Abstract: Provided are a semiconductor package and a semiconductor package module including the same. The semiconductor package may include a plurality of semiconductor chips, a plurality of leads connected to pads of the semiconductor chips and externally exposed, wherein the plurality of leads may be classified into a plurality of pin groups, and the plurality of semiconductor chips may be classified into a plurality of chip groups, and the pads of the semiconductor chips of like chip groups may be connected to the leads of like pin groups.

Abstract: An inexpensive method of manufacturing a semiconductor package using a redistribution substrate that is relatively thin. The method includes: attaching a semiconductor chip to a redistribution substrate; attaching the redistribution substrate to which the semiconductor chip is attached to a printed circuit board; removing a support substrate of the redistribution substrate; forming via holes to expose a bond pad of the semiconductor chip and a bond finger of the printed circuit board; and filling the via holes with a conductive material. Meanwhile, a redistribution substrate to which at least one other semiconductor chip may be mounted on the redistribution substrate.

Abstract: A touch screen panel includes a window having one curved surface and mounted on a front surface of a display element. A touch screen element is attached to the curved surface of the window, wherein the touch screen element is processed to have a curvature corresponding to a curvature of the curved surface of the window prior to being attached to the curved surface of the window. The touch screen panel operates in a resistive scheme and can be mounted on the window shaped like a curve. The invention makes it possible to manufacture the information device having various designs in accordance with consumer demands yet retaining a low cost.

Abstract: An organic electroluminescence device includes an array element divided into sub-pixels and including thin film transistors formed in the sub-pixels; a color conversion portion disposed below a second substrate and including a red (R), green (G) and blue (B) conversion layer for converting white light into three primary colors of red (R), green (G) and blue (B); a first electrode disposed below the color conversion portion and including a transparent conductive material; an organic EL layer disposed below the first electrode in the sub-pixels and including a plurality of stack units each including a charge generation layer, an electrode transporting layer, a hole transporting layer and an emission layer; a second electrode patterned below the organic EL layer in the sub-pixels; and a conductive spacer electrically connecting the thin film transistors with the second electrode.

Abstract: Disclosed herein is a system and method for providing a packet network-based MRBT service. In the method, when an originating MSC (110) requests call termination location information from an HLR (120), the HLR transmits an MRBT service request message, including a calling number and a called number, to an MRBT server (140). The MRBT server returns an MRBT service response message, including URL of MRBT content, to the HLR. The HLR transmits a call termination location information response message to the originating MSC, with MRBT service ID information and called party MRBT content URL information included in the call termination location information response message. The originating MSC (110) transmits called party MRBT content URL information to an originating MS (100) on a basis of the MRBT service ID information. The originating MS accesses the MRBT content URL, downloads relevant MRBT content, and plays and stores the MRBT content.

Abstract: An apparatus and a method of manufacturing a semiconductor package are provided. A die attaching process and/or a wire bonding process for first and second surfaces of a lead frame are sequentially performed inside one equipment. Thus, time required for a semiconductor packaging process decreases and yield is increased.

Abstract: Provided are an organic electroluminescence display device and method of fabricating the same. An organic electroluminescence display device according to the present invention includes a first substrate; a plurality of data lines arranged in a first direction on the first substrate; a plurality of gate lines arranged in a second direction on the first substrate; a plurality of pixel regions defined by the gate lines and the data lines, wherein a first pixel line is defined as a line of the pixel regions arranged in the first direction and a second pixel line is defined as a line of the pixel regions arranged in the second direction; a thin film transistor in each pixel region; a plurality of first connecting lines electrically connecting the thin film transistors of the first pixel lines with each other; and a second connecting line electrically connecting the thin film transistor of at least one of the second pixel lines.

Abstract: Provided is a flat panel display device and a method for fabricating the same. The flat panel display device comprises a first substrate, a light emitting unit, a second substrate, and insulating films. The light emitting unit comprises thin film transistors positioned on the first substrate, a first electrode electrically connecting with the thin film transistors, a second electrode facing the first electrode, and an emission layer or a liquid crystal layer interposed between the first and second electrodes. The second substrate is sealed with the first substrate by an ultraviolet curing sealant, and has a greater thermal expansion coefficient than the first substrate. The insulating films are positioned on one or more surfaces of the first and/or second substrates.

Abstract: Provided is a flat panel display device and a method for fabricating the same. The flat panel display device comprises a first substrate, a light emitting unit, a second substrate, and insulating films. The light emitting unit comprises thin film transistors positioned on the first substrate, a first electrode electrically connecting with the thin film transistors, a second electrode facing the first electrode, and an emission layer or a liquid crystal layer interposed between the first and second electrodes. The second substrate is sealed with the first substrate by an ultraviolet curing sealant, and has a greater thermal expansion coefficient than the first substrate. The insulating films are positioned on one or more surfaces of the first and/or second substrates.

