Abstract: Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber. Wafers are supported on a wafer lift which can move all wafers together or on independent lift pins which can move individual wafers for heating and cooling.

Abstract: Various embodiments of batch load lock apparatus are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Systems including the batch load lock apparatus and methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.

Abstract: A system and method for dynamic heating of a workpiece during processing is disclosed. The system includes an ion source and a plurality of LEDs arranged in an array, which are directed at a portion of the surface of the workpiece. The LEDs are selected so that they emit light in a frequency range that is readily absorbed by the workpiece, thus heating the workpiece. In some embodiments, the LEDs heat a portion of the workpiece just before that portion is processed by an ion beam. In another embodiment, the LEDs heat a portion of the workpiece as it is being processed. The LEDs may be arranged in an array, which may have a width that is at least as wide as the width of the ion beam. The array also has a length, perpendicular to its width, having one or more rows of LEDs.

Abstract: A wafer handling system may include upper and lower linked robot arms that may move a wafer along a nonlinear trajectory between chambers of a semiconductor processing system. These features may result in a smaller footprint in which the semiconductor processing system may operate, smaller transfer chambers, smaller openings in process chambers, and smaller slit valves, while maintaining high wafer throughput. In some embodiments, simultaneous fast wafer swaps between two separate chambers, such as load locks and ALD (atomic layer deposition) carousels, may be provided. Methods of wafer handling are also provided, as are other aspects.

Abstract: An apparatus for dynamically adjusting the pitch between substrates in a substrate stack comprises first and second lift portions. The first lift portion supports a first group of the plurality of substrates, and the second lift portion supports a second group of the plurality of substrates. The first and second lift portions are operable to move the first and second groups of substrates in a first direction independently from each other. This independent movement enables the pitch, or spacing, between adjacent substrates to be dynamically adjusted so that an end effector of a robot can be positioned between such adjacent substrates to pick one of the substrates without inadvertently engaging another substrate that is not being picked. Other embodiments are disclosed.

Abstract: A system and method for the handling of workpieces in a workpiece processing system is disclosed. The system utilizes three conveyor belts, where one may be a loading belt, feeding unprocessed workpieces from its associated workpiece carrier to a processing system. A second conveyor belt may be an unloading belt, receiving processed workpieces from the processing system and filling its associated workpiece carrier. The third conveyor belt may be exchanging its workpiece carrier during this time, so that it is available to start operating as the loading belt once all of the workpieces have been removed from the workpiece carrier associated with the first conveyor belt.

Abstract: An adjustable mass-resolving slit assembly includes an aperture portion and an actuation portion. The aperture portion includes first and second shield members that define an aperture therebetween for receiving an ion beam during semiconductor processing operations. The actuation portion is coupled to the aperture portion and selectively and independently adjusts the position of the first and second shield members along first and second non-parallel axes. Adjusting the position of the first and second shield members along the first axis adjusts a width of the aperture. Adjusting the position of the first and second shield members along the second axis adjusts a region of the first and second shield members impinged by the ion beam. Methods for using the adjustable mass-resolving slit assembly are also disclosed.

Abstract: A robot calibration method which aligns the coordinate system of a gantry module with the coordinate system of a camera system is disclosed. The method includes using an alignment tool, which allows the operator to place workpieces in locations known by the gantry module. An image is then captured of these workpieces by the camera system. A controller uses the information from the gantry module and the camera system to determine the relationship between the two coordinate systems. It then determines a transformation equation to convert from one coordinate system to the other.

Abstract: A system and method are disclosed for substrate handling. The system can include a robot adapter configured to connect to a robot, and first and second end effectors connected to the robot adapter. The robot adapter is configured to move the first and second end effectors from a first, retracted, position to a second, extended, position. In the extended position, the first or second end effector is disposed within a top entry load lock for picking or dropping a plurality of substrates therein. The first and second end effectors can be selectively and independently movable. The robot adapter can be rotatable so as to selectively position one of the end effectors over the top entry load lock. Methods for quickly swapping processed and unprocessed substrates in the top entry load lock are also disclosed and claimed.

