Patents by Inventor In Chang Hwang

In Chang Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220297578
    Abstract: A railess variable seatback type rear seat includes: a linear movement device configured to convert a rotation of a motor into a linear movement; a sliding movement device configured to convert the linear movement into a sliding movement in which a seat cushion is pushed forward or backward; and a reclining angle change device configured to convert the sliding movement into a reclining movement, and to fold a seatback, which is connected to the seat cushion, forward or to recline the seatback backward.
    Type: Application
    Filed: July 20, 2021
    Publication date: September 22, 2022
    Applicants: HYUNDAI MOTOR COMPANY, Kia Corporation, Daechang Seat Co.,LTD-Dongtan, Hyundai Transys Inc.
    Inventors: Seung-Hyun KIM, Sang-Hyun LEE, Min-Ju LEE, Byung-Yong CHOI, Chan-Ho JUNG, Seon-Chae NA, Young-Woon CHOI, Jae-Jin LEE, Dong-Hwan KIM, In-Chang HWANG
  • Publication number: 20220211137
    Abstract: A cap and a method for forming the same are provided. An integrally formed outer layer of fabric and an integrally formed moldable layer are adhesively bonded together to form a moldable front panel. A curved front side of the front panel is then formed by a mold. After that, the front panel and a plurality of side panels are connected to form a crown, and a peak is subsequently connected to the front panel of the crown to form the cap. Once the curved front side of the front panel is formed by heating and pressure application through the mold, the integrally formed moldable layer keeps the front panel in shape, so there is no need to support the outer layer of fabric and curve the front panel with two pieces of buckram that are stitched together, as is conventionally required.
    Type: Application
    Filed: January 4, 2021
    Publication date: July 7, 2022
    Inventor: YA-CHANG HWANG
  • Publication number: 20220208999
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate having a front side and a back side opposite the front side. The semiconductor structure also includes a first contact metal layer disposed on the front side of the substrate. The semiconductor structure further includes a III-V compound semiconductor layer disposed between the substrate and the first contact metal layer. Moreover, the semiconductor structure includes a via hole penetrating through the substrate and the III-V compound semiconductor layer from the back side of the substrate. The bottom of the via hole is defined by the first contact metal layer, and the first contact metal layer includes molybdenum, tungsten, iridium, palladium, platinum, cobalt, ruthenium, osmium, rhodium, rhenium, or a combination thereof.
    Type: Application
    Filed: December 30, 2020
    Publication date: June 30, 2022
    Inventors: Chang-Hwang HUA, Chia-Hao CHEN
  • Publication number: 20220184896
    Abstract: A cap and a method for forming the same are provided. An integrally formed outer layer of fabric and an integrally formed moldable layer are adhesively bonded together to form a moldable panel. A curved edge of the moldable panel is then formed by a mold. After that, the moldable panel and at least one second panel are connected to form a crown, to which a peak is subsequently connected to form the cap. Once the curved edge of the moldable panel is formed by heating and pressure application through the mold, the integrally formed moldable layer keeps the moldable panel in shape, so there is no need to support the outer layer of fabric and curve, for example, the front panel with two pieces of buckram that are stitched together, as is conventionally required.
    Type: Application
    Filed: June 15, 2021
    Publication date: June 16, 2022
    Inventor: YA-CHANG HWANG
  • Publication number: 20220153174
    Abstract: A combination structure of a seat frame includes: a first and a second side cushion frames installed on a first and a second sides of a seat, and configured to slide forward and rearward, wherein the first and the second sides of the seat are opposite to each other; a center cushion frame provided between the side cushion frames and having a first side fixed to the first side cushion frame; and a support guide device connected between a second side of the center cushion frame and the second side cushion frame, and configured to guide a sliding movement of each of the second side cushion frame and the center cushion frame while supporting weights of the second side cushion frame and the center cushion frame.
    Type: Application
    Filed: June 7, 2021
    Publication date: May 19, 2022
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, Daechang Seat Co.,LTD-Dongtan, Hyundai Transys Inc.
