Abstract: A trimming circuit for a semiconductor memory apparatus includes a trimming code generator configured to provide a trimming code signal group by performing one of addition and subtraction using a test mode signal and a fuse coding signal, and an internal voltage generator configured to provide trimmed voltage in response to the trimming code signal group as output voltage.

Abstract: An internal signal generator for use in a semiconductor memory device includes an internal read address generation unit and an internal write address generation unit. The internal read address generation unit generates a plurality of read delay addresses by delaying an external address for a predetermined latency shorter than an additive latency set by the semiconductor memory device and selects one of the read delay addresses to thereby output an internal read address. The internal write address generation unit generates a plurality of write delay addresses by delaying the internal read address for a preset latency shorter than a column address strobe (CAS) latency set by the semiconductor memory device and selects one of the write delay addresses to thereby output an internal write address.

Abstract: A control apparatus of a GIO line includes a plurality of GIO line termination units, and a GIO control unit for generating a control signal to activate an operation of a specific one of the plurality of GIO termination units according to a data transmission method. Further, a method of controlling a GIO line through GIO termination includes the step of generating a control signal to activate an operation of a specific one of a plurality of GIO termination units according to a data transmission method.

Abstract: A semiconductor memory device is capable of reducing the current dissipation in a termination circuit and allowing a voltage level of a GIO line to rapidly reach a voltage level of a termination voltage when a termination operation is performed. The semiconductor memory device includes a global input/output line configured to transport data between a core region and an interface region, a main driving block configure to drive a voltage level of the global input/output line to predetermined termination voltage level in response to a termination enabling signal, and an auxiliary driving block configured to drive the is voltage level of the global input/output line to the predetermined termination voltage level in response to an over-driving signal, wherein the over-driving signal is enabled for a predetermined period of time during an initial period of an enabling interval for the termination enabling signal.

Abstract: A semiconductor memory device includes an enable signal generator configured to generate an enable signal in response to a plurality of burn-in test signals; a test mode signal generator configured to generate a plurality of peripheral region test mode signals and a plurality of core region test mode signals corresponding to the burn-in test signals in response to the enable signal; a core region controller configured to control circuits in a core region in response to the core region test mode signals; and a peripheral region controller configured to control circuits in a peripheral region in response to the peripheral region test mode signals.

Abstract: A multi-wordline test control circuit in a semiconductor integrated device for performing a multi-wordline test in a specified cell mat among a plurality of cell mats. The multi-wordline test control circuit comprises a multi-test control block for receiving a multi-wordline test signal and outputting a first test signal and a second test signal, and a multi-wordline test block for performing the multi-wordline test in a specified cell mat among a plurality of cell mats in response to the first test signal and the second test signal.

Abstract: A semiconductor memory device includes: a delay locked loop (DLL) for delaying an external clock to generate a DLL clock; an output control unit for generating a select signal based on a column address strobe (CAS) latency signal and a delay time corresponding to a total delay time of the DLL being in a delay locked state; and an output enable signal generating unit for generating a plurality of output enable signals in response to the DLL clock and outputting a final output enable signal in response to the select signal.

Abstract: An internal address generator for use in a semiconductor memory device includes an address detector, a drive pulse generator, and a delay unit. The address detector generates a comparison signal by comparing a first address currently input with a second address previously input. The drive pulse generator generates a drive pulse in response to the comparison signal. The delay unit outputs the first address as the second address and delays the second address to thereby generate an internal address synchronized with the drive pulse in case that the first address is different from the second address.

Abstract: An internal voltage generator of a semiconductor memory device generates pumping voltages (VPP, VBB, etc.) as internal voltages, which is capable of improving a charge pumping scheme. The internal voltage generator includes a plurality of charge pumping units for generating a pumping voltage by performing a charge pumping operation according to a plurality of pumping enable signals, and a pumping controller for controlling a number of the pumping enable signals to be activated according to a level of a fed-back pumping voltage.

Abstract: A semiconductor memory device includes an enable signal generator configured to generate an enable signal in response to a plurality of burn-in test signals; a test mode signal generator configured to generate a plurality of peripheral region test mode signals and a plurality of core region test mode signals corresponding to the burn-in test signals in response to the enable signal; a core region controller configured to control circuits in a core region in response to the core region test mode signals; and a peripheral region controller configured to control circuits in a peripheral region in response to the peripheral region test mode signals.

