Abstract: A semiconductor device package includes a substrate including, on an edge thereof, a connector that is connectable to a host, a nonvolatile semiconductor memory device disposed on a surface of the substrate, a memory controller disposed on the surface of the substrate, an oscillator disposed on the surface of the substrate and electrically connected to the memory controller, and a seal member sealing the nonvolatile semiconductor memory device, the memory controller, and the oscillator on the surface of the substrate.

Abstract: A semiconductor device includes a substrate, a semiconductor memory unit mounted on a surface of the substrate, a memory controller configured to control the semiconductor memory unit and mounted on the surface of the substrate adjacent to the semiconductor memory unit, and a sealing layer disposed on the surface of the substrate and covering the semiconductor memory unit and the memory controller.

Abstract: A semiconductor device includes a substrate, a semiconductor memory unit mounted on a surface of the substrate, a memory controller configured to control the semiconductor memory unit and mounted on the surface of the substrate adjacent to the semiconductor memory unit, and a sealing layer disposed on the surface of the substrate and covering the semiconductor memory unit and the memory controller.

Abstract: According to one embodiment, a data storage device includes a controller driven by a first power supply voltage, a nonvolatile memory controlled by the controller and driven by a second power supply voltage, and a switch element determining whether the second power supply voltage is applied to the nonvolatile memory. The controller is configured to turn off the switch element in a first mode and turn on the switch element in a second mode.

Abstract: A filtering device includes, as a filter membrane, a pleated filter formed of a filter base having folds so as to repeat peak portions and valley portions, the pleated filter having a shape of a cylinder whose axial direction is a ridge line direction of the folds. In the filtering device, the pleated filter is rotatable about a cylindrical axis of the shape of the cylinder. The filtering device includes a nozzle that is provided so as to face an outer circumferential surface of the pleated filter and that ejects a liquid toward the outer circumferential surface.

Abstract: A semiconductor device includes a substrate, a sealing portion, a controller, a semiconductor chip, and a plurality of differential signal balls. The substrate has a first surface and a second surface positioned on a side opposite to the first surface. The sealing portion is formed on the first surface of the substrate. The controller is covered with the sealing portion. The semiconductor chip is electrically connected to the controller, and is covered with the sealing portion. The plurality of differential signal balls are formed on the second surface of the substrate. At least some of the plurality of differential signal balls are arranged substantially parallel to one side of the substrate.

Abstract: A semiconductor device includes a printed circuit board having a first surface and a second surface on a side opposite to the first surface. First pads are on the first surface of the printed circuit board. An interface part is mounted on the printed circuit board via the first pads and is configured to transfer a signal between the interface part and a host device. Second pads are also on the first surface and insulated from the interface part. A semiconductor memory and a controller are mounted on the first surface. First solder balls electrically connect the first pads and the controller. Second solder balls electrical connect the second pads and the controller. A plurality of third pads are disposed on the second surface and electrically connected to the second pads allowing direct connections to the controller and memory via the second pads.

Abstract: According to the embodiments, there are provided semiconductor memories that are mounted individually on two sides of a mounting board; a controller that is mounted either on an obverse side or a reverse side of the mounting board, and performs read and write control of the semiconductor memories; and a connector that is deviated in a lateral direction from the controller so as not to overlap the controller, is mounted either on the obverse side or the reverse side of the mounting board, and transfers a signal exchanged between the controller and outside.

Abstract: A ballast water treatment apparatus includes a cylindrical pleated filter that is rotatably held about an axis of a cylinder, a driving mechanism that rotates the pleated filter, an untreated water nozzle that ejects untreated water toward an outer circumferential surface of the pleated filter, a case that is provided so as to surround the pleated filter and that includes an outer cylindrical portion including a nozzle opening of the untreated water nozzle therein, a filtered water flow path that guides filtered water that has permeated through the pleated filter from the inside of the cylinder of the pleated filter to the outside of the case, and a discharge flow path that discharges discharged water that has not been filtered by the pleated filter to the outside of the case. The ballast water treatment apparatus further includes a reverse cleaning mechanism that supplies cleaning water to the inside of the cylinder of the pleated filter through the filtered water flow path.

