Abstract: A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.

Abstract: A rotary bearing assembly is disclosed and includes an input shaft, an inner-ring component, an outer-ring component and a load element. The input shaft is configured to combine a rotating shaft of a motor to provide a power input. The inner-ring component includes a gear set, wherein the inner-ring component is sleeved on the input shaft through the gear set and driven by the input shaft. The outer-ring component is sleeved on the inner-ring component through a load element and engaged with the gear set, wherein when the gear set is driven by the input shaft to drive the inner-ring component, the gear set drives the outer-ring component, and the inner-ring component and the outer-ring component are rotated relatively, wherein one of the inner-ring component and the outer-ring component is served to provide a power output, and a rotational speed difference is between the power input and the power output.

Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

Abstract: The present application relates to the technical field of road infrastructure, and provides a cement-based pervious pavement structure, a manufacturing method of the cement-based pervious pavement structure, and an application of the cement-based pervious pavement structure. The cement-based pervious pavement structure includes: a lower structural layer as the base; an upper surfacing layer overlaid on said lower structural layer and including: 1.0-2.0 parts by weight of upper layer (fine) aggregate; 0.40-0.70 part by weight of cement; 0.02-0.03 part by weight of titanium dioxide; 0.03-0.04 part by weight of water reducing agent; 0.001-0.002 part by weight of defoamer. The cement-based pervious pavement structure provided by the present application can provide air purification function taking into account the practical cost.

Abstract: A wafer lift pin system is capable of dynamically modulating or adjusting the flow of gas into and out of lift pins of the wafer lift pin system to achieve and maintain a consistent pressure in supply lines that supply the gas to the lift pins. This enables the wafer lift pin system to precisely control the speed, acceleration, and deceleration of the lift pins to achieve consistent and repeatable lift pin rise times and fall times. A controller and various sensors and valves may control the gas pressures in the wafer lift pin system based on various factors, such as historic rise times, historic fall times, and/or the condition of the lift pins. This enables smoother and more controlled automatic operation of the lift pins, which reduces and/or minimizes wafer shifting and wafer instability, which may reduce processing defects and maintain or improve processing yields.

Abstract: A method includes initiating a gas flow of a first gas parallel to a wall of an interface module to create an air curtain across an opening defined in the wall. The method includes moving an interface door to reveal the opening, wherein the air curtain restrains a second gas within the interface module from passing through the opening. The method includes transferring a semiconductor wafer through the opening and moving the interface door to cover the opening. The method includes halting the gas flow of the first gas after moving the interface door to cover the opening.

Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

Abstract: A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.

Abstract: A head mounted display device including a host, a first bracket and a second bracket is provided. The opposite sides of the host respectively have a first connection port and a second connection port. The first bracket is detachably and electrically connected to the first connection port. The second bracket is detachably connected to the second connection port.

Abstract: A head-mounted display device includes a body, two adjustment rings, and a face gasket. The body has two zoom lens groups corresponding to both eyes. The two adjustment rings are used to be detachably assembled to the corresponding zoom lens group, respectively. The face gasket is used to be detachably assembled to the body and used to contact a user's face. The face gasket has two adjustment knobs. Each of the adjustment knobs is used to couple the corresponding adjustment ring and rotate the corresponding zoom lens group for zooming, and a part of the each of the adjustment knobs is exposed to the outside for the user to manipulate.

Abstract: A head mounted display device including a host, two brackets, and two rotating components is provided. The two brackets are respectively pivotally connected to opposite sides of the host. Each bracket includes a first segment and a second segment. The first segment is pivotally connected to the second segment, and the first segment is pivotally connected to the host. The two rotating components are respectively assembled to the first segment and the second segment of each bracket to control an angle between the first segment and the second segment.

Abstract: A method of manufacturing a casing of an electronic device including the following steps is provided. A metallic housing is provided, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface and includes a back region and at least one side region. At least one gap, a plurality of apertures and a non-conductive layer are formed on the inner surface of the metallic housing, wherein the apertures is formed on a surface of the at least one gap, part of the non-conductive layer is formed in the at least one gap and extended from the back region to the at least one side region, and part of the non-conductive layer is extended into the apertures. Part of the metallic housing is removed for exposing part of the non-conductive layer, thereby forming a plurality of non-conductive spacers located in the at least one gap.

