Abstract: A method and intermediate structure for improving the thinning and planarity of a wafer back side utilizing planarization material applied to the back side prior to at least one portion of the thinning operation and which is subsequently removed concurrently with the wafer material by one or more suitable thinning or planarization techniques. The planarization material may be applied as a thin layer or film of a hardenable material to the rough, bare back side of a wafer to produce a planar surface when hardened. The planarization material is selected to exhibit a material removal rate approximating the removal rate of the wafer material for a given removal technique such as etching, mechanical abrasion or chemical-mechanical planarization (CMP). This approach to wafer thinning and planarization results in improved process control in the form of uniform material removal rates, reduction in wafer warpage, final surface smoothness and planarity, and even distribution of residual stresses.

Abstract: A semiconductor wafer having a high degree of thinness and exhibiting an enhanced strength state. A layer of tenacious reinforcement material is disposed over a back side of the wafer while in a rough state from backgrinding without prior, conventional polishing or plasma etching of the back side. The thin layer or film of reinforcement material fills grooves, fractures and scratches in the back side of the wafer, enhance the rigidity of the wafer and provide a planar, smooth, back side surface layer. The reinforcement material counteracts internal stresses of the wafer tending to warp, crack and propagate lattice defects in the wafer. The reinforcement material may also be configured to act as a die attach adhesive, may provide an ionic barrier, and may remain as part of the packaging for semiconductor dice singulated from the wafer.

Abstract: A semiconductor wafer having a high degree of thinness and exhibiting an enhanced strength state. A layer of tenacious reinforcement material is disposed over, a back side of the wafer while in a rough state from backgrinding without prior, conventional polishing or plasma etching of the back side. The thin layer or film of reinforcement material fills grooves, fractures and scratches in the back side of the wafer, enhance the rigidity of the wafer and provide a planar, smooth, back side surface layer. The reinforcement material counteracts internal stresses of the wafer tending to warp, crack and propagate lattice defects in the wafer. The reinforcement material may also be configured to act as a die attach adhesive, may provide an ionic barrier, and may remain as part of the packaging for semiconductor dice singulated from the wafer.

Abstract: A method for assembling semiconductor devices includes providing a first semiconductor device, applying a volume of adhesive material to at least a surface of the first semiconductor device, and positioning a second semiconductor device over the first semiconductor device and a portion of at least one discrete conductive element protruding thereabove. The adhesive material may be applied to a surface of the first semiconductor device prior to positioning the second semiconductor device thereover, or introduced between the first and second semiconductor devices. Upon curing, the predetermined volume of adhesive material spaces the first and second semiconductor devices a predetermined distance apart from one another. Additional semiconductor devices may also be added to the assembly. The first semiconductor device may be associated with a substrate. Semiconductor device assemblies and packages that are at least partially fabricated in accordance with the method are also disclosed.

Abstract: A method for assembling semiconductor devices includes providing a first semiconductor device, applying a volume of adhesive material to at least a surface of the first semiconductor device, and positioning a second semiconductor device over the first semiconductor device and a portion of at least one discrete conductive element protruding thereabove. The adhesive material may be applied to a surface of the first semiconductor device prior to positioning the second semiconductor device thereover, or introduced between the first and second semiconductor devices. Upon curing, the predetermined volume of adhesive material spaces the first and second semiconductor devices a predetermined distance apart from one another. Additional semiconductor devices may also be added to the assembly. The first semiconductor device may be associated with a substrate. Semiconductor device assemblies and packages that are at least partially fabricated in accordance with the method are also disclosed.

Abstract: A method for assembling semiconductor devices includes providing a first semiconductor device, securing spacers to noncircuit bond pads of the first semiconductor device, and positioning a second semiconductor device on the spacers. Adhesive material may be applied to a surface of one or both of the first and second semiconductor devices prior to positioning of the second semiconductor device, or introduced between first and second semiconductor devices. The noncircuit bond pads may be electrically isolated from other structures of the first semiconductor device or communicate with a ground or reference voltage plane, in which case the back side of the second semiconductor device may communicate with the ground or reference voltage plane upon being positioning against the spacers. Additional semiconductor devices may be added to the assembly. The first semiconductor device may be associated with a substrate. Assemblies and packages at least partially fabricated by the method are also disclosed.

Abstract: A method for assembling semiconductor devices includes providing a first semiconductor device, applying a volume of adhesive material to at least a surface of the first semiconductor device, and positioning a second semiconductor device over the first semiconductor device and a portion of at least one discrete conductive element protruding thereabove. The adhesive material may be applied to a surface of the first semiconductor device prior to positioning the second semiconductor device thereover, or introduced between the first and second semiconductor devices. Upon curing, the predetermined volume of adhesive material spaces the first and second semiconductor devices a predetermined distance apart from one another. Additional semiconductor devices may also be added to the assembly. The first semiconductor device may be associated with a substrate. Semiconductor device assemblies and packages that are at least partially fabricated in accordance with the method are also disclosed.

Abstract: A method for assembling semiconductor devices includes providing a first semiconductor device, applying a volume of adhesive material to at least a surface of the first semiconductor device, and positioning a second semiconductor device over the first semiconductor device and a portion of at least one discrete conductive element protruding thereabove. The adhesive material may be applied to a surface of the first semiconductor device prior to positioning the second semiconductor device thereover, or introduced between the first and second semiconductor devices. Upon curing, the predetermined volume of adhesive material spaces the first and second semiconductor devices a predetermined distance apart from one another. Additional semiconductor devices may also be added to the assembly. The first semiconductor device may be associated with a substrate. Semiconductor device assemblies and packages that are at least partially fabricated in accordance with the method are also disclosed.

