Abstract: An electromagnetic bandgap structure is disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer, a plurality of conductive plates, placed on a planar surface which is different from that of the dielectric layer, vias, of which each is connected to each of the conductive plates, respectively, and penetrates through the dielectric layer from one end part that is connected to the conductive plates, and a conductive trace, which connects the other end parts of the vias with each other such that all of the conductive plates are electrically connected.

Abstract: This invention provides an e-learning system having a capability for authenticating the learner's ID via Internet with the learner's physical Bio-ID such as a fingerprint, an iris and/or a vein of the learner into the login process and additional periodic checking according to the instruction signal generated by the contents. Accordingly, once a learner successfully logs into his or her account, the computer will monitor each learner's progress on a lecture or an examination. Thus, the invention enable to operate a full online distance education from a single database for the worldwide learners, at each learner's own space and scheduling, anytime, anyplace, in any of the major languages selected by the learners and accurately account credit hours of each learner by the lectures and examination on demand for conferring a degree or to transfer the credit to the university where they will earn their degrees.

Abstract: According to an embodiment of the present invention, an electromagnetic bandgap structure can include: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate. In the electromagnetic bandgap structure of the present invetion, the first stitching via can electrically connect the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above the one conductive plate, and the second stitching via can electrically connect the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface below the one conductive plate.

Abstract: Disclosed are an electromagnetic bandgap structure and a printed circuit board. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer; a plurality of conductive plates; a stitching via, configured to pass through the dielectric layer and have a part electrically connecting the conductive plates to each other by connecting through a planar surface that is different from a planar surface of the conductive plates, and a through via. Here, the dielectric layer, the conductive plates and the stitching via can be placed between any two conductive layers, and the through via can be configured to pass through a clearance hole formed in the conductive layer and electrically connect the two conductive layers to each other.

Abstract: The Printed Circuit Board (PCB) has connectors which each include a terminal part and a connector pin. The terminal part is formed in one end of the PCB and is provided with a terminal hole. The connector pin is configured such that one end thereof is inserted into the terminal hole, and the remaining end thereof extends to protrude outside the terminal hole and is also bent several times, thus forming a contact part that is elastically deformed, and electrically connected to a pad part provided in a target PCB for connection. Thus, a desirable signal transmission characteristic is guaranteed, so that the reliability of electronic devices using the PCB can be improved and the manufacturing cost can also be reduced.

Abstract: According to the present invention, the board can include a dielectric layer; a plurality of conductive plates; and a stitching via, to electrically connect two of the conductive plates to each other. Here, the stitching via can include a first via and a second via, respectively, passing through the dielectric layer and having one end part being placed on a same planar surface as each of the two conductive plates; a connection pattern, having each end part being connected to the other end part of the first via and the second via, respectively; and a first extension pattern, placed on the same planar surface as one of the conductive plates and having one end part being connected to the one end part of the first via and the end part being connected to one of the conductive plates.

Abstract: A printed circuit board having an embedded chip capacitor is disclosed. According to an embodiment of the present invention, a printed circuit board having an embedded chip capacitor can include a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, placed between the first conductive layer and the second conductive layer and having a second electrode, connected to the second conductive layer; and a via, connecting the first conductive layer to a first electrode of the chip capacitor. With the present invention, a problem mixed signals can be solved in the printed circuit board including an analog circuit and a digital circuit board by using the chip capacitor embedded in the printed circuit board as an electromagnetic bandgap structure. Here, various electrical devices or elements are mounted in the printed circuit board.

Abstract: A method of manufacturing a 4-layered printed circuit board by one-time stacking process is disclosed. In particular, the printed circuit board manufacturing method includes adhering copper clad laminates (CCL) to both surfaces of a foam tape; forming an inner layer circuit pattern on one of both copper thin layers of the CCL, the one copper thin layer being not adhered to the foam tape; separating the CCL from the foam tape; arranging the copper thin layer in which the inner layer circuit pattern is formed to face a prepreg; compressing the CCL into the prepreg; and forming an outer layer circuit pattern on one of both copper thin layers of the CCL, the one copper thin layer being in no contact with the prepreg.

Abstract: An electromagnetic bandgap structure and a printed circuit board that intercepts to transfer a signal having a predetermined frequency band are disclosed. In particularly, the electromagnetic bandgap structure includes a first metal layer and a second metal layer; a metal plate, placed between the first metal layer and a second metal layer; a multi-via, penetrating the first metal layer, passing through the same planar surface as an outer metal layer and turning toward the first metal layer to connect the metal plate and the first metal layer; and a dielectric layer, stacked in between the first metal layer and the metal plate, between the metal plate and the second metal layer and between the first metal layer and the outer metal layer. With the present invention, a bandgap frequency can be decreased without increasing the size of the metal plate.

