Abstract: A method and corresponding software for automatically validating a computer platform thermal solution. An application program is employed to selectively execute thermal stress code to cause the platform's processor to dissipate an amount of power corresponding to a predetermined value, such as a thermal design power dissipation value specified by the processor's manufacturer. In one embodiment, tests are performed while operating at this power dissipation level to determine if a thermal overload condition exists, which may be determined by the processor's temperature, an indication that the processor is throttled, or a signal provided by the processor indicating the processor has detected a thermal overload condition. In another embodiment, a thermal resistance value is calculated based on the processor power dissipation, the temperature of the processor, and the ambient temperature of the test environment.

Abstract: An integrated circuit cooling device in which a thermoelectric module (TEM) is built into a printed circuit board (PCB) so that the TEM converts heat generated by an integrated circuit on the PCB into DC power that is then supplied to a DC--DC regulator to drive a cooling fan. In one embodiment, the cooling fan is incorporated within a heat sink disposed on one side of the PCB so that the built-in TEM is between the heat sink and the integrated circuit being cooled. In an alternate embodiment, the cooling fan is located remotely from the heat sink.