Patents by Inventor Jang Won Seo

Jang Won Seo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200207981
    Abstract: In the composition according to the embodiment, the composition of oligomers that constitute the chains in a urethane-based prepolymer may be adjusted to control the physical properties thereof such as gelation time. Thus, since the micropore characteristics, polishing rate, and pad cut rate of a polishing pad obtained by curing the composition according to the embodiment may be controlled, it is possible to efficiently manufacture high-quality semiconductor devices using the polishing pad.
    Type: Application
    Filed: December 24, 2019
    Publication date: July 2, 2020
    Inventors: Eun Sun JOENG, Hye Young HEO, Jang Won SEO, Jong Wook YUN
  • Publication number: 20200192549
    Abstract: An image display apparatus and an image display method are provided. The image display method includes displaying an item list including items, and a cursor indicating a position of a user input for moving the cursor. The image display method further includes sensing the user input, moving the cursor based on the user input, and changing a gap between a first item and a second item adjacent to the first item, among the items, based on a positional relationship between the cursor and the first item.
    Type: Application
    Filed: February 25, 2020
    Publication date: June 18, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin-ha LEE, Jang-won SEO, Jun-Seong PARK
  • Publication number: 20200164483
    Abstract: Embodiments relate to a polishing pad, which comprises a window having a hardness similar to that of its polishing layer. Since the polishing pad comprises a window having a hardness and a polishing rate similar to those of its polishing layer, it can produce an effect of preventing scratches on a wafer during a CMP process. In addition, the polishing layer and the window of the polishing pad have a similar rate of change in hardness with respect to temperature, so that they can maintain a similar hardness despite a change in temperature during the CMP process.
    Type: Application
    Filed: July 10, 2018
    Publication date: May 28, 2020
    Inventors: Sunghoon YUN, Joonsung RYOU, Jang Won SEO, Jaein AHN
  • Publication number: 20200119206
    Abstract: A perovskite solar cell adopts a compound having a specific central backbone having a carbazolylamino group as a substituent, and more particularly, to the perovskite solar cell adopts a compound, as a hole transport material, having a specific central backbone having a carbazolylamino group as a substituent, and a spirobifluorene compound having a carbazolylphenylamino group. The perovskite solar cell has very excellent high-temperature stability while having a high power generation efficiency.
    Type: Application
    Filed: June 29, 2018
    Publication date: April 16, 2020
    Inventors: Jaemin LEE, Hye Jin NA, Nam Joong JEON, Tae Youl YANG, Jang Won SEO
  • Patent number: 10606440
    Abstract: An image display apparatus and an image display method are provided. The image display method includes displaying an item list including items, and a cursor indicating a position of a user input for moving the cursor. The image display method further includes sensing the user input, moving the cursor based on the user input, and changing a gap between a first item and a second item adjacent to the first item, among the items, based on a positional relationship between the cursor and the first item.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: March 31, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin-ha Lee, Jang-won Seo, Jun-Seong Park
  • Patent number: 10593816
    Abstract: A method for manufacturing a device comprising an inorganic/organic hybrid perovskite compound film, according to the present invention, comprises the steps of: a) laminating a first structure and a second structure to allow the first surface layer and the second surface layer to be in contact with each other, the first structure comprising a first surface layer containing at least one of materials i) to v) below, the second structure comprising a second surface layer containing, independently from the first surface layer, at least one of materials i) to v) below; and b) applying heat and physical force to the laminate in which the first structure and the second structure are laminated: i) an inorganic/organic hybrid perovskite compound, ii) an organic halide, iii) a metal halide, iv) an inorganic/organic hybrid perovskite compound precursor, and v) a metal halide precursor.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: March 17, 2020
    Assignee: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY
    Inventors: Sang-Il Seok, Jun Hong Noh, Jang Won Seo, Nam Joong Jeon, Young Chan Kim
  • Patent number: 10545633
    Abstract: A method of providing, by an image output apparatus, a graphical user interface (GUI) for providing a service to a user is provided, the method including: displaying a selection menu for determining whether to execute a pre-set function related to a service corresponding to an external apparatus when the external apparatus is connected to the image output apparatus; determining whether to display a function list indicating at least one detail function of the service corresponding to the external apparatus, based on a selection input with respect to the selection menu; and displaying the function list based on a result of the determining.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: January 28, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki-tae Kim, Jang-won Seo
  • Patent number: 10518383
    Abstract: The embodiments relate to a porous polyurethane polishing pad and a process for preparing a semiconductor device by using the same. The porous polyurethane polishing pad comprises a urethane-based prepolymer and a curing agent, and has a thickness of 1.5 to 2.5 mm, a number of pores whose average diameter is 10 to 60 ?m, a specific gravity of 0.7 to 0.9 g/cm3, a surface hardness at 25° C. of 45 to 65 Shore D, a tensile strength of 15 to 25 N/mm2, an elongation of 80 to 250%, an AFM (atomic force microscope) elastic modulus of 101 to 250 MPa measured from a polishing surface in direct contact with an object to be polished to a predetermined depth wherein the predetermined depth is 1 to 10 ?m.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: December 31, 2019
    Assignee: SKC CO., LTD.
