations of the related art, the fault current limiter may measure heat capacity of a current limiting impedance unit by detecting fault current flowing to the current limiting impedance unit and limiting the fault current flowing to the current limiting impedance unit according to the measured heat capacity, which may result in preventing the current limiting impedance unit from being damaged due to the fault current, preventing an extended accident due to the damaged current limiting impedance unit and enabling a stabilized system and line protection.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: May 9, 2017
    Assignee: LSIS CO., LTD.
    Inventors: Seung Hyun Bang, Won Joon Choe, Min Jee Kim, Kil Young Ahn
  • Patent number: 9553497
    Abstract: The present invention provides a horizontal linear vibrator which can reduce the thickness but increase vibration strength while at the same time guaranteeing a sufficiently long lifetime and satisfactory responsivity. The horizontal linear vibrator includes a casing, a bracket, a vibration unit and springs. The casing defines an internal space therein. The bracket is disposed under the casing. A cylindrical coil is provided on the bracket. The vibration unit has a magnet, a yoke and a weight. The yoke contains the magnet therein and is open on the lower end thereof. The weight is coupled to the outer surface of the yoke. The springs are coupled to sidewall plates of the casing or the bracket. The springs elastically support the vibration unit to allow the vibration unit to vibrate in the horizontal direction.
    Type: Grant
    Filed: April 30, 2013
    Date of Patent: January 24, 2017
    Assignee: MPLUS CO., LTD.
    Inventors: Yong Jin Kim, Jun Kun Choi, Jae Woo Jun, Ki Suk Woo, Kwang Hyung Lee, Je Hyun Bang, Seok Jun Park, Kyung Ho Lee, Hwa Young Oh