    Inventors: Min Ju LEE, Seung Hyun KIM, Byung Yong CHOI, Sang Hyun LEE, Seon Chae NA, Chan Ki CHO, In Chang HWANG, Dong Hwan KIM, Young Woon CHOI, Jae Jin LEE
  • Publication number: 20220111770
    Abstract: An apparatus for adjusting a seat of a vehicle includes a seat back frame, a cushion frame that is moved forward and backward by a motor driving unit, a cushion hinge part connecting the seat back frame and the cushion frame and rotating according to the movement of the cushion frame to adjust the angle of the seat back frame, and a seat back hinge part connecting the seat back frame and the vehicle body and rotating according to the movement of the seat back frame.
    Type: Application
    Filed: March 3, 2021
    Publication date: April 14, 2022
    Inventors: Min Ju Lee, Seunghyun Kim, Byung Yong Choi, Sanghyun Lee, Seon Chae Na, Chan Ki Cho, In Chang Hwang, Donghwan Kim, Youngwoon Choi, Jaejin Lee
  • Publication number: 20220111772
    Abstract: The present disclosure relates to a reclining device for a seat, which can adjust a seatback at various angles through movement of a striker installed in a vehicle body. The reclining device for a seat includes a latch installed on a side of a seatback and configured to be rotated together with the seatback, and a striker module in which the latch is engaged with a striker installed in a vehicle body, where the striker moves in a certain section overlapping a rotation trajectory of the latch in a state where the latch is engaged and reclines the seatback together with the latch.
    Type: Application
    Filed: May 28, 2021
    Publication date: April 14, 2022
    Inventors: Suk Won Hong, Jong Seok Han, Jun Yong Kim, Sang Do Park, Sang Man Seo, Sung Hak Hong, Myung Soo Lee, In Chang Hwang, Kyoung Min Cho
  • Patent number: 11292370
    Abstract: A rear seat for a vehicle is provided, in which when the seat back is reclined. The angle of the seat cushion is adjusted by following the operation of the seat back to provide an optimal posture for fatigue reduction of a passenger. When the seat back is folded, the seat cushion is not operated.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: April 5, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation, Daechang Seat Co., LTD-Dongtan
    Inventors: Chan Ho Jung, Hyun Kyu Moon, Tae Hee Won, Jung Sang You, Hun Woong Song, Seon Chae Na, Myung Soo Lee, In Chang Hwang, Jeong Soo Kim, Jun Kyu Park
  • Patent number: 11177379
    Abstract: A gate-sinking pseudomorphic high electron mobility transistor comprises a compound semiconductor substrate overlaid with an epitaxial structure which includes sequentially a buffer layer, a channel layer, a Schottky layer, and a first cap layer. The Schottky layer comprises from bottom to top at least two stacked regions of semiconductor material. Each of the two adjacent stacked regions differs in material from the other and provides a stacked region contact interface therebetween. In any two adjacent stacked regions of the Schottky layer, one stacked region composed of AlGaAs-based semiconductor material alternates with the other stacked region composed of InGaP-based semiconductor material. A gate-sinking region is beneath the first gate metal layer of the gate electrode, and the bottom boundary of the gate-sinking region is located at the one of the at least one stacked region contact interface of the Schottky layer.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: November 16, 2021
    Assignee: WIN SEMICONDUCTORS CORP.
    Inventors: Chia-Ming Chang, Jung-Tao Chung, Chang-Hwang Hua, Ju-Hsien Lin, Yan-Cheng Lin, Yu-Chi Wang
  • Patent number: 11017698
    Abstract: A health monitoring device included in a large area display (LAD) with at least one display computers comprises a universal asynchronous receiver-transmitter (UART) configured to produce a test path by communicating with a processor of the display computer, a field programmable gate array (FPGA) configured to transmit a test signal to a terminal of the display computer and receive a test result, an ethernet unit configured to communicate with a test terminal connected with the LAD to transmit a monitoring signal to the test terminal, and a micro-controller configured to gather an operation state of the display computer and produce a measurement signal according to the test result.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: May 25, 2021
    Inventor: Byeung Chang Hwang
  • Patent number: 10953773
    Abstract: A fold and dive seat for a vehicle is provided with a seat-cushion tilting mechanism, a fold and dive mechanism, and a seatback reclining mechanism so as to simultaneously performed both a seatback reclining operation and a tilting operation of a front portion of a seat cushion. The fold and dive seat reduces by evenly dispersing a body pressure over a passenger's upper body and lower body.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: March 23, 2021
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION, DAECHANG SEAT CO., LTD-DONGTAN, HYUNDAI TRANSYS INC.
