Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

Abstract: Disclosed herein are diagnostic markers for lung cancer, isolated from serum glycoproteins. The disclosed diagnostic markers for lung cancer are specifically expressed only in the sera of lung cancer patients at high levels, and thus will be very useful for diagnosing lung cancer and estimating disease progression and treatment.

Abstract: A refrigerator includes a hinge bracket that is installed on a cabinet between an upper door and a lower door, which are configured to individually open and close an upper portion and a lower portion of a cabinet, respectively, and rotatably supports the upper door and the lower door, the hinge bracket coupled to a connecting member through a reinforcing bracket, which is installed at an inner side of a wall forming a heat insulation space of the cabinet, thereby enhancing the sealing performance of a filler unit configured to seal between the upper door and the lower door.

Abstract: Disclosed herein is a system and method for providing a packet network-based MRBT service. In the method, when an originating MSC (110) requests call termination location information from an HLR (120), the HLR transmits an MRBT service request message, including a calling number and a called number, to an MRBT server (140). The MRBT server returns an MRBT service response message, including URL of MRBT content, to the HLR. The HLR transmits a call termination location information response message to the originating MSC, with MRBT service ID information and called party MRBT content URL information included in the call termination location information response message. The originating MSC (110) transmits called party MRBT content URL information to an originating MS (100) on a basis of the MRBT service ID information. The originating MS accesses the MRBT content URL, downloads relevant MRBT content, and plays and stores the MRBT content.

Abstract: A battery charging device includes a power terminal unit to be connected to a power source and provided with power therefrom, a charging terminal unit to be connected to a power terminal of a battery, and a holding device to be fixed to side faces of the battery when the charging terminal unit contacts the power terminal of the battery.

Abstract: An apparatus to manufacture a semiconductor package is provided. A die attaching process and/or a wire bonding process for first and second surfaces of a lead frame are sequentially performed inside the apparatus. Thus, time required for a semiconductor packaging process decreases and yield is increased.

Abstract: A semiconductor package is provided. The semiconductor package includes a package substrate, a plurality of semiconductor chips, and a plurality of connection terminals. The package substrate includes a center portion, which has a first recess with a portion of a top of the package substrate removed, and an edge portion that has a plurality of second recesses. Each second recess has a portion of a bottom of the package substrate removed. The plurality of semiconductor chips are mounted in the first recess, and the plurality of connection terminals are respectively disposed in the second recesses.

Abstract: An organic electroluminescent device includes first and second substrates facing and spaced apart from each other; a gate line on the first substrate; a data line intersecting the gate line to define a pixel region; a switching element connected to the gate line and the data line; an organic electroluminescent diode on the second substrate; and a driving element connected to the switching element and the organic electroluminescent diode, the driving element including a plurality of driving negative-type polycrystalline silicon thin film transistors connected to the organic electroluminescent diode in parallel.

Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

Abstract: An organic electroluminescent display device includes a substrate, a gate line on the substrate, a data line crossing the gate line over the substrate, a switching thin film transistor near the crossing of the gate line and data line, a driving thin film transistor system including a plurality of sub-TFTs connected in parallel to the switching thin film transistor via a gate base, a power line crossing the gate line over the substrate and electrically connected with the plurality of sub-TFTs, a first electrode over the driving thin film transistor system in contact with the plurality of sub-TFTs, an organic electroluminescent layer on the first electrode, and a second electrode of transparent material on the organic electroluminescent layer.

Abstract: An organic electroluminescent device includes first and second substrates spaced apart from and facing each other, an organic electroluminescent diode on an inner surface of the second substrate, a gate line formed on an inner surface of the first substrate in a first direction, a data line formed in a second direction crossing the first direction, a power supply line spaced apart from the data line and formed in the second direction, a switching thin film transistor at a crossing portion of the gate and data lines, a driving thin film transistor at a crossing portion of the switching thin film transistor and the power supply line, a connecting electrode connected to the driving thin film transistor, and an electrical connecting pattern corresponding to the connecting electrode and for electrically connecting the connecting electrode to the organic electroluminescent diode.