Abstract: A method for assembling semiconductor devices includes providing a first semiconductor device, applying a volume of adhesive material to at least a surface of the first semiconductor device, and positioning a second semiconductor device over the first semiconductor device and a portion of at least one discrete conductive element protruding thereabove. The adhesive material may be applied to a surface of the first semiconductor device prior to positioning the second semiconductor device thereover, or introduced between the first and second semiconductor devices. Upon curing, the predetermined volume of adhesive material spaces the first and second semiconductor devices a predetermined distance apart from one another. Additional semiconductor devices may also be added to the assembly. The first semiconductor device may be associated with a substrate. Semiconductor device assemblies and packages that are at least partially fabricated in accordance with the method are also disclosed.

Abstract: A method for assembling semiconductor devices includes providing a first semiconductor device, applying a volume of adhesive material to at least a surface of the first semiconductor device, and positioning a second semiconductor device over the first semiconductor device and a portion of at least one discrete conductive element protruding thereabove. The adhesive material may be applied to a surface of the first semiconductor device prior to positioning the second semiconductor device thereover, or introduced between the first and second semiconductor devices. Upon curing, the predetermined volume of adhesive material spaces the first and second semiconductor devices a predetermined distance apart from one another. Additional semiconductor devices may also be added to the assembly. The first semiconductor device may be associated with a substrate. Semiconductor device assemblies and packages that are at least partially fabricated in accordance with the method are also disclosed.

Abstract: A method for assembling semiconductor devices includes providing a first semiconductor device, applying a volume of adhesive material to at least a surface of the first semiconductor device, and positioning a second semiconductor device over the first semiconductor device and a portion of at least one discrete conductive element protruding thereabove. The adhesive material may be applied to a surface of the first semiconductor device prior to positioning the second semiconductor device thereover, or introduced between the first and second semiconductor devices. Upon curing, the predetermined volume of adhesive material spaces the first and second semiconductor devices a predetermined distance apart from one another. Additional semiconductor devices may also be added to the assembly. The first semiconductor device may be associated with a substrate. Semiconductor device assemblies and packages that are at least partially fabricated in accordance with the method are also disclosed.

Abstract: An assembly method that includes providing a first semiconductor device with discrete conductive elements protruding above a surface thereof and positioning a second semiconductor device at least partially over the first semiconductor device. A back side of the second semiconductor device rests upon at least some of the discrete conductive elements while remaining electrically isolated therefrom. The first and second semiconductor devices may be secured to one another with an adhesive material which is either placed on an active surface of the first semiconductor device before positioning the second semiconductor device thereover or introduced between the first and second semiconductor devices. Assemblies and packaged semiconductor devices that are formed in accordance with the method are also disclosed.

Abstract: A semiconductor device that includes at least one nonconfluent spacer layer on at least one surface thereof. The at least one nonconfluent spacer layer at least partially spaces the surface of the semiconductor device apart from another semiconductor device assembled in stacked arrangement therewith. Adjacent stacked semiconductor devices may include abutting nonconfluent spacer layers which together define a distance between opposed surfaces of the semiconductor devices. Each nonconfluent spacer layer includes voids therein that communicate with an exterior periphery of the layer to facilitate the lateral introduction of adhesive or encapsulant material into the layer and between the adjacent, stacked semiconductor devices. Multi-chip modules are also disclosed, as are methods for forming the nonconfluent spacer layers and assembly and packaging methods.

Abstract: A semiconductor device that includes at least one nonconfluent spacer layer on at least one surface thereof. The at least one nonconfluent spacer layer at least partially spaces the surface of the semiconductor device apart from another semiconductor device assembled in stacked arrangement therewith. Adjacent stacked semiconductor devices may include abutting nonconfluent spacer layers which together define a distance between opposed surfaces of the semiconductor devices. Each nonconfluent spacer layer includes voids therein that communicate with an exterior periphery of the layer to facilitate the lateral introduction of adhesive or encapsulant material into the layer and between the adjacent, stacked semiconductor devices. Multi-chip modules are also disclosed, as are methods for forming the nonconfluent spacer layers and assembly and packaging methods.

Abstract: An assembly method that includes providing a first semiconductor device with discrete conductive elements protruding above a surface thereof and positioning a second semiconductor device at least partially over the first semiconductor device. A back side of the second semiconductor device rests upon at least some of the discrete conductive elements while remaining electrically isolated therefrom. The first and second semiconductor devices may be secured to one another with an adhesive material which is either placed on an active surface of the first semiconductor device before positioning the second semiconductor device thereover or introduced between the first and second semiconductor devices. Assemblies and packaged semiconductor devices that are formed in accordance with the method are also disclosed.

Abstract: A method for assembling semiconductor devices includes providing a first semiconductor device, securing spacers to noncircuit bond pads of the first semiconductor device, and positioning a second semiconductor device on the spacers. Adhesive material may be applied to a surface of one or both of the first and second semiconductor devices prior to positioning of the second semiconductor device, or introduced between first and second semiconductor devices. The noncircuit bond pads may be electrically isolated from other structures of the first semiconductor device or communicate with a ground or reference voltage plane, in which case the back side of the second semiconductor device may communicate with the ground or reference voltage plane upon being positioning against the spacers. Additional semiconductor devices may be added to the assembly. The first semiconductor device may be associated with a substrate. Assemblies and packages at least partially fabricated by the method are also disclosed.