Patents by Inventor Itaru Kanno
Itaru Kanno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240047234Abstract: A substrate processing apparatus includes: a holding unit, a processing cup, a first supply unit, a second supply unit, a drain unit, and a first measurement unit. The holding unit holds a substrate. The processing cup is provided around the holding unit. The first supply unit supplies a chemical liquid to the substrate held by the holding unit. The second supply unit supplies a rinse liquid or a drying liquid to the substrate held by the holding unit. The drain unit is provided at the bottom of the processing cup, and is connected to a drain line and a recovery line via a line switch. The first measurement unit is provided in the drain unit, and measures the purity of the rinse liquid or the drying liquid.Type: ApplicationFiled: July 27, 2023Publication date: February 8, 2024Inventors: Yosuke HACHIYA, Itaru KANNO, Mitsunori NAKAMORI, Hirofumi TAKEGUCHI
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Publication number: 20230264233Abstract: A liquid processing apparatus includes: a storage tank that stores a processing liquid; a first circulation line that causes the processing liquid sent from the storage tank to pass through a first filter and to return to the storage tank; and at least one second circulation line that causes the processing liquid to pass through a second filter and to return to the storage tank, wherein the second circulation line is shorter in a flow path than the first circulation line, a second flow rate of the processing liquid flowing into the second circulation line is smaller than a first flow rate of the processing liquid flowing into the first circulation line at a downstream side of a location where the first circulation line and the second circulation line are joined, and the second filter is smaller in a filtration amount per unit time than the first filter.Type: ApplicationFiled: June 22, 2021Publication date: August 24, 2023Inventors: Kazuki KOSAI, Taisei INOUE, Yusuke TAKAMATSU, Takahisa OTSUKA, Masaru AMAI, Itaru KANNO, Hiroshi YANO
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Publication number: 20220277968Abstract: A method for cleaning a substrate includes supplying, to a substrate which does not have a resist formed thereon, a film-forming processing liquid which includes a volatile component and forms a processing film, volatilizing the volatile component of the film-forming processing liquid such that the film-forming processing liquid on the substrate is solidified or cured and that the processing film is formed on the substrate, heating a peeling processing liquid which peels off the processing film from the substrate without dissolving the processing film such that a heated peeling processing liquid is prepared, and supplying, to the processing film formed on the substrate, the heated peeling processing liquid such that the heated peeling processing liquid peels off the processing film from the substrate without dissolving the processing film.Type: ApplicationFiled: May 17, 2022Publication date: September 1, 2022Applicant: TOKYO ELECTRON LIMITEDInventors: Miyako KANEKO, Keiji TANOUCHI, Takehiko ORII, Itaru KANNO, Meitoku AIBARA, Satoru TANAKA
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Patent number: 11367630Abstract: A method for cleaning a substrate includes supplying to a substrate on which a resist layer is not formed a film-forming processing liquid which includes a volatile component and forms a film on the substrate, forming a processing film on the substrate by solidifying or curing the film-forming processing liquid supplied on the substrate, and supplying to the substrate having the processing film a strip-processing liquid which strips the processing film from the substrate.Type: GrantFiled: August 31, 2020Date of Patent: June 21, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Miyako Kaneko, Keiji Tanouchi, Takehiko Orii, Itaru Kanno, Meitoku Aibara, Satoru Tanaka
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Patent number: 11201050Abstract: A substrate processing method capable of suppressing particles from remaining on a surface of a substrate is provided. In the substrate processing method, a liquid film of a protection liquid is formed on the surface of the substrate, and the substrate is dried by using a supercritical fluid so that the protection liquid is removed from the surface of the substrate. After the substrate is dried, the particles remaining on the surface of the substrate is removed.Type: GrantFiled: May 14, 2019Date of Patent: December 14, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Itaru Kanno, Hiromi Kiyose, Gentaro Goshi, Naohiko Hamamura, Takuro Masuzumi, Kenji Sekiguchi, Satoru Tanaka, Teruomi Minami
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Substrate cleaning apparatus, substrate cleaning system, substrate cleaning method and memory medium
Patent number: 10998183Abstract: A method for cleaning a substrate includes setting a substrate inside a cleaning chamber, supplying on a surface of the substrate a treatment solution which includes a volatile component and forms a treatment film, vaporizing the volatile component of the treatment solution supplied on the surface of the substrate such that the treatment solution solidifies or is cured on the surface of the substrate and the treatment film is formed on the surface of the substrate, and supplying onto the treatment film formed on the surface of the substrate a removal solution which removes the treatment film.Type: GrantFiled: February 11, 2016Date of Patent: May 4, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Miyako Kaneko, Takehiko Orii, Satoru Shimura, Masami Yamashita, Itaru Kanno -
