Patents by Inventor In-Lung Chu

In-Lung Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220354007
    Abstract: A method of manufacturing a casing of an electronic device including the following steps is provided. A metallic housing is provided, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface and includes a back region and at least one side region. At least one gap, a plurality of apertures and a non-conductive layer are formed on the inner surface of the metallic housing, wherein the apertures is formed on a surface of the at least one gap, part of the non-conductive layer is formed in the at least one gap and extended from the back region to the at least one side region, and part of the non-conductive layer is extended into the apertures. Part of the metallic housing is removed for exposing part of the non-conductive layer, thereby forming a plurality of non-conductive spacers located in the at least one gap.
    Type: Application
    Filed: July 17, 2022
    Publication date: November 3, 2022
    Applicant: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Patent number: 11457535
    Abstract: A metallic housing of an electronic device including an inner surface, an outer surface and a first non-conductive spacer is provided. The outer surface is opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing having a first gap and a second gap substantially located at two opposite ends of the metallic housing and being parallel with each other. The first gap and the second gap each communicates the inner surface and the outer surface. The first non-conductive spacer is disposed the first gap of the metallic housing.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: September 27, 2022
    Assignee: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Patent number: 11330734
    Abstract: A case assembly and an electronic device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side. The metal case further includes a channel which is concavely disposed on the inner side to divide the inner side into a plurality of thermal insulation areas. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case. The electronic device includes a case assembly and a plurality of heart sources. The heart sources are corresponded to the thermal insulation areas on the inner side of the metal case respectively. Thus, the case assembly and the electronic device are able to prevent the heat produced from elements effect each other.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: May 10, 2022
    Assignee: HTC CORPORATION
    Inventors: Chih-Kuang Wang, Chin Kai Sun, Chun-Lung Chu, Tung-Hsin Yeh
  • Publication number: 20220075192
    Abstract: A glasses type display device including a front end assembly and a pair of legs is provided. Each of the pair of legs includes a front segment, a rear segment, a torsion mechanism, and a rotation mechanism. The torsion mechanism is disposed between the front end assembly and the front segment. The rotation mechanism is disposed between the front segment and the rear segment.
    Type: Application
    Filed: June 18, 2021
    Publication date: March 10, 2022
    Applicant: HTC Corporation
    Inventors: Tung-Hsin Yeh, Ching-Ho Li, Wei-Cheng Liu, Chun-Lung Chu
  • Publication number: 20220075198
    Abstract: A glasses type display device includes a front end assembly, a pair of legs and a light-shielding mask. Each of the pair of legs includes a front segment and a rear segment. The front segment is coupled to the front end assembly. The rear segment is pivotally connected to the corresponding front segment on an axis. The light-shielding mask includes a frame and a cover. The frame is connected to the front end assembly. The cover has flexibility and is connected to the frame to cover the eyes of the user. The movement range of the rear segment relative to the corresponding front segment partially overlaps with the cover in space.
    Type: Application
    Filed: June 4, 2021
    Publication date: March 10, 2022
    Applicant: HTC Corporation
    Inventors: Ching-Ho Li, Wei-Cheng Liu, Chun-Lung Chu
  • Publication number: 20210392212
    Abstract: A case assembly and a wireless communication device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side, the metal case includes a hollow portion and an antenna portion, the hollow portion is adjacent to a side of the antenna portion. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case, partially covers the inner side of the metal case, and fills the hollow portion. The wireless communication device includes a case assembly and a radio frequency signal module. The radio frequency signal module is electrically connected to the antenna portion of the case assembly. Thus, the structural rigidity of the wireless communication device and its case assembly is kept, and the production cost is reduced.
    Type: Application
    Filed: August 9, 2021
    Publication date: December 16, 2021
    Inventors: Chih-Kuang WANG, Chin Kai SUN, Chun-Lung CHU, Tung-Hsin YEH
  • Publication number: 20210378135
    Abstract: A case assembly and an electronic device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side. The metal case further includes a channel which is concavely disposed on the inner side to divide the inner side into a plurality of thermal insulation areas. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case. The electronic device includes a case assembly and a plurality of heart sources. The heart sources are corresponded to the thermal insulation areas on the inner side of the metal case respectively. Thus, the case assembly and the electronic device are able to prevent the heat produced from elements effect each other.
