Abstract: A vehicle includes an integrated controller equipped with an advanced driver assistance system (ADAS). An air conditioner is configured to introduce air into the inside of the vehicle and to adjust a flow of the air. The air conditioner is configured to transmit the air to the integrated controller by branching an air conditioning duct that is a passage for transmitting air into the inside of the vehicle.

Abstract: An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.

Abstract: A method and system for monitoring a biomedical signal employ a sensor module configured to output a continuous electrical signal by sensing the biomedical signal, a memory configured to store reference data, a transmitter configured to transmit output data via a wireless channel, and a data processing unit configured to determine whether to transmit input data via the transmitter as the output data, based on the input data, which is generated from the continuous electrical signal, and the reference data.

Abstract: A method and system for monitoring a biomedical signal employ a sensor module configured to output a continuous electrical signal by sensing the biomedical signal, a memory configured to store reference data, a transmitter configured to transmit output data via a wireless channel, and a data processing unit configured to determine whether to transmit input data via the transmitter as the output data, based on the input data, which is generated from the continuous electrical signal, and the reference data.

Abstract: Disclosed is a surveillance system and method based on accumulated features of objects. The surveillance system ensures and accumulatively stores a plurality of data about feature information corresponding to an object picked up by a plurality of cameras and easily identifies the same object in an image taken by another camera having a surveillance area different from those of the plurality of cameras on the basis of the data, thereby allowing for continuous tracing.

Abstract: Disclosed is a surveillance system and method based on accumulated features of objects. The surveillance system ensures and accumulatively stores a plurality of data about feature information corresponding to an object picked up by a plurality of cameras and easily identifies the same object in an image taken by another camera having a surveillance area different from those of the plurality of cameras on the basis of the data, thereby allowing for continuous tracing.

Abstract: An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.

Abstract: A method of fabricating a semiconductor package includes providing a wafer which includes an upper area having through silicon vias (TSVs) and a lower area not having the TSVs; mounting a semiconductor chip on the upper area of the wafer; forming a passivation layer to a predetermined thickness to cover the semiconductor chip; exposing the TSVs by removing the lower area of the wafer in a state where no support is attached to the wafer; and exposing a top surface of the semiconductor chip by partially removing the passivation layer.

Abstract: An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.

Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

Abstract: A method of fabricating a semiconductor package includes providing a wafer which includes an upper area having through silicon vias (TSVs) and a lower area not having the TSVs; mounting a semiconductor chip on the upper area of the wafer; forming a passivation layer to a predetermined thickness to cover the semiconductor chip; exposing the TSVs by removing the lower area of the wafer in a state where no support is attached to the wafer; and exposing a top surface of the semiconductor chip by partially removing the passivation layer.

Abstract: The present invention relates to a lighting control system with a security function based on a CPTED, which is capable of acquiring detailed video information on a desired object in interlocking with a video device such as a DVR based on sensing information collected through sensors included a local lighting device and controlling a lighting adjacent to the object to strengthen a security function. Since lightings and cameras can be simultaneously controlled to direct a suspicious object in response to motion of the suspicious object without any separate video analysis module, the object's crime intention can be prevented and the object's video can be acquired without any shadow zone or deteriorated video quality, which can result in increased security in interlocking of the security function including CPTED-based crime prevention with the lighting control.

Abstract: The present invention relates to a lighting control system with a security function based on a CPTED, which is capable of acquiring detailed video information on a desired object in interlocking with a video device such as a DVR based on sensing information collected through sensors included a local lighting device and controlling a lighting adjacent to the object to strengthen a security function. Since lightings and cameras can be simultaneously controlled to direct a suspicious object in response to motion of the suspicious object without any separate video analysis module, the object's crime intention can be prevented and the object's video can be acquired without any shadow zone or deteriorated video quality, which can result in increased security in interlocking of the security function including CPTED-based crime prevention with the lighting control.

Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

Abstract: The present invention relates to a light control system using statement of Personal Computer (PC) which is applied to a building for energy saving and method thereof, and more specifically, to a light control system, in which a lighting environment is changed depending on a PC operation state to provide the lighting environment optimized for a working environment and that uses a PC state and is applied to a building for energy saving in order to promote energy saving effects, and a method thereof. According to the invention, a worker's attending and leaving states and being temporarily away from his or her position are easily determined using a PC operation state and thus a light illumination intensity is adaptively adjusted. As a result, it is possible to improve energy saving effects and optimize the lighting environment.

Abstract: Disclosed herein are diagnostic markers for lung cancer, isolated from serum glycoproteins. The disclosed diagnostic markers for lung cancer are specifically expressed only in the sera of lung cancer patients at high levels, and thus will be very useful for diagnosing lung cancer and estimating disease progression and treatment.

Abstract: A method of fabricating a semiconductor package includes providing a wafer which includes an upper area having through silicon vias (TSVs) and a lower area not having the TSVs; mounting a semiconductor chip on the upper area of the wafer; forming a passivation layer to a predetermined thickness to cover the semiconductor chip; exposing the TSVs by removing the lower area of the wafer in a state where no support is attached to the wafer; and exposing a top surface of the semiconductor chip by partially removing the passivation layer.

Abstract: A semiconductor device defect detecting apparatus including: a sensor disposed on semiconductor process equipment, the sensor configured to detect a signal emitted from a semiconductor device in contact with the semiconductor process equipment; and a signal analyzer configured to determine whether the semiconductor device is defective based on the detected signal in a predetermined frequency range.

Abstract: A refrigerator includes a hinge bracket that is installed on a cabinet between an upper door and a lower door, which are configured to individually open and close an upper portion and a lower portion of a cabinet, respectively, and rotatably supports the upper door and the lower door, the hinge bracket coupled to a connecting member through a reinforcing bracket, which is installed at an inner side of a wall forming a heat insulation space of the cabinet, thereby enhancing the sealing performance of a filler unit configured to seal between the upper door and the lower door.