Abstract: An embodiment relates to a polishing pad which is used in a chemical mechanical planarization (CMP) process and has excellent airtightness, wherein the polishing pad is excellent in airtightness of a window opening and thus can prevent water leakage that may occur during a CMP process.

Abstract: Provided herein are an ultrasonic-based aerosol generation device with a new structure capable of reducing cartridge replacement costs and a control method thereof. The ultrasonic-based aerosol generation device according to some embodiments of the present disclosure may include a replaceable cartridge which is configured to store a liquid aerosol-forming substrate and a control main body which is configured to be coupled to the cartridge. Also, the control main body may include a controller and a vibration member which is configured to generate ultrasonic vibrations to vaporize the aerosol-forming substrate stored in the cartridge. Here, the controller may monitor a temperature of the vibration member and controls operation of the vibration member on the basis of a monitoring result.

Abstract: Provided herein are an ultrasonic-based aerosol generation device, which is capable of reducing cartridge replacement costs and ensuring immediate aerosol generation, and a cartridge recognition method thereof. The ultrasonic-based aerosol generation device according to some embodiments of the present disclosure may include a liquid reservoir configured to store a liquid aerosol-forming substrate, a vibration element configured to provide ultrasonic vibrations to the stored liquid aerosol-forming substrate to form an aerosol, and a porous member which is disposed to be spaced apart from the vibration element and has a plurality of holes formed therein. Here, the liquid aerosol-forming substrate may be pushed in a direction toward the porous member due to ultrasonic vibrations of the vibration element, and the pushed liquid may be rapidly vaporized by passing through the plurality of holes. Accordingly, an aerosol can be generated immediately upon a puff.

Abstract: Provided herein is an ultrasonic-based aerosol generation device capable of ensuring immediate aerosol generation according to puffs and reducing cartridge replacement costs. The ultrasonic-based aerosol generation device according to some embodiments of the present disclosure may include a control main body which includes a vibration member configured to generate ultrasonic vibrations and a cartridge which is replaceable and coupled to the control main body. In this structure, since the vibration member, which is a relatively expensive component, is disposed at the control main body side, the cartridge replacement costs may be significantly reduced. Further, since a vibration transmission member configured to transmit the ultrasonic vibrations of the vibration member to a liquid aerosol-forming substrate is disposed in the cartridge, an aerosol may be smoothly generated.

Abstract: A spirobifluorene compound and a perovskite solar cell including the spirobifluorene compound are disclosed. More particularly, a spirobifluorene compound which can be used as a hole transport material of a perovskite solar cell is disclosed. A perovskite solar cell including the spirobifluorene compound as a hole transport material is further disclosed.

Abstract: An aerosol generating device includes a cavity into which a cigarette is inserted, a light source that emits light to the cigarette inserted in the cavity, a reuse detection sensor that receives light reflected from the cigarette, a heater that heats the cigarette inserted into the cavity, and a controller, and the controller determines whether or not to operate the heater based on a rate of increase or decrease of a sensing value received from the reuse detection sensor.

Abstract: In the composition according to the embodiment, the content of an unreacted diisocyanate monomer in a urethane-based prepolymer may be controlled to control the physical properties thereof such as gelation time. Thus, since the micropore characteristics, polishing rate, and pad cut rate of a polishing pad obtained by curing the composition according to the embodiment may be controlled, it is possible to efficiently manufacture high-quality semiconductor devices using the polishing pad.

Abstract: An aerosol generating system includes: a cavity configured to accommodate at least a portion of a cigarette; a first induction coil located around the cavity; a second induction coil located around the cavity and connected to the first induction coil in parallel; and a battery configured to supply an alternating current to the first induction coil and the second induction coil, wherein the first induction coil and the second induction coil have different resonant frequencies.

Abstract: Provided is a polishing pad that comprises a plurality of first grooves that have a shape of geometric figures that share a center; and a plurality of second grooves that radially extend from the center to the outer perimeter, wherein the depth of the second grooves is equal to, or deeper than, the depth of the first grooves. It is possible for the polishing pad to rapidly discharge any debris generated during the polishing process to reduce such defects as scratches on the surface of a wafer.

Abstract: Provided herein are a porous wick and a vaporizer and aerosol generation device including the same. The vaporizer according to some embodiments of the present disclosure includes a liquid reservoir configured to store an aerosol-generating substrate in a liquid state, a heating element configured to heat the stored aerosol-generating substrate to generate an aerosol, and a porous wick configured to deliver the stored aerosol-generating substrate to the heating element through a porous body and comprising a coating film formed on at least a part of a plurality of surfaces of the porous body. Since a coating film is formed on a surface not associated with a target transport path for a liquid, the liquid can be intensively transported along the target transport path.

