Abstract: An image reading apparatus includes an image sensor, a document feeder, and a processor. The document feeder includes a first driving device, a second driving device, a third driving device, a first sensor, and a second sensor. The first driving device includes a pick-up member to move documents from a tray to a document conveying path using a driving force through a first clutch. The second driving device is to move the tray with the documents to a side of the pick-up member using a driving force through a second clutch. The third driving device to move the documents along the document conveying path onto the image sensor using the driving force of the motor The first and second sensors detect the documents on the document conveying path. The processor controls an operation of the first clutch based on the signals of the first and second sensors.

Abstract: A polishing pad sheet which provides optimized interfacial properties for the laminated structure of a polishing pad based on appropriate elasticity and high durability, and in which the polishing pad having the polishing pad sheet applied thereto not only has its intrinsic function such as the polishing rate or the like, but also is capable of realizing the function without damage even during the polishing process in a wet environment for a long time, and a polishing pad to which the polishing pad sheet is applied. The polishing pad sheet includes: a first surface which is a polishing layer attachment surface; and a second surface which is a rear surface of the first surface, wherein the first surface has a value of the following Equation 1 of 4.20 to 5.50: 4.20?(|Sv|)/Sz×P (%)?5.50.

Abstract: Embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, a process for preparing the same, and a process for preparing a semiconductor device using the same. In the polishing pad according to the embodiment, the size (or diameter) and distribution of a plurality of pores are adjusted, whereby the polishing performance such as polishing rate and within-wafer non-uniformity can be further enhanced.

Abstract: The present disclosure provides a polishing pad, which may maintain polishing performances required for a polishing process, such as a removal rate and a polishing profile, minimize defects that may occur on a wafer during the polishing process, and polish layers of different materials so as to have the same level of flatness even when the layers are polished at the same time, and a method for producing the polishing pad. In addition, according to the present disclosure, it is possible to determine a polishing pad, which shows an optimal removal rate selectivity along with excellent performance in a CMP process, through the physical property values of the polishing pad without a direct polishing test.

Abstract: An embodiment relates to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. In the porous polyurethane polishing pad, the polishing performance (or polishing rate) thereof can be controlled by adjusting the size and distribution of pores in the polishing pad.

Abstract: A classifying and purifying apparatus of a solid blowing agent includes a classifier which classifies a supplied solid blowing agent into first microspheres and second microspheres, a storage connected to the classifier, in which the classified first microspheres flow in to be stored and emitted, and a filter arranged on the moving route of the solid blowing agent or the first microspheres which separates metallic substance from the object of filtering comprising the solid blowing agent or the first microspheres.

Abstract: A vaporizer and an aerosol-generating device including the vaporizer are provided. The vaporizer includes a liquid storage tank configured to store a liquid aerosol-generating material, and a wick-heater assembly including a porous wick that absorbs the stored aerosol-generating material through a porous body and a heater assembly that generates an aerosol by heating the absorbed aerosol-generating material.

Abstract: A memory controller according to an aspect of the present invention includes a buffer configured to store an operation command table including operation commands entered by a user, a BIST (built-in self-tester) controller configured to generate a pointer pointing to an operation command, a command and address generator configured to decode the operation command corresponding to the pointer among the operation commands to generate first memory commands, a command and address queue comprising queues for storing the first memory commands, and a command requester configured to output a test command including first operation command information for the generation of a memory command output from a first queue included in the queues among the memory command, location information of the first queue, and the operation commands.

Abstract: An image reading apparatus includes an image sensor, a document feeder, and a processor. The document feeder includes a first driving device, a second driving device, a third driving device, a first sensor, and a second sensor. The first driving device includes a pick-up member to move documents from a tray to a document conveying path using a driving force through a first clutch. The second driving device is to move the tray with the documents to a side of the pick-up member using a driving force through a second clutch. The third driving device to move the documents along the document conveying path onto the image sensor using the driving force of the motor The first and second sensors detect the documents on the document conveying path. The processor controls an operation of the first clutch based on the signals of the first and second sensors.

Abstract: Provided herein are a vaporizer and an aerosol generation device including the same. The vaporizer according to some embodiments of the present disclosure includes a porous wick configured to absorb an aerosol-generating substrate in a liquid state through a porous body, and a heating element which includes a heating pattern having a planar form that is embedded in the porous body and which is configured to heat the absorbed aerosol-generating substrate by the heating pattern to generate an aerosol. Since the heating pattern is embedded at a predetermined depth from a surface of the porous body, the amount of generated aerosol may be increased, and the risk of damage to the wick and the carbonization phenomenon may be reduced.