    Inventors: Jaein Ahn, Jang Won Seo, Sunghoon Yun, Su Young Moon, Myung-Ok Kyun
  • Publication number: 20190389033
    Abstract: Provided is a polishing pad that comprises a plurality of first grooves that have a shape of geometric figures that share a center; and a plurality of second grooves that radially extend from the center to the outer perimeter, wherein the depth of the second grooves is equal to, or deeper than, the depth of the first grooves. It is possible for the polishing pad to rapidly discharge any debris generated during the polishing process to reduce such defects as scratches on the surface of a wafer.
    Type: Application
    Filed: April 26, 2019
    Publication date: December 26, 2019
    Inventors: Sunghoon YUN, Jang Won SEO, Hye Young HEO, Jong Wook YUN, Jaein AHN, Su Young MOON
  • Patent number: 10513007
    Abstract: The embodiments relate to a porous polyurethane polishing pad and a process for preparing a semiconductor device by using the same. The porous polyurethane polishing pad comprises a urethane-based prepolymer and a curing agent, and has a thickness of 1.5 to 2.5 mm, a number of pores whose average diameter is 10 to 60 ?m, a specific gravity of 0.7 to 0.9 g/cm3, a surface hardness at 25° C. of 45 to 65 Shore D, a tensile strength of 15 to 25 N/mm2, an elongation of 80 to 250%, an AFM (atomic force microscope) elastic modulus of 30 to 100 MPa measured from a polishing surface in direct contact with an object to be polished to a predetermined depth wherein the predetermined depth is 1 to 10 ?m.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: December 24, 2019
    Assignee: SKC CO., LTD.
    Inventors: Jaein Ahn, Jang Won Seo, Sunghoon Yun, Su Young Moon, Myung-Ok Kyun
  • Publication number: 20190329376
    Abstract: An embodiment relates to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. In the porous polyurethane polishing pad, the polishing performance (or polishing rate) thereof can be controlled by adjusting the size and distribution of pores in the polishing pad.
    Type: Application
    Filed: January 9, 2018
    Publication date: October 31, 2019
    Inventors: Hye Young HEO, Jang Won SEO, Hyuk Hee HAN
  • Publication number: 20190321937
    Abstract: Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. According to the embodiments, the size and distribution of the plurality of pores contained in the porous polyurethane polishing pad can be adjusted. Thus, it is possible to provide a porous polyurethane polishing pad that has enhanced physical properties such as a proper level of withstand voltage, excellent polishing performance (i.e., polishing rate), and the like.
    Type: Application
    Filed: April 19, 2019
    Publication date: October 24, 2019
    Inventors: Hye Young HEO, Jang Won SEO, Jong Wook YUN, Sunghoon YUN, Jaein AHN
  • Publication number: 20190314954
    Abstract: Embodiments relate to a porous polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. According to the embodiments, the size and distribution of the plurality of pores contained in the porous polishing pad can be adjusted in light of the volume thereof. Thus, the plurality of pores have an apparent volume-weighted average pore diameter in a specific range, thereby providing a porous polishing pad that is excellent in such physical properties as polishing rate and the like.
    Type: Application
    Filed: April 16, 2019
    Publication date: October 17, 2019
    Inventors: Hye Young HEO, Jang Won SEO, Jong Wook YUN, Sunghoon YUN, Jaein AHN
  • Publication number: 20190288207
    Abstract: A spirobifluorene compound and a perovskite solar cell including the spirobifluorene compound are disclosed. More particularly, a spirobifluorene compound which can be used as a hole transport material of a perovskite solar cell is disclosed. A perovskite solar cell including the spirobifluorene compound as a hole transport material is further disclosed.
    Type: Application
    Filed: November 8, 2017
    Publication date: September 19, 2019
    Inventors: Jaemin LEE, Hye Jin NA, Nam Joong JEON, Jang Won SEO, Jun Hong NOH, Tae Youl YANG, Sang IL SEOK
  • Patent number: D857732
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: August 27, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sul-Hee Yang, Jang-Won Seo
  • Patent number: D862504
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: October 8, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sul-Hee Yang, Jang-Won Seo
  • Patent number: D870135
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: December 17, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Cedric Kiefer, Henryk Wollik, Jae Julien, Dae-Wung Kim, Jang-Won Seo, Ji-Hyun Lee, Yoo-Jin Choi
  • Patent number: D870763
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: December 24, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Cedric Kiefer, Henryk Wollik, Jae Julien, Dae-Wung Kim, Jang-Won Seo, Ji-Hyun Lee, Yoo-Jin Choi
  • Patent number: D873286
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: January 21, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hee-Jin Ko, Hyun-Jee Kwak, Jang-Won Seo, Jae Julien, Yoo-Jin Choi
  • Patent number: D887430
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: June 16, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jang-Won Seo, Yong-Hwan Kwon, Ji-Eun Kim, Ji-Hong Kim, Hye-Ryung Kim, Se-Ran Jeon, Woo-Seok Hwang