Publication number: 20200395230Abstract: A method for cleaning a substrate includes supplying to a substrate on which a resist layer is not formed a film-forming processing liquid which includes a volatile component and forms a film on the substrate, forming a processing film on the substrate by solidifying or curing the film-forming processing liquid supplied on the substrate, and supplying to the substrate having the processing film a strip-processing liquid which strips the processing film from the substrate.Type: ApplicationFiled: August 31, 2020Publication date: December 17, 2020Applicant: TOKYO ELECTRON LIMITEDInventors: Miyako KANEKO, Keiji TANOUCHI, Takehiko ORII, Itaru KANNO, Meitoku AIBARA, Satoru Satoru
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Patent number: 10835908Abstract: Productivity can be improved. A substrate processing method includes a processing liquid supplying process of supplying a processing liquid, which contains a volatile component and forms a film on a substrate, onto the substrate on which a pre-treatment, which requires atmosphere management or time management after the pre-treatment, is performed; and an accommodating process of accommodating, in a transfer container, the substrate on which the processing liquid is solidified or cured by volatilization of the volatile component.Type: GrantFiled: May 24, 2018Date of Patent: November 17, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Miyako Kaneko, Takehiko Orii, Itaru Kanno
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Patent number: 10811283Abstract: A method for cleaning a substrate includes supplying to a substrate a film-forming processing liquid which includes a volatile component and forms a film on the substrate, vaporizing the volatile component in the film-forming processing liquid such that the film-forming processing liquid solidifies or cures on the substrate and forms a processing film on the substrate, supplying to the substrate having the processing film a strip-processing liquid which strips the processing film from the substrate, and supplying to the processing film formed on the substrate a dissolving-processing liquid which dissolves the processing film after the supplying of the strip-processing liquid.Type: GrantFiled: February 26, 2018Date of Patent: October 20, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Miyako Kaneko, Keiji Tanouchi, Takehiko Orii, Itaru Kanno, Meitoku Aibara, Satoru Tanaka
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Patent number: 10792711Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment comprises a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, wherein the treatment film comprises an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.Type: GrantFiled: December 11, 2018Date of Patent: October 6, 2020Assignee: Tokyo Electron LimitedInventors: Meitoku Aibara, Yuki Yoshida, Hisashi Kawano, Masami Yamashita, Itaru Kanno, Kenji Mochida, Motoyuki Shima
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Patent number: 10734255Abstract: A substrate cleaning method includes supplying, onto a substrate, a film-forming processing liquid including a volatile component and a polar organic material that forms a processing film on the substrate, volatilizing the volatile component such that the film-forming processing liquid solidifies or cures and forms the processing film on the substrate, supplying, to the processing film formed on the substrate, a peeling processing liquid that peels off the processing film from the substrate and includes a non-polar solvent, and supplying, to the processing film, a dissolution processing liquid that dissolves the processing film and includes a polar solvent after the supplying of the peeling processing liquid. The non-polar solvent does not contain water, and the polar solvent does not contain water.Type: GrantFiled: May 18, 2017Date of Patent: August 4, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Kenji Sekiguchi, Itaru Kanno, Meitoku Aibara, Kouzou Tachibana
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Publication number: 20190355574Abstract: A substrate processing method capable of suppressing particles from remaining on a surface of a substrate is provided. In the substrate processing method, a liquid film of a protection liquid is formed on the surface of the substrate, and the substrate is dried by using a supercritical fluid so that the protection liquid is removed from the surface of the substrate. After the substrate is dried, the particles remaining on the surface of the substrate is removed.Type: ApplicationFiled: May 14, 2019Publication date: November 21, 2019Inventors: Itaru Kanno, Hiromi Kiyose, Gentaro Goshi, Naohiko Hamamura, Takuro Masuzumi, Kenji Sekiguchi, Satoru Tanaka, Teruomi Minami
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Patent number: 10272478Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment includes a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, the treatment film includes an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.Type: GrantFiled: July 27, 2015Date of Patent: April 30, 2019Assignee: Tokyo Electron LimitedInventors: Meitoku Aibara, Yuki Yoshida, Hisashi Kawano, Masami Yamashita, Itaru Kanno, Kenji Mochida, Motoyuki Shima