    Type: Application
    Filed: May 28, 2020
    Publication date: December 2, 2021
    Inventors: Chih-Kuang WANG, Chin Kai Sun, Chun-Lung Chu, Tung-Hsin Yeh
  • Patent number: 11115508
    Abstract: A case assembly and a wireless communication device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side, the metal case includes a hollow portion and an antenna portion, the hollow portion is adjacent to a side of the antenna portion. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case, partially covers the inner side of the metal case, and fills the hollow portion. The wireless communication device includes a case assembly and a radio frequency signal module. The radio frequency signal module is electrically connected to the antenna portion of the case assembly. Thus, the structural rigidity of the wireless communication device and its case assembly is kept, and the production cost is reduced.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: September 7, 2021
    Assignee: HTC CORPORATION
    Inventors: Chih-Kuang Wang, Chin Kai Sun, Chun-Lung Chu, Tung-Hsin Yeh
  • Patent number: 10952341
    Abstract: A casing of an electronic device including a metallic housing, a first non-conductive spacer and a second non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing having a first gap and a second gap substantially located at two opposite ends of the metallic housing and being parallel with each other. The first non-conductive spacer is disposed the first gap, and the second non-conductive spacer is disposed in the second gap.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: March 16, 2021
    Assignee: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Publication number: 20210076522
    Abstract: A metallic housing of an electronic device including an inner surface, an outer surface and a first non-conductive spacer is provided. The outer surface is opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing having a first gap and a second gap substantially located at two opposite ends of the metallic housing and being parallel with each other. The first gap and the second gap each communicates the inner surface and the outer surface. The first non-conductive spacer is disposed the first gap of the metallic housing.
    Type: Application
    Filed: November 17, 2020
    Publication date: March 11, 2021
    Applicant: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Patent number: 10923455
    Abstract: The present disclosure is directed to a method for preparing a semiconductor apparatus having a plurality of bonded semiconductor devices formed by a fusion bonding technique and a method for preparing the same. The method includes the steps of forming a first semiconductor device having a first conductive portion, a first dielectric portion adjacent to the first conductive portion, and a depression at an upper surface of the first conductive portion; forming a second semiconductor device having a second conductive portion and a second dielectric portion adjacent to the second conductive portion; disposing the first semiconductor device and the second semiconductor device in a manner such that the first conductive portion faces the second conductive portion; and expanding at least one of the first conductive portion and the second conductive portion to fill the depression.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: February 16, 2021
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Po-Chun Lin, Chin-Lung Chu
  • Publication number: 20200381747
    Abstract: A formulation of an interconnect of a fuel cell includes chrome powder and chrome-iron alloy powder. A ratio of a sum of chrome in the chrome powder and the chrome-iron alloy powder is in a range between 80% in weight and 95% in weight, and a ratio of a sum of iron in the chrome powder and the chrome-iron alloy powder is in a range between 5% in weight and 20% in weight.
    Type: Application
    Filed: March 24, 2020
    Publication date: December 3, 2020
    Inventors: SHING YIN LIAO, WEI HSUN HSU, WEI PING HUANG, HUEI LONG LEE, CHIU LUNG CHU
  • Patent number: 10825794
    Abstract: The present disclosure is directed to method for preparing a semiconductor apparatus having a plurality of bonded semiconductor devices formed by a fusion bonding technique. The method includes operations of forming a first semiconductor device having a first conductive portion, a first dielectric portion adjacent to the first conductive portion, and a depression at an upper surface of the first conductive portion; forming a second semiconductor device having a second conductive portion and a second dielectric portion adjacent to the second conductive portion; disposing the first semiconductor device and the second semiconductor device in a manner such that the first conductive portion faces the second conductive portion; and expanding at least one of the first conductive portion and the second conductive portion to fill the depression.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: November 3, 2020
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Po-Chun Lin, Chin-Lung Chu
  • Publication number: 20200305297
    Abstract: A casing of an electronic device including a metallic housing, a first non-conductive spacer and a second non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing having a first gap and a second gap substantially located at two opposite ends of the metallic housing and being parallel with each other. The first non-conductive spacer is disposed the first gap, and the second non-conductive spacer is disposed in the second gap.
