Abstract: An electronic assembly includes an IC die including a semiconductor top surface having active circuitry thereon and a bottom surface, and at least one protruding bonding feature having sidewall surfaces and a leading edge surface extending outward from the IC die. A workpiece has a workpiece surface including at least one electrical connector and at least one framed hollow receptacle coupled to the electrical connector. The receptacle is formed from metal and includes sidewall portions and a bent top that defines a cavity. The bent top includes bent peripheral shelf regions that point downward into the cavity and towards the sidewall portions. The protruding bonding feature is inserted within the cavity of the receptacle and contacts the bent peripheral shelf regions along a contact area to form a metallic joint, wherein the contact area is at least primarily along the sidewall surfaces.

Abstract: An IC includes a substrate having a semiconductor top surface and a bottom surface, wherein the semiconductor top surface includes one or more active circuit components and a plurality of through silicon vias (TSVs) extending through the substrate. The plurality of TSVs include an outer dielectric liner. The dielectric liner includes at least one halogen or a Group 15 element metal gettering agent in an average concentration from 1 to 10 atomic %. A metal diffusion barrier layer is on the dielectric liner and a metal filler is on the metal barrier layer. The metal gettering agent getters metal filler that escapes the metal barrier layer.

Abstract: An IC includes a substrate having a semiconductor top surface, a plurality of metal interconnect levels having inter-level dielectric (ILD) layers therebetween on the top surface, and a bottom surface. A plurality of through substrate vias (TSVs) extend from a TSV terminating metal interconnect level downward to the bottom surface. The plurality of TSVs include an electrically conductive filler material surrounded by a dielectric liner that define a projected volume. The projected volume includes a projected area over the electrically conductive filler material and a projected height extending upwards from the TSV terminating metal interconnect level to a metal interconnect level above, and a projected sidewall surface along sidewalls of the projected volume. A crack suppression structure (CSS) protects TSVs and includes a lateral CSS portion that is positioned lateral to the projected volume and encloses at least 80% of the projected sidewall surface.

Abstract: A system, method, and apparatus for suppressing cracks in the wafer dicing process. A wafer includes a plurality of die attached to a frame and mounting tape, with the die separated by a plurality of scribe lanes. An existing die seal generally protects the boundary of the die but can still fail to fully protect the die from excessive cracks induced by dicing damage, particularly when dicing through brittle, low-k dielectrics. The system, method, and apparatus includes embedding a crack arrest structure (CAS) between adjacent scribe lanes. Upon a mechanical saw dicing the wafer, the CAS creates a moisture diffusion block, and can absorb or significantly diminish the energy of cracks propagating towards the individual die seals. Furthermore, the system, method, and apparatus can be implemented without the need to increase the width of the scribe lanes.

Abstract: The present invention relates to methods of making compositions for sensor films used for detecting chemical analytes within sensors, such as polymer-absorption chemiresistors (i.e., conductometric sensors). The sensor films have reduced cross-sensitivity to temperature, while maintaining sensitivity to the chemical analytes. The sensor matrix includes components that are associated with a first temperature coefficient of resistance, such as a polymer resin and/or a first conductive particle. The sensor matrix further comprises a second species, preferably a conductive particle, which has a second temperature coefficient of resistance that is opposite to the first temperature coefficient of resistance. The second species has an opposite influence on a resistance response of the sensor from the first species. In this manner, the sensor matrix exhibits a minimized response in resistance to any changes in temperature.

Abstract: In a semiconductor device for use in a wafer level chip scale package (WLCSP) and a method for fabrication, an inner scribe seal is formed around a functional circuit area that does not extend all the way into the corners of the rectangular die, and an outer scribe seal follows the perimeter of the die and into the corners, with the outer scribe seal having a continuous barrier wall towards the die edges so that moisture penetration in dielectric layers of the die is minimized, and cracks and delamination are stopped near the die edges. Limiting the extent of the insulating layer or layers in the WLCSP to cover the functional circuit area also reduces the stresses caused by these layers near the die corners. Other features further enhance the strength and barrier properties of the scribe seals and the layers near the die corners, terminate cracks and delamination at various levels within the dielectric stack of the die and the die protective overcoat, and prevent damage during the WLCSP assembly process.