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Publication number: 20190118227Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment comprises a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, wherein the treatment film comprises an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.Type: ApplicationFiled: December 11, 2018Publication date: April 25, 2019Applicant: Tokyo Electron LimitedInventors: Meitoku AIBARA, Yuki Yoshida, Hisashi Kawano, Masami Yamashita, Itaru Kanno, Kenji Mochida, Motoyuki Shima
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Patent number: 10242889Abstract: Disclosed is a substrate liquid processing method. The method includes producing a processing liquid including deionized water, carbon dioxide, and ammonia, which has a PH of a predetermined value in a range of pH 5 to 9; and processing a substrate having a metal exposed, using the processing liquid.Type: GrantFiled: August 18, 2015Date of Patent: March 26, 2019Assignee: Tokyo Electron LimitedInventors: Jun Nonaka, Itaru Kanno
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Patent number: 10083845Abstract: Provided is a substrate processing apparatus, in which a processing liquid is supplied to a substrate W held horizontally by a substrate holding unit. A processing liquid passing portion includes a passing surface that is provided between the substrate W and a recovery cup provided around the substrate W such that the processing liquid flows on the passing surface. Light for concentration detection is projected from a light projection unit to the passing surface, and a concentration detection unit detects a concentration of the processing liquid based on a result of receiving the reflected light of the light by a light receiving unit.Type: GrantFiled: January 25, 2016Date of Patent: September 25, 2018Assignee: Tokyo Electron LimitedInventor: Itaru Kanno
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Publication number: 20180264492Abstract: Productivity can be improved. A substrate processing method includes a processing liquid supplying process of supplying a processing liquid, which contains a volatile component and forms a film on a substrate, onto the substrate on which a pre-treatment, which requires atmosphere management or time management after the pre-treatment, is performed; and an accommodating process of accommodating, in a transfer container, the substrate on which the processing liquid is solidified or cured by volatilization of the volatile component.Type: ApplicationFiled: May 24, 2018Publication date: September 20, 2018Inventors: Miyako Kaneko, Takehiko Orii, Itaru Kanno
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Patent number: 10043652Abstract: A method for cleaning a substrate, includes supplying to a substrate having a hydrophilic surface a film-forming processing liquid which includes a volatile component and forms a film on the substrate, vaporizing the volatile component in the film-forming processing liquid such that the film-forming processing liquid solidifies or cures on the substrate and forms a processing film on the hydrophilic surface of the substrate, and supplying to the substrate having the processing film a strip-processing liquid for stripping the processing film from the substrate.Type: GrantFiled: November 12, 2014Date of Patent: August 7, 2018Assignee: TOKYO ELECTRON LIMITEDInventors: Miyako Kaneko, Keiji Tanouchi, Takehiko Orii, Itaru Kanno
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Patent number: 9953826Abstract: A method for cleaning a substrate includes supplying to a substrate a film-forming processing liquid which includes a volatile component and forms a film on the substrate, vaporizing the volatile component in the film-forming processing liquid such that the film-forming processing liquid solidifies or cures on the substrate and forms a processing film on the substrate, supplying to the substrate having the processing film a strip-processing liquid which strips the processing film from the substrate, and supplying to the processing film formed on the substrate a dissolving-processing liquid which dissolves the processing film after the supplying of the strip-processing liquid.Type: GrantFiled: November 12, 2014Date of Patent: April 24, 2018Assignee: TOKYO ELECTRON LIMITEDInventors: Miyako Kaneko, Keiji Tanouchi, Takehiko Orii, Itaru Kanno, Meitoku Aibara, Satoru Tanaka
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Publication number: 20170345685Abstract: A substrate cleaning method includes supplying, onto a substrate, a film-forming processing liquid including a volatile component and a polar organic material that forms a processing film on the substrate, volatilizing the volatile component such that the film-forming processing liquid solidifies or cures and forms the processing film on the substrate, supplying, to the processing film formed on the substrate, a peeling processing liquid that peels off the processing film from the substrate and includes a non-polar solvent, and supplying, to the processing film, a dissolution processing liquid that dissolves the processing film and includes a polar solvent after the supplying of the peeling processing liquid. The non-polar solvent does not contain water, and the polar solvent does not contain water.Type: ApplicationFiled: May 18, 2017Publication date: November 30, 2017Applicant: TOKYO ELECTRON LIMITEDInventors: Kenji SEKIGUCHI, Itaru KANNO, Meitoku AIBARA, Kouzou TACHIBANA