Abstract: An internal signal generator for use in a semiconductor memory device includes an internal read address generation unit and an internal write address generation unit. The internal read address generation unit generates a plurality of read delay addresses by delaying an external address for a predetermined latency shorter than an additive latency set by the semiconductor memory device and selects one of the read delay addresses to thereby output an internal read address. The internal write address generation unit generates a plurality of write delay addresses by delaying the internal read address for a preset latency shorter than a column address strobe (CAS) latency set by the semiconductor memory device and selects one of the write delay addresses to thereby output an internal write address.

Abstract: An internal voltage test circuit of a semiconductor memory apparatus includes a comparing unit for comparing a level of internal voltage with a level of external voltage to output a comparison result as an output signal during a test mode, and an output selecting unit for outputting the output signal to a data output pad during the test mode, and outputting a data signal to the data output pad during a normal operation mode.

Abstract: Provided is a memory device capable of automatically controlling a self refresh cycle by sensing an ambient temperature, rather than setting Extended Mode Register Set (EMRS) code. The memory device includes a temperature sensing unit for generating a first voltage independent of a temperature variation and a second voltage dependent upon a temperature variation, a comparing unit for comparing the first voltage with the second voltage to provide a comparison result signal, and a self refresh signal generating unit for receiving a self refresh entry signal and generating a self refresh signal of temperature compensated cycle under the control of the comparison result signal.

Abstract: An internal signal generator for use in a semiconductor memory device includes an internal read address generation unit and an internal write address generation unit. The internal read address generation unit generates a plurality of read delay addresses by delaying an external address for a predetermined latency shorter than an additive latency set by the semiconductor memory device and selects one of the read delay addresses to thereby output an internal read address. The internal write address generation unit generates a plurality of write delay addresses by delaying the internal read address for a preset latency shorter than a column address strobe (CAS) latency set by the semiconductor memory device and selects one of the write delay addresses to thereby output an internal write address.

Abstract: Provided is a memory device capable of automatically controlling a self refresh cycle by sensing an ambient temperature, rather than setting Extended Mode Register Set (EMRS) code. The memory device includes a temperature sensing unit for generating a first voltage independent of a temperature variation and a second voltage dependent upon a temperature variation, a comparing unit for comparing the first voltage with the second voltage to provide a comparison result signal, and a self refresh signal generating unit for receiving a self refresh entry signal and generating a self refresh signal of temperature compensated cycle under the control of the comparison result signal.

Abstract: A semiconductor memory device having a plurality of banks performs a refresh operation in sequence to each bank whether the refresh operation is required for all or less than all of the banks. The semiconductor memory device includes an extended mode register set containing a refresh information of each bank; and a bank refresh block for supporting a refresh operation performed in sequence to each bank in response to the refresh information of each bank.

Abstract: A multi-wordline test control circuit in a semiconductor integrated device for performing a multi-wordline test in a specified cell mat among a plurality of cell mats. The multi-wordline test control circuit comprises a multi-test control block for receiving a multi-wordline test signal and outputting a first test signal and a second test signal, and a multi-wordline test block for performing the multi-wordline test in a specified cell mat among a plurality of cell mats in response to the first test signal and the second test signal.

Abstract: A semiconductor memory device includes: a delay locked loop (DLL) for delaying an external clock to generate a DLL clock signal; an internal command signal generator for generating an internal command signal in response to an external command; a delay circuit for delaying the internal command signal by a delay time corresponding to a delay time of the DLL to output a delayed internal command signal; and an output enable signal generator for generating an output enable signal based on the delayed internal command signal and the DLL clock signal.

Abstract: A semiconductor memory device is capable of reducing the current dissipation in a termination circuit and allowing a voltage level of a GIO line to rapidly reach a voltage level of a termination voltage when a termination operation is performed. The semiconductor memory device includes a global input/output line configured to transport data between a core region and an interface region, a main driving block configure to drive a voltage level of the global input/output line to predetermined termination voltage level in response to a termination enabling signal, and an auxiliary driving block configured to drive the is voltage level of the global input/output line to the predetermined termination voltage level in response to an over-driving signal, wherein the over-driving signal is enabled for a predetermined period of time during an initial period of an enabling interval for the termination enabling signal.

Abstract: A semiconductor memory device includes: a delay locked loop (DLL) for delaying an external clock to generate a DLL clock; an output control unit for generating a select signal based on a column address strobe (CAS) latency signal and a delay time corresponding to a total delay time of the DLL being in a delay locked state; and an output enable signal generating unit for generating a plurality of output enable signals in response to the DLL clock and outputting a final output enable signal in response to the select signal.