Abstract: The present disclosure relates to a polishing system in which accuracy and easiness of attachment and detachment of a polishing pad to a surface plate are maximized, the polishing system including: a surface plate having a polishing pad mounted on an upper portion; and the polishing pad mounted on the surface plate, in which the polishing pad includes: a polishing surface and a surface plate attachment surface that is a rear surface of the polishing surface, the surface plate attachment surface includes: at least one engraved portion, the surface plate includes at least one embossed portion, and the embossed portion and the engraved portion have a complementary coupling structure, and a method of manufacturing a semiconductor device to which the polishing system is applied.

Abstract: The present disclosure relates to a polishing pad, a method for manufacturing the polishing pad, and a method for manufacturing a semiconductor device using the polishing pad, and the present disclosure can prevent an error in detecting the end point due to the window in the polishing pad by minimizing the effect on transmittance according to the surface roughness of the window in the polishing pad in the polishing process, and allows the fluidity and loading rate of the polishing slurry in the polishing process to be implemented at similar levels by maintaining the surface roughness difference between the polishing layer and the window in the polishing pad within the predetermined range, thereby enabling the problem of deterioration of polishing performance due to the surface difference between the polishing layer and the window to be prevented. Further, a method for manufacturing a semiconductor device to which a polishing pad is applied may be provided.

Abstract: A polishing pad includes a polishing layer, wherein the polishing layer includes zinc (Zn), and a concentration of the zinc (Zn) is 0.5 ppm to 40 ppm parts by weight based on the total weight of the polishing layer. In an exemplary embodiment, a polishing pad is provided wherein a concentration of the zinc (Zn) is 0.5 ppm to 40 ppm parts by weight based on the total weight of the polishing layer, a concentration of the iron (Fe) is 1 ppm to 50 ppm parts by weight based on the total weight of the polishing layer, and a concentration of the aluminum (Al) is 2 ppm to 50 ppm parts by weight based on the total weight of the polishing layer.

Abstract: An aerosol generating system may include a plurality of susceptors having different resonance frequencies and configured to heat different portions of a cigarette accommodated in an aerosol generating device, a coil configured to heat the plurality of susceptors, a plurality of capacitors connected to the coil, and a processor configured to determine a combination of capacitors through which current applied to the coil is to pass from among the plurality of capacitors, and heat a susceptor corresponding to a resonance frequency according to the combination by applying current to the coil according to the combination.

Abstract: The present invention relates to a polishing pad, a method for producing the same, and a method of fabricating a semiconductor device using the same. According to the present invention, it is possible to prevent defects from occurring due to an inorganic component contained in a polishing layer during a polishing process, by limiting the content range of the inorganic component contained in the polishing layer. In addition, an unexpanded solid foaming agent is contained in a polishing composition for producing a polishing layer and is expanded during a curing process to form a plurality of uniform pores in the polishing layer, and the content range of the inorganic component contained in the polishing layer, thereby preventing defects from occurring during the polishing process.

Abstract: The polishing pad according to an embodiment adjusts the content of elements present in the polishing layer, thereby controlling the bonding strength between the polishing pad and the polishing particles and enhancing the bonding strength between the polishing particles and the semiconductor substrate (or wafer), resulting in an increase in the polishing rate. It is possible to enhance not only the mechanical properties of the polishing pad such as hardness, tensile strength, elongation, and modulus, but also the polishing rate for both a tungsten layer or an oxide layer. Accordingly, it is possible to efficiently fabricate a semiconductor device of excellent quality using the polishing pad.

Abstract: A memory controller according to an aspect of the present invention includes a BIST (built-in self-tester) configured to test a memory, a scheduler configured to change an execution order of memory commands to be transmitted to the memory, a main controller configured to control the memory, and a switch configured to connect one of an output of the scheduler and an output of the BIST to an input of the main controller in response to a control signal output from the BIST.

Abstract: Provided is a perovskite solar cell, and more particularly, a perovskite solar cell including an organometal halide layer having a perovskite structure; and a crystalline material layer stacked while forming an interface with the organometal halide layer, wherein a crystalline material of the crystalline material layer is a crystalline halide having a crystal structure different from the perovskite structure, and the crystalline halide has a band gap energy higher than a band gap energy of an organometal halide of the organometal halide layer, and has a valence band maximum energy level lower than a valence band maximum energy level of the organometal halide.