Abstract: According to the embodiments, there are provided semiconductor memories that are mounted individually on two sides of a mounting board; a controller that is mounted either on an obverse side or a reverse side of the mounting board, and performs read and write control of the semiconductor memories; and a connector that is deviated in a lateral direction from the controller so as not to overlap the controller, is mounted either on the obverse side or the reverse side of the mounting board, and transfers a signal exchanged between the controller and outside.

Abstract: According to one embodiment, a semiconductor module includes a semiconductor chip that is mounted on a printed substrate, a terminal electrode that is formed on the printed substrate so as to be electrically connected to the semiconductor chip, a metal coating layer that is formed on the terminal electrode, a plating lead wire that is electrically connected to the terminal electrode, and a gap that is formed in the plating lead wire.

Abstract: According to one embodiment, a semiconductor package includes a package substrate, a controller chip, a semiconductor memory chip, a temperature sensor, a seal portion, and a plurality of solder balls. The controller chip and the semiconductor memory chip are provided on a first surface of the package substrate. The temperature sensor is provided at a position along an edge of the first surface, which is at a center portion separated away from corner portions. The plurality of solder balls is provided on a second surface that is at an opposite side of the first surface.

Abstract: A semiconductor device includes a semiconductor chip with bonding pads, the bonding pads being arranged along one side of an element forming surface of the semiconductor chip, a lead frame including first and second internal leads arranged such that tips thereof correspond to some of the bonding pads of the semiconductor chip, and first and second bonding wires by which the first internal leads and the some of the bonding pads are bonded to each other. The semiconductor device further includes a hanging pin section provided on the element non-forming surface of the semiconductor chip, and a sealing member with which the semiconductor chip is sealed including the hanging pin section and a bonding section between the first and second internal leads and the first and second bonding wires.

Abstract: A semiconductor device includes a substrate, a sealing portion, a controller, a semiconductor chip, and a plurality of differential signal balls. The substrate has a first surface and a second surface positioned on a side opposite to the first surface. The sealing portion is formed on the first surface of the substrate. The controller is covered with the sealing portion. The semiconductor chip is electrically connected to the controller, and is covered with the sealing portion. The plurality of differential signal balls are formed on the second surface of the substrate. At least some of the plurality of differential signal balls are arranged substantially parallel to one side of the substrate.

Abstract: According to one embodiment, a semiconductor device includes a board, a sealing portion, a controller, a semiconductor chip, and solder balls. The board includes a first surface and a second surface opposite to the first surface. The controller and the semiconductor chip are covered with the sealing portion. The solder balls are on the second surface of the board. The solder balls include a plurality of solder ball sets each corresponding to a pair of differential input and differential output signals, and the plurality of solder ball sets are arranged substantially parallel to a side of the board.

Abstract: According to one embodiment, a semiconductor package includes a substrate with first and second pad, first semiconductor chip above the substrate, first wire, first mold member, second semiconductor chip above the first mold member, third semiconductor chip above the second semiconductor chip, second wire, and a second mold member. The first wire electrically connects the first pad and the first semiconductor chip. The first mold member seals the first wire and the first semiconductor chip. The second wire electrically connects the second pad and the second semiconductor chip. The second mold member seals the second wire, the second and the third semiconductor chips, and the first mold member.

Abstract: A semiconductor device includes a semiconductor chip with bonding pads, the bonding pads being arranged along one side of an element forming surface of the semiconductor chip, a lead frame including first and second internal leads arranged such that tips thereof correspond to some of the bonding pads of the semiconductor chip, and first and second bonding wires by which the first internal leads and the some of the bonding pads are bonded to each other. The semiconductor device further includes a hanging pin section provided on the element non-forming surface of the semiconductor chip, and a sealing member with which the semiconductor chip is sealed including the hanging pin section and a bonding section between the first and second internal leads and the first and second bonding wires.