Abstract: The present disclosure relates to a blank mask and the like, and comprises a transparent substrate and a light shielding film disposed on the transparent substrate. The light shielding film comprises a transition metal and at least any one between oxygen and nitrogen. The light shielding film comprises a first light shielding layer and a second light shielding layer disposed on the first light shielding layer. The light shielding film has an Rd value of Equation 1 below which is 0.4 to 0.8. Rd=er2/er1??[Equation 1] In the Equation 1, the er1 value is an etching rate of the first light shielding layer measured by etching with argon gas. The er2 value is an etching rate of the second light shielding layer measured by etching with argon gas. In such a blank mask, a resolution degradation can be suppressed effectively when the light shielding film is patterned.

Abstract: The present disclosure relates to a blank mask including: a transparent substrate; and a light shielding film disposed on the transparent substrate, wherein the light shielding film comprises a transition metal and at least one selected from the group consisting of oxygen and nitrogen, and wherein a Mtr value of Equation 1 below of a surface of the light shielding film is 6 or less: Mtr=|Rsk|*Rku ??[Equation 1] where, in the Equation 1, |Rsk| is an absolute value of an Rsk value, which is a height skewness of the surface of the light shielding film, and Rku is kurtosis of the surface of the light shielding film.

Abstract: Disclosed is a photomask comprising: a transparent substrate; and a multi-layer light shielding pattern film disposed on the transparent substrate, wherein the multi-layer light shielding pattern film comprises: a first light shielding film; and a second light shielding film disposed on the first light shielding film and comprising a transition metal and at least one selected from the group consisting of oxygen and nitrogen, and wherein a surface roughness Wr of the measuring zone satisfies Equation 1 below: 0 nm<Wr?Wo?3 nm??[Equation 1] where, in the Equation 1 above, Wo is a surface roughness of the measuring zone before soaking and washing processes, Wr is a surface roughness of the measuring zone after soaking in SC-1 (standard clean-1) solution and washing with ozone water, and the SC-1 solution comprises NH4OH, H2O2, and H2O.

Abstract: A photomask blank includes a light-transmitting substrate, and a shading layer part disposed on the light-transmitting substrate, the shading layer part including a first shading layer having a first hardness and a second shading layer having a second hardness. The first shading layer is disposed closer to the light-transmitting substrate than the second shading layer, and a value of the first hardness is larger that a value of the second hardness.

Abstract: A critical dimension measurement system includes a voltage measurement circuit, a control circuit, and a critical dimension measurement circuit. The voltage measurement circuit may measure potentials of mask patterns of a photomask. The control circuit may include an information storage circuit for storing distribution information on the potentials of the mask patterns, measured by the voltage measurement circuit, and information on layout patterns corresponding to the mask patterns of the photomask. The critical dimension measurement circuit may be operated, by the control circuit, in a first measurement mode and a second measurement mode running for a shorter time than the first measurement mode, and measure critical dimensions of the mask patterns.

Abstract: A blank mask including a transparent substrate, a phase shift film disposed on the transparent substrate, and a light shielding film disposed on the phase shift film. The phase shift film has XRD maximum peak at 2? of 15° to 30° when normal mode XRD analysis is performed on an upper surface of the phase shift film. The transparent substrate has XRD maximum peak at 2? of 15° to 30° when performing normal mode XRD analysis on a lower surface of the transparent substrate. AI1 value of the blank mask expressed by below Equation is 0.9 to 1.1. AI ? ? 1 = XM ? ? 1 XQ ? ? 1 XM1 is the maximum value of the measured X-ray intensity when the normal mode XRD analysis is performed on upper surface of the phase shift film. XQ1 is the maximum value of the measured X-ray intensity when the normal mode XRD analysis is performed on the lower surface of the transparent substrate.

Abstract: The present disclosure relates to a blank mask and the like, and comprises a transparent substrate, a phase shift film disposed on the transparent substrate, and a light shielding film disposed on the phase shift film. The blank mask has a TFT1 value of 0.25 ?m/100° C. or less expressed by Equation 1 below: TFT ? ? 1 = ? ? ? PM T ? ? 2 - T ? ? 1 [ Equation ? ? 1 ] where, when the thermal variation of the processed blank mask, which is formed by processing the thickness of the transparent substrate of the blank mask to be 0.6 mm and removing the light shielding film, is analyzed in a thermomechanical analyzer, the measuring temperature of the thermomechanical analyzer is increased from T1 to T2, and ?PM is a position change of the upper surface of the phase shift film in the thickness direction at T2, based on a position of the upper surface of the phase shift film at T1.

Abstract: Disclosed are a composite resin composition and an article containing the same. The composite resin composition may include semicrystalline polyamide; amorphous polyamide; an acrylonitrile-butadiene-styrene (ABS) resin; a compatibilizer; and a strength-reinforcing agent. The article may exhibit superior rigidity equivalent to or greater than that of conventional long-fiber thermoplastics and remarkably excellent dimensional stability. In addition, the composite resin composition and the molded article including the same may be used in replacement of steel parts so as to reduce the weight by about 30%.

Abstract: An electronic device includes a cover glass, a display exposed through the cover glass, a housing for mounting the display, a first printed circuit board (PCB) and a second PCB that are disposed inside the housing, a back cover coupled to the housing, a first antenna element electrically connected to a ground area through the first PCB, and a communication circuit feeding the first antenna element and transmitting or receiving a signal through the first antenna element. A spaced distance between the first PCB and the display is longer than a spaced distance between the second PCB and the display.