Abstract: Disclosed is a mousetrap having an enclosure with a rotatable top part having a downwardly extending strike plate within the enclosure, and a bottom part having an upwardly extending catch plate within the enclosure, an aperture in each of the top part and the bottom part which are in substantial alignment when the mousetrap is set, and a trigger mechanism, wherein the mousetrap is set to incapacitate or kill the mouse by the manual rotation of the top part relative to the bottom part when a mouse activates the trigger mechanism causing the top part to rotate relative to the bottom part and thereby incapacitating or killing the mouse between the strike plate and the catch plate.

Abstract: A method for forming a single damascene and/or dual damascene interconnect structure, comprising: performing front end processing, depositing copper, annealing the copper, performing CMP planarization, performing a post copper CMP clean process, performing a BTA rinse, performing IPA drying process, performing doping during thermal ramp up and performing remaining back end processing.

Abstract: Disclosed is a mousetrap having an enclosure with a rotatable top part having a downwardly extending strike plate within the enclosure, and a bottom part having an upwardly extending catch plate within the enclosure, an aperture in each of the top part and the bottom part which are in substantial alignment when the mousetrap is set, and a trigger mechanism, wherein the mousetrap is set to incapacitate or kill the mouse by the manual rotation of the top part relative to the bottom part when a mouse activates the trigger mechanism causing the top part to rotate relative to the bottom part and thereby incapacitating or killing the mouse between the strike plate and the catch plate.

Abstract: A gas-fired heating appliance includes a burner, a gas valve module for supplying a fuel gas to the burner, a power module for applying a voltage to the gas valve module, and a flammable vapor sensor module for detecting a flammable vapor. The flammable vapor sensor module interrupts the voltage to the gas valve to shut off the gas valve and the burner when the flammable vapor module detects the presence or a predetermined concentration of flammable vapor. The voltage of the power module is applied to the gas valve module through the flammable vapor sensor module. The voltage to the gas valve module is interrupted if the flammable vapor sensor module is short-circuited. This arrangement is tamper-resistant to promote a safe operation of the gas-fired heating appliance.

Abstract: A carrier tube for use in a wellbore perforating gun has inner and outer layers selected from materials of different, comparative physical properties. The inner layer has a higher compressive strength, and the outer layer has a higher yield strength. The inner layer enables the tube to withstand wellbore compressive pressures, which may, depending upon the material selected, include relatively high pressures, while the outer layer contains any fragments of the inner layer that result upon detonation of the gun. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Abstract: Doping copper interconnects (100) with silicon (115) has been shown to improve Electromigration and Via Stress Migration reliability. After copper (118) is deposited by electrochemical deposition and chemically-mechanically polished back, doping is achieved by flowing SiH4 over the copper interconnect (100) for 0.5 to 5 seconds at a temperature of 325-425° C.

Abstract: A chemiresistor sensor system that compensates for changes in resistance caused by changes in ambient temperature, thereby increasing the accuracy of the sensor system's ability to detect target analytes. The sensor system generally includes a first resistor, a second resistor, and a load regulator or switch that is sensitive to changes in ambient temperature. At least one of the first resistor and the second resistor is a sensing element having a resistance that changes in response to the presence of one or more of the analytes. The switch manages an electrical load across the first resistor and the second resistor. The switch prevents passage of the electrical load across the first and/or second resistor when the ambient temperature is at a first value. The switch permits passage of the electrical load across the first and/or second resistor when the ambient temperature is at a second value.