    Inventors: Hyun Kyu Moon, Seon Chae Na, Jung Sang You, Chan Ho Jung, Sang Beom Hwang, In Chang Hwang, Myung Soo Lee, Jeong Soo Kim, Eom Seok Yoo
  • Publication number: 20210070200
    Abstract: A rear seat for a vehicle is provided, in which when the seat back is reclined. The angle of the seat cushion is adjusted by following the operation of the seat back to provide an optimal posture for fatigue reduction of a passenger. When the seat back is folded, the seat cushion is not operated.
    Type: Application
    Filed: June 9, 2020
    Publication date: March 11, 2021
    Inventors: Chan Ho Jung, Hyun Kyu Moon, Tae Hee Won, Jung Sang You, Hun Woong Song, Seon Chae Na, Myung Soo Lee, In Chang Hwang, Jeong Soo Kim, Jun Kyu Park
  • Patent number: 10933776
    Abstract: A fold and dive seat for a vehicle that achieves a fatigue reduction posture is provided. The seat includes a tip up-extension mechanism that enables tipping-up and extension of the front end of a seat cushion and a seatback reclining mechanism for the fold and dive seat so that tipping-up for lifting the front end of the seat cushion and extension for extending the front end forward are performed simultaneously performed when the seatback reclining is performed.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: March 2, 2021
    Assignees: Hyundai Motor Company, Kia Motors Corporation, DAECHANG SEAT CO., LTD-DONGTAN, HYUNDAI TRANSYS INC.
    Inventors: Hyun Kyu Moon, Chan Ho Jung, Seon Chae Na, Sang Beom Hwang, In Chang Hwang, Myung Soo Lee, Jeong Soo Kim, Eom Seok Yoo
  • Publication number: 20200403091
    Abstract: A gate-sinking pseudomorphic high electron mobility transistor comprises a compound semiconductor substrate overlaid with an epitaxial structure which includes sequentially a buffer layer, a channel layer, a Schottky layer, and a first cap layer. The Schottky layer comprises from bottom to top at least two stacked regions of semiconductor material. Each of the two adjacent stacked regions differs in material from the other and provides a stacked region contact interface therebetween. In any two adjacent stacked regions of the Schottky layer, one stacked region composed of AlGaAs-based semiconductor material alternates with the other stacked region composed of InGaP-based semiconductor material. A gate-sinking region is beneath the first gate metal layer of the gate electrode, and the bottom boundary of the gate-sinking region is located at the one of the at least one stacked region contact interface of the Schottky layer.
    Type: Application
    Filed: June 19, 2019
    Publication date: December 24, 2020
    Inventors: Chia-Ming CHANG, Jung-Tao CHUNG, Chang-Hwang HUA, Ju-Hsien LIN, Yan-Cheng LIN, Yu-Chi WANG
  • Publication number: 20200373225
    Abstract: A semiconductor integrated circuit comprises a semiconductor substrate having a via-hole, a front-side-metal layer formed on a top surface of the semiconductor substrate, a seed-metal layer and a backside-metal layer. A bottom surface of an inner surface of the via-hole is at least partially defined by the front-side-metal layer. A surrounding surface of the inner surface of the via-hole is at least partially defined by the semiconductor substrate. The seed-metal layer is formed on the inner surface of the via-hole and a bottom surface of the semiconductor substrate such that the seed-metal layer and the front-side-metal layer are connected. The backside-metal layer is formed on an outer surface of the seed-metal layer. An aspect ratio of the via-hole is greater than or equal to 0.2 and less than or equal to 3, thereby a thickness uniformity of the backside-metal layer is improved.