Abstract: Provided herein is an aerosol generation device with a reduced preheating time. The aerosol generation device according to some embodiments of the present disclosure includes a case including an opening formed in one surface, and an article insertion portion into which an aerosol-generating article including an aerosol-generating substrate is inserted, an opening/closing type cover which is disposed on the one surface of the case to open and close the opening, and a heater configured to heat the inserted aerosol-generating article. Here, the opening/closing type cover is configured to, when closing the opening, mechanically press an aerosol-generating substrate portion of the inserted aerosol-generating article so that the entire aerosol-generating substrate portion is rapidly heated, and in this way, a preheating time of the device may be reduced.

Abstract: Embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, a process for preparing the same, and a process for preparing a semiconductor device using the same. In the polishing pad according to the embodiment, the size (or diameter) and distribution of a plurality of pores are adjusted, whereby the polishing performance such as polishing rate and within-wafer non-uniformity can be further enhanced.

Abstract: An image display apparatus and an image display method are provided. The image display method includes displaying an item list including items, and a cursor indicating a position of a user input for moving the cursor. The image display method further includes sensing the user input, moving the cursor based on the user input, and changing a gap between a first item and a second item adjacent to the first item, among the items, based on a positional relationship between the cursor and the first item.

Abstract: Provided is a polishing pad including a polishing layer, wherein the nuclear magnetic resonance (NMR) 13C spectrum of a processed composition prepared by adding 1 g of the polishing layer to a 0.3 M aqueous solution of potassium hydroxide (KOH) and allowing the mixture to react in a closed container at a temperature of 150° C. for 48 hours includes a first peak appearing at 15 ppm to 18 ppm, a second peak appearing at 9 ppm to 11 ppm, and a third peak appearing at 138 ppm to 143 ppm, and the area ratio of the third peak to the second peak is about 5:1 to about 10:1. The polishing pad may exhibit physical properties corresponding to the above-described peak characteristics, thereby achieving a removal rate and defect prevention performance within desired ranges in polishing of a polishing target.

Abstract: The present disclosure relates to a polishing pad, a method of manufacturing the polishing pad, and a method of manufacturing a semiconductor device using the same. In the polishing pad, an unexpanded solid-phase blowing agent is included in a polishing composition when a polishing layer is manufactured, and the unexpanded solid-phase blowing agent is expanded during a curing process to form a plurality of uniform pores in the polishing layer, such that defects occurring on a surface of the semiconductor substrate may be prevented. In addition, the present disclosure may provide a method of manufacturing a semiconductor device to which the polishing pad is applied.

Abstract: In the composition according to the embodiment, the composition of oligomers that constitute the chains in a urethane-based prepolymer may be adjusted to control the physical properties thereof such as gelation time. Thus, since the micropore characteristics, polishing rate, and pad cut rate of a polishing pad obtained by curing the composition according to the embodiment may be controlled, it is possible to efficiently manufacture high-quality semiconductor devices using the polishing pad.

Abstract: The present disclosure relates to an endpoint detection window of a polishing pad for use in a polishing process. The polishing pad may prevent an error in detection of the endpoint of the polishing process by preventing a difference in endpoint detection performance from occurring due to a difference in the wavelength of a laser between polishing apparatuses. The present disclosure may also provide a method of fabricating a semiconductor device using the polishing pad.

Abstract: Provided is a polishing pad including a polishing layer, wherein the nuclear magnetic resonance (NMR) 13C spectrum of a processed composition prepared by adding 1 g of the polishing layer to a 0.3 M aqueous solution of potassium hydroxide (KOH) and allowing the mixture to react in a closed container at a temperature of 150° C. for 48 hours includes a first peak appearing at 15 ppm to 18 ppm, a second peak appearing at 9 ppm to 11 ppm, a third peak appearing at 138 ppm to 143 ppm, and a fourth peak appearing at 55 ppm to 65 ppm, and the softening control index calculated by Equation 1 is 0.10 to 0.45. The polishing pad includes the polishing layer having physical properties corresponding to the softening control index, and thus may exhibit a removal rate and defect prevention performance within desired ranges in polishing of a polishing target.

Abstract: Embodiments relate to a leakage-proof polishing pad for use in a chemical mechanical planarization (CMP) process and a process for producing the same.

Abstract: In the composition according to an embodiment, the weight ratio of toluene 2,4-diisocyanate in which one NCO group is reacted and unreacted toluene 2,6-diisocyanate in the urethane-based prepolymer is adjusted, whereby such physical properties as gelation time can be controlled. Thus, the polishing rate and pad cut rate of a polishing pad obtained by curing the composition according to the embodiment may be controlled while it has a hardness suitable for a soft pad, whereby it is possible to efficiently manufacture high-quality semiconductor devices using the polishing pad.