Abstract: A substrate processing module includes a process chamber configured to perform a treatment process on a substrate; a transfer chamber provided on a first side of the process chamber, the substrate being transferred between the process chamber and the transfer chamber; an optical emission spectroscopy (OES) system provided on a second side of the process chamber and configured to monitor the process chamber; and a reference light source disposed in the transfer chamber and configured to emit a reference light to calibrate the OES system.

Abstract: An electronic device is provided, which includes a housing; a conductive member forming at least a part of the housing; first to third nonconductive members separating the conductive member, wherein the conductive member includes a first conductive pattern disposed between the first nonconductive member and the second nonconductive member, and a second conductive pattern disposed between the second nonconductive member and the third nonconductive member; a first feeding part connected to the first conductive pattern; a second feeding part connected to the second conductive pattern; a first ground part connected to the first conductive pattern at a point adjacent to the second nonconductive member; and a communication circuit electrically connected with the conductive member.

Abstract: An electronic device is provided. The electronic device includes a housing including a first surface, a second surface disposed facing an opposite side of the first surface, and a side surface configured to surround at least a portion of a space between the first surface and the second surface, a first elongated metal member configured to form a first portion of the side surface and including a first end and a second end, at least one communication circuit electrically connected to a first point of the first elongated metal member through a capacitive element, at least one ground member disposed in an interior of the housing, and a first conductive member configured to electrically connect a second point of the first elongated metal member to the ground member. The second point of the first elongated metal member is disposed closer to the second end than to the first point.

Abstract: An optical emission spectroscopy system may include a reference light source, an analyzer to receive and analyze light transmitted from the reference light source, and a calibrator to calibrate light emitted from the reference light source. The calibrator may change a calibration ratio in accordance with an incidence angle of the light.

Abstract: An electronic device is provided, which includes a housing; a conductive member forming at least a part of the housing; first to third nonconductive members separating the conductive member, wherein the conductive member includes a first conductive pattern disposed between the first nonconductive member and the second nonconductive member, and a second conductive pattern disposed between the second nonconductive member and the third nonconductive member; a first feeding part connected to the first conductive pattern; a second feeding part connected to the second conductive pattern; a first ground part connected to the first conductive pattern at a point adjacent to the second nonconductive member; and a communication circuit electrically connected with the conductive member.

Abstract: An electronic device is provided. The electronic device includes a housing including a first surface, a second surface disposed facing an opposite side of the first surface, and a side surface configured to surround at least a portion of a space between the first surface and the second surface, a first elongated metal member configured to form a first portion of the side surface and including a first end and a second end, at least one communication circuit electrically connected to a first point of the first elongated metal member through a capacitive element, at least one ground member disposed in an interior of the housing, and a first conductive member configured to electrically connect a second point of the first elongated metal member to the ground member. The second point of the first elongated metal member is disposed closer to the second end than to the first point.

Abstract: A substrate processing module includes a process chamber configured to perform a treatment process on a substrate; a transfer chamber provided on a first side of the process chamber, the substrate being transferred between the process chamber and the transfer chamber; an optical emission spectroscopy (OES) system provided on a second side of the process chamber and configured to monitor the process chamber; and a reference light source disposed in the transfer chamber and configured to emit a reference light to calibrate the OES system.

Abstract: Disclosed is a vertical moving and swing type blender, which is capable of being moved vertically and swinging in right and left directions, thereby easily crushing food. The blender includes: a base member; a turning member configured such that a lower portion thereof is pivotally hinged to an upper portion of the base member; a main body disposed to be vertically movable in the turning member; a container member detachably coupled to an upper portion of the main body and configured to receive food, with a blade provided therein; a vertical elastic member elastically supporting the main body to allow the main body to be vertically movable in the turning member; and a horizontal elastic member configured such that a first end thereof is coupled to the base member and a second end thereof is coupled to the turning member so as to support the turning member horizontally and elastically.

Abstract: A substrate processing module includes a process chamber configured to perform a treatment process on a substrate; a transfer chamber provided on a first side of the process chamber, the substrate being transferred between the process chamber and the transfer chamber; an optical emission spectroscopy (OES) system provided on a second side of the process chamber and configured to monitor the process chamber; and a reference light source disposed in the transfer chamber and configured to emit a reference light to calibrate the OES system.

Abstract: A critical dimension measurement system includes a voltage measurement circuit, a control circuit, and a critical dimension measurement circuit. The voltage measurement circuit may measure potentials of mask patterns of a photomask. The control circuit may include an information storage circuit for storing distribution information on the potentials of the mask patterns, measured by the voltage measurement circuit, and information on layout patterns corresponding to the mask patterns of the photomask. The critical dimension measurement circuit may be operated, by the control circuit, in a first measurement mode and a second measurement mode running for a shorter time than the first measurement mode, and measure critical dimensions of the mask patterns.

Abstract: Provided is an amplifying repeater to intensify and amplify a magnetic field of electromagnetic waves. Also provided is a wireless power conversion charging device using the magnetic field of electromagnetic waves, which is located between an electromagnetic wave generating source transmitter and a receiving coil or attached to a transmitter and a receiving coil. Accordingly, charging power for various electronic devices can be provided and power can be wirelessly supplied to various loads.