    Type: Application
    Filed: October 21, 2019
    Publication date: November 26, 2020
    Inventors: Chih-Hsien CHANG, Wen CHU, Chang-Hwang HUA, Clement HUANG
  • Publication number: 20200307420
    Abstract: A fold and dive seat for a vehicle that achieves a fatigue reduction posture is provided. The seat includes a tip up-extension mechanism that enable stipping-up and extension of the front end of a seat cushion and a seatback reclining mechanism for the fold and dive seat so that tipping-up for lifting the front end of the seat cushion and extension for extending the front end forward are performed simultaneously performed when the seatback reclining is performed.
    Type: Application
    Filed: July 24, 2019
    Publication date: October 1, 2020
    Inventors: Hyun Kyu Moon, Chan Ho Jung, Seon Chae Na, Sang Beom Hwang, In Chang Hwang, Myung Soo Lee, Jeong Soo Kim, Eom Seok Yoo
  • Publication number: 20200249243
    Abstract: Provided herein are methods for assessing response to inflammatory disease therapy. The methods include performing immunoassays to generate scores based on quantitative data for expression of biomarkers relating to inflammatory biomarkers to assess disease activity in inflammatory diseases, e.g., rheumatoid arthritis. Also provided are methods of adjusting disease activity scores to account for variables that can influence such scores.
    Type: Application
    Filed: July 30, 2018
    Publication date: August 6, 2020
    Applicant: MYRIAD GENETICS, INC.
    Inventors: Ching Chang HWANG, David CHERNOFF, Alexander GUTIN, Darl FLAKE, Jerry LANCHBURY, Paul Scott EASTMAN, Eric SASSO
  • Patent number: 10726228
    Abstract: A semiconductor device comprising a fingerprint sensor configured to generate first-direction sensing data and second-direction sensing data by sensing a fingerprint image in a first direction and a second direction, respectively, which is perpendicular to the first direction; a differential sensing circuit configured to generate first-direction first differential data and second-direction first differential data by performing a differential operation on the first-direction sensing data and the second-direction sensing data, respectively; and a fingerprint processing circuit configured to generate first-direction second differential data and second-direction second differential data by performing a differential operation on the first-direction first differential data and the second-direction first differential data, respectively, and generate fingerprint data by adding the first-direction second differential data and the second-direction second differential data.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: July 28, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hee Chang Hwang, Jae Jin Park, Min Chul Lee, Seung Hoon Lee, Dae Young Chung
  • Patent number: 10720390
    Abstract: An ohmic metal for GaN device comprises a diffusion barrier seed metal layer and a plurality of metal layers. The diffusion barrier seed metal layer is formed on an epitaxial structure layer. The diffusion barrier seed metal layer is made of Pt. The epitaxial structure layer is made of AlGaN or GaN. The plurality of metal layers is formed on the diffusion barrier seed metal layer. The plurality of metal layers comprises a first metal layer and a second metal layer. The first metal layer is formed on the diffusion barrier seed metal layer. The first metal layer is made of Ti. The second metal layer is formed on the first metal layer. The second metal layer is made of Al. By the diffusion barrier seed metal layer, so as to suppress the diffusion of the plurality of metal layers into the epitaxial structure layer.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: July 21, 2020
    Assignee: WIN SEMICONDUCTORS CORP.
    Inventors: Chang-Hwang Hua, Yi-Wei Lien
  • Patent number: 10717991
    Abstract: The present invention relates to a transgenic pig in which an immune rejection response is suppressed during xenotransplantation, wherein a gene coding for heme oxygenase-1 (HO-1) and a gene coding for tumor necrosis factor receptor 1-Fc (TNFR1-Fc) are simultaneously expressed and a gene coding for ?-1,3-galactosyltransferase (GGTA1) is knocked out; and a method for producing the same.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: July 21, 2020
    Assignees: CHONG KUN DANG PHARMACEUTICAL CORP., SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Byeong Chun Lee, Curie Ahn, Geon A Kim, Su Cheong Yeom, Su Jin Kim, Bumrae Cho, Eun Mi Lee, Sang Hoon Lee, In Chang Hwang, Hye Jin Hong