Abstract: The present general inventive concept includes a wave soldering apparatus, a soldering method using the wave soldering apparatus, and a method of forming a solder bump for a flip chip. The wave soldering apparatus includes a solder bath containing a molten solder. A nozzle is arranged in the solder bath so as to upwardly spout the molten solder toward a bottom surface of a substrate that passes an upper portion of the solder bath. A liquid that is separated from the molten solder is contained in a downstream area of the solder bath, and buoyancy is applied to the molten solder, which is adhered to the substrate, by the liquid. Since the amount of the molten solder adhered to the substrate is increased by the buoyancy, it is possible to form the solder bump to have a height sufficient to use it as a flip chip.

Abstract: Provided is a flat panel display device and a method for fabricating the same. The flat panel display device comprises a first substrate, a light emitting unit, a second substrate, and insulating films. The light emitting unit comprises thin film transistors positioned on the first substrate, a first electrode electrically connecting with the thin film transistors, a second electrode facing the first electrode, and an emission layer or a liquid crystal layer interposed between the first and second electrodes. The second substrate is sealed with the first substrate by an ultraviolet curing sealant, and has a greater thermal expansion coefficient than the first substrate. The insulating films are positioned on one or more surfaces of the first and/or second substrates.

Abstract: A method of forming at least one bonding structure may be provided. A ball may be formed on the front end of a wire outside a capillary. The capillary may be moved downwardly to form a preliminary compressed ball on a first pad using the ball. The capillary may be moved upwardly to form a neck portion on the preliminary compressed ball using the preliminary compressed ball and the wire. The capillary may be moved obliquely and downwardly to form a compressed ball. The capillary may extend the wire from the compressed ball to a second pad.

Abstract: An organic electroluminescent device includes first and second substrates facing each other and spaced apart from each other; a gate line on an inner surface of the first substrate; a data line and a power line crossing the gate line and spaced apart from each other; a switching thin film transistor connected to the gate line and the data line; a driving thin film transistor connected to the switching thin film transistor and the power line, the driving thin film transistor including a channel region having a ring shape; an electric connection pattern connected to the driving thin film transistor, the connection pattern being disposed over the driving thin film transistor; and an organic electroluminescent diode on an inner surface of the second substrate, the organic electroluminescent diode being connected to the electric connection pattern.

Abstract: An organic light emitting display device that is capable of preventing the permeation of moisture by changing a sealing structure, thereby preventing the degradation of pixels and thus improving look-and-feel characteristics and a method of manufacturing the same are disclosed.

Abstract: An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.

Abstract: A dual panel-type organic electroluminescent display device includes first and second substrates facing and spaced apart from each other, an array element layer disposed along an inner surface of the first substrate, the array element including a thin film transistor, a connection pattern disposed on the array element layer and electrically connected to the thin film transistor, a color filter layer disposed along an inner surface of the second substrate, the color filter layer including red, green, and blue color filters, an overcoat layer disposed on the color filter layer, the overcoat layer including a hygroscopic material, an organic electroluminescent diode disposed on the overcoat layer and connected to the connection pattern, the organic electroluminescent diode including a first electrode, an organic light-emitting layer, and a second electrode sequentially formed on the overcoat layer, and the organic light-emitting layer emits substantially monochromatic light, and a seal pattern along peripheral p

Abstract: A method of forming at least one bonding structure may be provided. A ball may be formed on the front end of a wire outside a capillary. The capillary may be moved downwardly to form a preliminary compressed ball on a first pad using the ball. The capillary may be moved upwardly to form a neck portion on the preliminary compressed ball using the preliminary compressed ball and the wire. The capillary may be moved obliquely and downwardly to form a compressed ball. The capillary may extend the wire from the compressed ball to a second pad.

Abstract: An organic electroluminescent device includes first and second substrates spaced apart from each other, the first and second substrates including a first region and a second region, the second region outside the first region and including a concave portion, an array element on an inner surface of the first substrate, the array element including a switching element, an organic electroluminescent diode on an inner surface of the second substrate, a connection electrode electrically connecting the array element and the organic electroluminescent diode, the connection electrode between the first and second substrates, and a bar-type desiccant in the concave portion of the second region between the first and second substrates.