Abstract: Various embodiments of batch load lock apparatus are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Systems including the batch load lock apparatus and methods of operating the batch load lock apparatus are also provided, as are numerous other aspects.

Abstract: Electronic device processing systems are described. The system includes a mainframe housing having a transfer chamber, a first facet, a second facet opposite the first facet, a third facet, and a fourth facet opposite the third facet, a first carousel assembly coupled to a first facet, a second carousel assembly coupled to the third facet, a first load lock coupled to the second facet, a second load lock coupled to the fourth facet, and a robot adapted to operate in the transfer chamber to exchange substrates from the first and second carousels. Methods and multi-axis robots for transporting substrates are described, as are numerous other aspects.

Abstract: Embodiments of substrate handling systems capable of heating and/or cooling batches of substrates being transferred into and out of various substrate processing chambers are provided. Methods of substrate handling are also provided, as are numerous other aspects.

Abstract: A wafer handling system may include upper and lower linked robot arms that may move a wafer along a nonlinear trajectory between chambers of a semiconductor processing system. These features may result in a smaller footprint in which the semiconductor processing system may operate, smaller transfer chambers, smaller openings in process chambers, and smaller slit valves, while maintaining high wafer throughput. In some embodiments, simultaneous fast wafer swaps between two separate chambers, such as load locks and ALD (atomic layer deposition) carousels, may be provided. Methods of wafer handling are also provided, as are other aspects.

Abstract: A robot calibration method which aligns the coordinate system of a gantry module with the coordinate system of a camera system is disclosed. The method includes using an alignment tool, which allows the operator to place workpieces in locations known by the gantry module. An image is then captured of these workpieces by the camera system. A controller uses the information from the gantry module and the camera system to determine the relationship between the two coordinate systems. It then determines a transformation equation to convert from one coordinate system to the other.

Abstract: A system and method for the handling of workpieces in a workpiece processing system is disclosed. The system utilizes three conveyor belts, where one may be a loading belt, feeding unprocessed workpieces from its associated workpiece carrier to a processing system. A second conveyor belt may be an unloading belt, receiving processed workpieces from the processing system and filling its associated workpiece carrier. The third conveyor belt may be exchanging its workpiece carrier during this time, so that it is available to start operating as the loading belt once all of the workpieces have been removed from the workpiece carrier associated with the first conveyor belt.

Abstract: Methods and apparatus are provided for the use of a dual Selective Compliant Assembly Robot Arm (SCARA) robot. In some embodiments two SCARAs are provided, each including an elbow joint, wherein the two SCARAs are vertically stacked such that one SCARA is a first arm and the other SCARA is a second arm, and wherein the second arm is adapted to support a first substrate, and the first arm is adapted to extend to a full length when the second arm supports the first substrate, and wherein the first substrate supported by the second arm is coplanar with the elbow joint of the first arm, and the second arm is further adapted to move concurrently in parallel (and/or in a coordinated fashion) with the first arm a sufficient amount to avoid interference between the first substrate and the elbow joint of the first arm. Numerous other embodiments are provided.

Abstract: Methods and apparatus are provided for the use of a dual Selective Compliant Assembly Robot Arm (SCARA) robot. In some embodiments two SCARAs are provided, each including an elbow joint, wherein the two SCARAs are vertically stacked such that one SCARA is a first arm and the other SCARA is a second arm, and wherein the second arm is adapted to support a first substrate, and the first arm is adapted to extend to a full length when the second arm supports the first substrate, and wherein the first substrate supported by the second arm is coplanar with the elbow joint of the first arm, and the second arm is further adapted to move concurrently in parallel (and/or in a coordinated fashion) with the first arm a sufficient amount to avoid interference between the first substrate and the elbow joint of the first arm. Numerous other embodiments are provided.