Abstract: A voice reception device includes a casing and at least two voice reception units. The casing includes a peripheral side wall, a bottom wall, a containing space formed in an inside of the peripheral side wall and the bottom wall, and a first opening end located at an end of the containing space. The voice reception units are disposed in the containing space. Each of the voice reception units includes a main body, a diaphragm, and a voice guiding channel. The main body has a chamber, and an end of the chamber has a second opening end. The diaphragm is connected to the second opening end of the main body. The voice guiding channel includes an importing end acoustically connected to the chamber and an exporting end opposite to the importing end and acoustically connected to a microphone.

Abstract: A case assembly and a wireless communication device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side, the metal case includes a hollow portion and an antenna portion, the hollow portion is adjacent to a side of the antenna portion. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case, partially covers the inner side of the metal case, and fills the hollow portion. The wireless communication device includes a case assembly and a radio frequency signal module. The radio frequency signal module is electrically connected to the antenna portion of the case assembly. Thus, the structural rigidity of the wireless communication device and its case assembly is kept, and the production cost is reduced.

Abstract: A neck-mounted power bank is suitable for being hung on a user's neck to supply power to an electronic device. The neck-mounted power bank includes a body, a battery, and a pair of adjustable assemblies. The battery is disposed in the body. The pair of adjustable assemblies are respectively connected to two ends of the body, and define a wearing space with the body. The pair of adjustable assemblies can be rotated relative to the body so as to adjust the size of the wearing space. Each of the pair of adjustable assemblies includes a rotate arm and an angle arm. The rotate arm is rotatably connected to a corresponding end of the body. The angle arm is connected to the rotate arm and has a contact surface. The contact surface is suitable for contacting the user's neck.

Abstract: A neck-mounted power bank includes a neck-mounted portion, a first body and a second body. The first body is connected to an end of the neck-mounted portion. The second body is connected to another end of the neck-mounted portion. The neck-mounted portion, the first body and the second body define a wearing space. The first body includes a first tray and a first controller. The first tray is connected to the neck-mounted portion. The first controller is detachable and electrically connected to the first tray, and has a first controller battery. When the first controller is installed and electrically connected to the first tray, the first controller battery can supply power to an electronic device through the first tray. When the first controller is detached from the first tray, the first controller can control the electronic device wirelessly.

Abstract: A voice reception device includes a casing and at least two voice reception units. The casing includes a peripheral side wall, a bottom wall, a containing space formed in an inside of the peripheral side wall and the bottom wall, and a first opening end located at an end of the containing space. The voice reception units are disposed in the containing space. Each of the voice reception units includes a main body, a diaphragm, and a voice guiding channel. The main body has a chamber, and an end of the chamber has a second opening end. The diaphragm is connected to the second opening end of the main body. The voice guiding channel includes an importing end acoustically connected to the chamber and an exporting end opposite to the importing end and acoustically connected to a microphone.

Abstract: A method of manufacturing a casing of an electronic device including the following steps is provided. A metallic housing is provided, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface and includes a back region and at least one side region. At least one gap, a plurality of apertures and a non-conductive layer are formed on the inner surface of the metallic housing, wherein the apertures is formed on a surface of the at least one gap, part of the non-conductive layer is formed in the at least one gap and extended from the back region to the at least one side region, and part of the non-conductive layer is extended into the apertures. Part of the metallic housing is removed for exposing part of the non-conductive layer, thereby forming a plurality of non-conductive spacers located in the at least one gap.

Abstract: A metallic housing of an electronic device including an inner surface, an outer surface and a first non-conductive spacer is provided. The outer surface is opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing having a first gap and a second gap substantially located at two opposite ends of the metallic housing and being parallel with each other. The first gap and the second gap each communicates the inner surface and the outer surface. The first non-conductive spacer is disposed the first gap of the metallic housing.

Abstract: A case assembly and an electronic device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side. The metal case further includes a channel which is concavely disposed on the inner side to divide the inner side into a plurality of thermal insulation areas. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case. The electronic device includes a case assembly and a plurality of heart sources. The heart sources are corresponded to the thermal insulation areas on the inner side of the metal case respectively. Thus, the case assembly and the electronic device are able to prevent the heat produced from elements effect each other.