Abstract: A deployable secure cellular communication system comprises an encryption device, an Internet Protocol (IP) encapsulator to encapsulate an output of the encryption device within IP packets, and a network interface to allow transport of the IP packets to a public IP network. The encryption device may be an STE device, the output of which is encapsulated into IP packets addressed to a matching IP encapsulator/decapsulator device over a public IP network, that then passes to a similar STE or other encryption device for decryption. Secure Voice-Over-IP (VoIP), video and data network functionality in a single, small size deployable case, to a remote user. Most importantly, bulk encrypted (i.e., secure) data is communicated over a public IP network.

Abstract: A chemiresistor sensor system that compensates for changes in resistance caused by changes in ambient temperature, thereby increasing the accuracy of the sensor system's ability to detect target analytes. The sensor system generally includes a first resistor, a second resistor, and a load regulator or switch that is sensitive to changes in ambient temperature. At least one of the first resistor and the second resistor is a sensing element having a resistance that changes in response to the presence of one or more of the analytes. The switch manages an electrical load across the first resistor and the second resistor. The switch prevents passage of the electrical load across the first and/or second resistor when the ambient temperature is at a first value. The switch permits passage of the electrical load across the first and/or second resistor when the ambient temperature is at a second value.

Abstract: The present invention relates to methods of making compositions for sensor films used for detecting chemical analytes within sensors, such as polymer-absorption chemiresistors (i.e., conductometric sensors). The sensor films have reduced cross-sensitivity to temperature, while maintaining sensitivity to the chemical analytes. The sensor matrix includes components that are associated with a first temperature coefficient of resistance, such as a polymer resin and/or a first conductive particle. The sensor matrix further comprises a second species, preferably a conductive particle, which has a second temperature coefficient of resistance that is opposite to the first temperature coefficient of resistance. The second species has an opposite influence on a resistance response of the sensor from the first species. In this manner, the sensor matrix exhibits a minimized response in resistance to any changes in temperature.

Abstract: The present invention is directed to a mousetrap comprising: an enclosure comprised of a top, a base and apertures located on each of the top and the base, wherein the enclosure is in an open position upon substantial alignment of the apertures; and a trigger mechanism comprising a lever arrangement and a biasing means operably connected to the top and the base, wherein the lever arrangement defines a gap through which a mouse is able to move through and as a result, raise the lever, wherein the enclosure, when in the open position, is able to admit the mouse into the enclosure and when in the closed position, the trapped mouse is substantially concealed within the enclosure, the mousetrap being set to trap the mouse by manual rotation of the top relative to the base to open the enclosure by substantial alignment of the apertures, the enclosure being held open against the force of the biasing means by engagement of the lever arrangement with a stop means, the mousetrap being activated to trap the mouse by the

Abstract: A ferroelectric polymer memory device and a method of providing an electrode layer of the device. The device comprises: a substrate; a plurality of electrode layers including a first electrode layer disposed on the substrate and a second electrode layer extending at an angle with respect to the first electrode layer in a longitudinal direction thereof; a ferroelectric layer disposed between the first electrode layer and the second electrode layer to form memory cells; a ILD layer disposed on the second electrode layer; wherein at least one of the plurality of electrode layers exhibits a pyramidal profile in a widthwise cross-section thereof.

Abstract: A user input panel dynamically expands to accommodate user input, such as handwritten or keyboard input. Expansion may occur in one or two out of four possible directions, depending upon the language to be written or typed. For example, when writing English words, the input panel may expand to the right as the user writes and then downward when the input panel has fully expanded rightward.

Abstract: The invention consists of a gripping device with two flat handles permanently secured together such that the flat sides are adjacent and freely pivot around a fastener. The ends farthest from the pivot point comprise a handle to be squeezed in the hand. The other ends are each bent and twisted in such a manner that one handle can pivot under the other handle, while the bends create a pair of matching jaws. The jaws are placed around a hot cooking utensil or other object and the handles are squeezed in the hand, thus firmly gripping the hot item, which can then be safely moved as desired without the user sustaining a burn.