Abstract: A method and system of B2C e-commerce for placing an order to purchase fashionable items for minimizing the return rate after selling via the Internet. The order is placed by a first banner window at seller's website for displaying a prerecorded digital video image of a model of the same or similar size of the buyer wearing the clothes that the buyer wants to purchase, and a second banner window for displaying a static digital image of the model for synthesizing the face of model, hair patterns, foot-wear or accessories such as necklace, earrings, hairpin, or sunglasses selected by the buyer from the database of the system. This provides a technology to reduce the return rate by checking the fashionable products whether suitable with the figure and face image of the buyer before placing an order through a cyber fashion show and synthesizing the image for confirming coordination.

Abstract: This invention relates to provide a pedestrian signal system not only for the normal pedestrian but also for the blinds, the disabled person of weak sight, and the illiterates by displaying the remaining time of each signal change in image figures at the signal head and by generating voice signal in real time. It reduces the cost of the system fabrication, installation and maintenance of the system by combining the five functions of the pedestrian signals such as a walk signal, a stop signal, a remaining time of each signal of red/green and/or the voice generator for blinds in a one signal head. Also, this invention provides the useful double safety traffic signal system especially for a school zone by installing LED studs on the stop line at crossroad for warning to drivers by blinking the LED studs automatically when the walk signal is on-mode.

Abstract: An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, connecting the first metal layer to the metal plate; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer. Here, a hole can be formed on the metal plate. With the present invention, the electromagnetic bandgap structure can lower a noise level more within the same frequency band as compared with other structures having the same size.

Abstract: An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

Abstract: An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a metal layer; and a plurality of mushroom type structures including a metal plate and a via. Here, the plurality of mushroom type structures can be formed on the metal layer in a stacked structure. With the present invention, the small sized electromagnetic bandgap structure can have a lower bandgap frequency.

Abstract: Disclosed are an electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit. The electromagnetic bandgap structure in which a first metal layer, a first dielectric layer, a second dielectric layer and a second metal layer are stacked can include a first metal plate, formed between the first dielectric layer and the second dielectric layer; a second metal plate, formed on a same planar surface as the first metal plate, accommodated into a hole which is formed in the first metal plate and electrically connected to the first metal plate through a metal line; and a via, connecting the second metal plate to any one of the first metal layer and the second metal layer. With the present invention, the electromagnetic bandgap structure can be not only miniaturized but also have a low bandgap frequency.

Abstract: Provided is a method for bonding a gold foil. The method includes coating a lower primer adhesive layer on a surface of an object and drying the coated lower primer adhesive layer; adhering and bonding a thin gold foil onto the lower primer adhesive layer; coating an upper primer adhesive layer on the bonded gold foil and processing the coated upper primer adhesive layer by surface curing; and forming a coating layer on the upper primer adhesive layer that is coated on the gold foil.

Abstract: An electrotherapeutic device for simultaneously generating positive, negative, or multiple polarities. The device includes a power source section and pulse generating sections for inputting prescribed high-voltage oscillating frequency signals to bipolar output sections. The bipolar output section can select poles according to a switching operation after amplifying and waveform-shaping the signals emitted from the pulse generating sections. Also, the device includes an operating time controlling section with alarm function. Thus, the bipolar electrotherapeutic device pulses currents of positive(+) and negative(?) poles or multiple poles(+, ?, +, ?, +) without short circuiting to allow for safe use in seeking abnormal areas in a human body to control and remove accumulated anions and cations.

Abstract: Disclosed herein is a Printed Circuit Board (PCB) having connectors. The PCB includes a terminal part and a connector pin. The terminal part is formed in one end of the PCB and is provided with a terminal hole. The connector pin is configured such that one end thereof is inserted into the terminal hole, and the remaining end thereof extends to protrude outside the terminal hole and is also bent several times, thus forming a contact part that is elastically deformed, and electrically connected to a pad part provided in a target PCB for connection. Thus, a desirable signal transmission characteristic is guaranteed, so that the reliability of electronic devices using the PCB can be improved and the manufacturing cost can also be reduced.

Abstract: A computer program, system and method for micro controller unit (MCU) application program verification may provide source code program level debugging using different versions of debugging information files. The MCU application program verification may simultaneously debug information created by different versions of development tools, assign a highest priority to a debugging information file corresponding to a most recently updated source code program, and construct a corresponding debugging information data structure. Previously debugged source code programs and recently updated source code programs may be simultaneously debugged without changing images corresponding to the already debugged source code programs.

Abstract: An apparatus relating to a human-body potential controlling electrotherapeutic device is disclosed herein. The device includes a power source section and pulse generating sections for inputting prescribed high-voltage oscillating frequency signals to bipolar output sections. The bipolar output section can select poles according to a switching operation after amplifying and waveform-shaping the signals emitted from the pulse generating sections. Also, the device includes an operating time controlling section with alarm function. Thus, the bipolar electrotherapeutic device pulses currents of positive(+) and negative(−) poles or multiple poles(+, −, +, −, +) without short circuiting to allow for safe use in seeking abnormal areas in a human body to control and remove accumulated anions and cations.