    Type: Application
    Filed: June 9, 2020
    Publication date: September 24, 2020
    Applicant: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Patent number: 10785893
    Abstract: A heat dissipation module and an electronic device are provided. The heat dissipation module includes a first heat transfer member, a second heat transfer member, and a cooling element. The first heat transfer member has a first end and a second end opposite to the first end. The second heat transfer member has a third end and a fourth end opposite to the third end. The cooling element disposed between the second end and the third end is configured to allow or block the heat transferring between the second end and the third end.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: September 22, 2020
    Assignee: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chun-Lung Chu, Wei-Cheng Liu
  • Patent number: 10729026
    Abstract: A casing of an electronic device including a metallic housing and a first non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing has a first gap communicating the inner surface and the outer surface, and the metallic housing further includes a second gap and at least one connecting terminal. The first non-conductive spacer is selectively disposed in the first gap of the metallic housing, and extends from a first side of the lateral sides of the metallic housing to the back side of the metallic housing.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: July 28, 2020
    Assignee: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Publication number: 20200170143
    Abstract: A heat dissipation module manufacturing method, a heat dissipation module and an electronic device are provided. The heat dissipation module manufacturing method includes the steps: providing a first substrate, the first substrate has a first portion, a second portion, a connecting portion connected to the first portion and the second portion; performing a first etching on a surface of the first substrate to form a plurality of grooves; providing a plurality of second substrates, and bonding the second substrates to the first substrate to cover the grooves and form a plurality of chambers; filling the chambers with a working fluid; and sealing the chambers. The heat dissipation module includes the first substrate, the working fluid, and the second substrates. The electronic device includes the heat dissipation module and a plurality of electronic modules. The first portion and the second portion of the heat dissipation module respectively contact the electronic modules.
    Type: Application
    Filed: May 22, 2019
    Publication date: May 28, 2020
    Applicant: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chun-Lung Chu, Wei-Cheng Liu
  • Patent number: 10667428
    Abstract: A heat dissipation module manufacturing method, a heat dissipation module and an electronic device are provided. The heat dissipation module manufacturing method includes the steps: providing a first substrate, the first substrate has a first portion, a second portion, a connecting portion connected to the first portion and the second portion; performing a first etching on a surface of the first substrate to form a plurality of grooves; providing a plurality of second substrates, and bonding the second substrates to the first substrate to cover the grooves and form a plurality of chambers; filling the chambers with a working fluid; and sealing the chambers. The heat dissipation module includes the first substrate, the working fluid, and the second substrates. The electronic device includes the heat dissipation module and a plurality of electronic modules. The first portion and the second portion of the heat dissipation module respectively contact the electronic modules.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: May 26, 2020
    Assignee: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chun-Lung Chu, Wei-Cheng Liu
  • Publication number: 20200116436
    Abstract: A heat transferring module includes a first conductor plate, a second conductor plate, a working fluid and a reinforcing layer. The second conductor plate is connected to the first conductor plate to form a cavity. The working fluid is located in the cavity. The reinforcing layer is formed on an outer surface of at least one of the first conductor plate and the second conductor plate, wherein at least one of the first conductor plate and the second conductor plate has a capillary structure. The capillary structure is located on an inner surface of at least one of the first conductor plate and the second conductor plate, and a structural strength of the reinforcing layer is greater than a structural strength of the first conductor plate and a structural strength of the second conductor plate. In addition, a manufacturing method of a heat transferring module is also provided.
    Type: Application
    Filed: May 30, 2019
    Publication date: April 16, 2020
    Applicant: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chun-Lung Chu, Wei-Cheng Liu, Tien-Tso Liu, Shuo-Hsiu Chang
  • Patent number: 10607858
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a semiconductor substrate and a first conductive bump. The semiconductor substrate has an integrated circuit and an interconnection metal layer, and a tilt surface is formed on an edge of the semiconductor substrate. The first conductive bump is electrically connected to the integrated circuit via the interconnection metal layer, and is disposed on the tilt surface, wherein a profile of the first conductive bump extends beyond a side surface of the edge of the semiconductor layer.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: March 31, 2020
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Po-Chun Lin, Chin-Lung Chu