Abstract: An active matrix organic electro luminescent display (ELD) device comprises a substrate, first and second active layers formed of polycrystalline silicon on the substrate, first source and drain regions and second source and drain regions, the first source and drain regions neighboring the first active layer and the second source and drain regions neighboring the second active layer, a gate insulating layer on the first and second active layers, first and second gate electrodes on the gate insulating layer, a first inter layer on the first and second gate electrodes, an anode electrode and a capacitor electrode on the first inter layer, a first passivation layer on the anode electrode and the capacitor electrode, a power line on the first passivation layer, first source and drain electrodes on the first passivation layer, the first source electrode being connected to the first source region and the first drain electrode being connected to the first drain region, second source and drain electrodes on the first

Abstract: An electroluminescent display device includes first and second substrates facing each other and having a pixel region and a non-pixel region; a thin film transistor and an array layer on an inner surface of the first substrate; a first electrode on an inner surface of the second substrate; a buffer layer on the first electrode in the non-pixel region; a shielding pattern on the buffer layer; a separator on the shielding pattern; an emitting layer on the first electrode in the pixel region; a second electrode on the emitting layer; and a connection electrode between the first and second substrates.

Abstract: An organic electroluminescent device includes first and second substrates spaced apart from each other, the first and second substrates including a pixel region, an array element layer on an inner surface of the first substrate, the array element layer including a switching element and a driving element connected to the switching element, an organic electroluminescent diode on an inner surface of the second substrate, an absorbent element on one of the array element layer and the organic electroluminescent diode, a protective layer on the absorbent element, and a connection electrode electrically connecting the array element layer and the organic electroluminescent diode.

Abstract: In a lead-free solder, a semiconductor package and a method of manufacturing the semiconductor package, the lead-free solder includes about 3.5 percent by weight to about 6 percent by weight of silver, about 0.05 percent by weight to about 0.5 percent by weight of copper and a remainder of tin. The lead-free solder is employed in the semiconductor package. The lead-free solder has high impact resistance and high heat resistance to reduce failures of the semiconductor package.

Abstract: An electro-luminescence display that is capable of being made into a small thickness and minimizing its length. In the electro-luminescence display, an electro-luminescence panel has a display area and a non-display area. Driving circuit boards apply driving signals to gate lines and data lines provided at the electro-luminescence panel. Tape carrier packages are connected between the driving circuit boards and the electro-luminescence panel in a planar state after the driving circuit boards were connected to the non-display area of the electro-luminescence panel.

Abstract: An organic electroluminescent device includes: an array element layer having a pad on a first substrate having first and second sides; an organic electroluminescent diode connected to the array element, the organic electroluminescent diode emitting light in an opposite direction away from the first substrate; a printed circuit board adjacent to a backside of the first substrate, the printed circuit board supplying the array element with external signals through the pad; and a supporting plate between the first substrate and the printed circuit board, the supporting plate having better thermal conductivity than the first substrate.

Abstract: An electroluminescent display device includes first and second substrates facing each other and having a pixel region and a non-pixel region; a thin film transistor and an array layer on an inner surface of the first substrate; a first electrode on an inner surface of the second substrate; a buffer layer on the first electrode in the non-pixel region; a shielding pattern on the buffer layer; a separator on the shielding pattern; an emitting layer on the first electrode in the pixel region; a second electrode on the emitting layer; and a connection electrode between the first and second substrates.

Abstract: A method of fabricating a dual panel-type active matrix organic electroluminescent device includes patterning a first metal layer to form a gate electrode, a gate line, a power line, a gate pad, and a power pad on a first substrate, forming a first insulating layer on the first substrate to cover the gate electrode, the gate pad, and the power pad, forming a semiconductor layer on the first insulating layer over the gate electrode, the semiconductor layer including an active layer of undoped amorphous silicon and an ohmic contact layer of doped amorphous silicon, forming source and drain electrodes, a data line, a first link electrode, and a data pad, wherein the source and drain electrodes are disposed on the ohmic contact layer, wherein the data line, the data pad, and the first link electrode are disposed on the first insulating layer, and wherein the first link electrode crosses the gate line, forming a channel within the active layer by etching a portion of the ohmic contact exposed between the source an

Abstract: An organic electroluminescence (EL) device includes first and second substrates spaced apart by a predetermined interval and facing each other; an array element having thin film transistors formed in a unit of sub-pixel on an inner surface of the first substrate; a color conversion portion disposed below the second substrate and having red (R), green (G) and blue (B) conversion layers for converting blue light into three primary colors of red (R), green (G) and blue (B); a lamination film formed below the color conversion portion; a first electrode disposed below the lamination film and made of a transparent conductive material; an organic EL layer formed in the unit of sub-pixel below the first electrode; a second electrode patterned in the unit of sub-pixel below the organic EL layer; and a conductive spacer electrically connecting the thin film transistors provided in the unit of the sub-pixels with the second electrode.

Abstract: An organic electroluminescent display device includes an array element layer formed on a substrate, the array element layer including a switching element, a driving element, a first electrode, an organic luminescent layer, and a second electrode, and a ground line formed on the substrate, the ground line directly contacting the second electrode.

Abstract: An organic electroluminescent device includes first and second substrates facing each other and spaced apart from each other; a gate line on an inner surface of the first substrate; a data line and a power line crossing the gate line and spaced apart from each other; a switching thin film transistor connected to the gate line and the data line; a driving thin film transistor connected to the switching thin film transistor and the power line, the driving thin film transistor including a channel region having a ring shape; an electric connection pattern connected to the driving thin film transistor, the connection pattern being disposed over the driving thin film transistor; and an organic electroluminescent diode on an inner surface of the second substrate, the organic electroluminescent diode being connected to the electric connection pattern.