Abstract: A buck-boost switching power circuit comprises a bypass control circuit which configured to determine whether the buck-boost switching power circuit operates in a bypass mode according to a bypass enable signal. When the conversion voltage difference between the input voltage and the output voltage is less than a reference voltage, the bypass control circuit controls to electrically connect the input power source with the output power source, and operates the buck-boost switching power circuit in the bypass phase of the bypass mode. Before and/or after the bypass phase, the bypass control circuit respectively controls the buck-boost switching power circuit to operate in a first transition phase and/or a second transition phase.

Abstract: A method for fabricating minimal fin length includes the steps of first forming a fin-shaped structure extending along a first direction on a substrate, forming a first single-diffusion break (SDB) trench and a second SDB trench extending along a second direction to divide the fin-shaped structure into a first portion, a second portion, and a third portion, and then performing a fin-cut process to remove the first portion and the third portion.

Abstract: A spike structure of golf shoes with deformation effect has a spike disk made of thermoplastic polyurethane (TPU), and having a disk ring portion, and a pressed portion connected to an inner rim of the disk ring portion, the pressed portion is capable of actuating between a normal position and a pressed position; and a plurality of spike claws made of thermoplastic polyurethane (TPU), and radially arranged on the disk ring portion and extending outwardly and downwardly; when the pressed portion of the spike disk is in the pressed position, each of the spike claws is driven by compressed deformation of the pressed portion to deform synchronously, and each of the spike claws retracts and deforms inwardly synchronously; when the pressed portion of the spike disk is in the normal position, each of the spike claws restores to its original shape.

Abstract: A MRAM layout structure with multiple unit cells, including a first word line, a second word line and a third word line extending through active areas, wherein two ends of a first MTJ are connected respectively to a second active area and one end of a second MTJ, and two ends of a third MTJ are connected respectively to a third active area and one end of a fourth MTJ, and a first bit line and a second bit line connected respectively to the other end of the second MTJ and the other end of the fourth MTJ.

Abstract: A package structure and a method for forming the same are provided. The package structure includes a first package structure and a second package structure. The first package structure includes a first device formed over a first substrate. The first device includes a first conductive plug connected to a through substrate via (TSV) structure formed in the first substrate. A buffer layer surrounds the first substrate. A first bonding layer is formed over the first substrate and the buffer layer. The second package structure includes a second device formed over a second substrate. A second bonding layer is formed over the second device. A hybrid bonding structure is between the first package structure and the second package structure by bonding the first bonding layer to the second bonding layer.

Abstract: A biological kit for separating electronegative low density lipoproteins is disclosed. The biological kit includes a first reagent, a second reagent, a third reagent and a fourth reagent. The first reagent includes water. The second reagent includes a first buffer, a second buffer and a salt. The third reagent includes the first buffer, the second buffer, an organic compound and the salt. The fourth reagent includes the first buffer and the second buffer.

Abstract: A semiconductor device comprises a metallization layer, a passivation layer disposed above the metallization layer, a copper redistribution layer disposed on the passivation layer, a second passivation layer disposed on the copper redistribution layer, and a polyimide layer disposed over the second passivation layer. The polyimide layer and the second passivation layer include a continuous gap there-through that exposes a portion of the copper redistribution layer.

Abstract: A MRAM circuit structure is provided in the present invention, with the unit cell composed of three transistors in series and four MTJs, wherein the junction between first transistor and third transistor is first node, the junction between second transistor and third transistor is second node, and the other ends of first transistor and third transistor are connected to a common source line. First MTJ is connected to second MTJ in series to form a first MTJ pair that connecting to the first node, and third MTJ is connected to fourth MTJ in series to form a second MTJ pair that connecting to the second node.

Abstract: A semiconductor device comprises a metallization layer, a passivation layer disposed above the metallization layer, a copper redistribution layer disposed on the passivation layer, a second passivation layer disposed on the copper redistribution layer, and a polyimide layer disposed over the second passivation layer. The polyimide layer and the second passivation layer include a continuous gap there-through that exposes a portion of the copper redistribution layer.

Abstract: A coating system and a method for using such a system comprising a vessel, a flexible container within the vessel, and a coating apparatus. The flexible container includes an outlet port, wherein the flexible container is configured to contract in response to an increase in pressure within the vessel. The flexible container is configured to output a coating composition through the outlet port in response to contraction. The coating apparatus is configured to receive the coating composition from the outlet port and in some embodiments, deliver the coating composition to a wafer surface.

Abstract: A gel composition includes an oleogel dispersed within an aqueous gel which is continuous phase. the oleogel comprising either a plant-based oil in liquid state at room temperature and a wax, or a plant-based oil in non-liquid state at room temperature. and the aqueous gel comprising water and at least one of protein and polysaccharide. The present disclosure also discloses an edible composition comprising the gel composition, and the use of this edible composition as an animal fat substitute. The present disclosure further discloses a food product comprising the edible composition. Methods for making the gel composition are also disclosed.

Abstract: A state detection circuit for detecting whether a state of an input node is floating, grounded, or electrically connected to an external voltage includes: a unidirectional device circuit and a determination circuit. The unidirectional device circuit electrically conducts a test node to a detection node unidirectionally. The detection node is coupled to the input node. The test node, the unidirectional device circuit, the detection node and the input node form a current path. The determination circuit determines a state of the input node according to a voltage level of the detection node. Within a detection stage, the state detection circuit provides a test voltage at the test node. A voltage of the detection node is determined by the input node, the test voltage, and a characteristic of the unidirectional device circuit.

Abstract: A semiconductor device is provided. The semiconductor device includes a bottom package and a top package. The top package is mounted on the bottom package. At least one portion of the top package protrudes from a sidewall of the bottom package. The semiconductor device further includes a passive device mounted on a protruding region of the portion of the top package.

Abstract: A switching converter includes: a power stage circuit which includes at least one switch to switch an inductor to convert an input power to an output power; a first loop control circuit configured to switch the at least one switch by a peak current mode according to a first feedback signal related to the output power and an inductor current of the inductor in a first control mode; and a second loop control circuit configured to control the at least one switch to switch with a switching period according to a second feedback signal in a second control mode. If the power stage circuit operates in DCM during consecutively more than a predetermined number of the switching periods, the switching converter enters the first control mode. A portion of sub-circuits of the second loop control circuit are turned off to reduce power consumption in the first control mode.

Abstract: A semiconductor package structure includes a first component, a bonding structure on the first component, a second component connected to the first component, and a copper connector on the second component. The bonding structure includes a copper base on the first component and copper protruding portions on the copper base. The second component is connected to the first component by bonding the copper protruding portions to the copper connector, and the copper protruding portions are in contact with the copper connector.

Abstract: Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.

Abstract: An automatic module switching system of a combined processing apparatus includes a chassis, a moving mechanism, a holding device, and multiple processing modules. The moving mechanism is driven to drive the holding device to move along a first moving direction and the holding device is driven to move along a second moving direction on the moving mechanism. The processing modules are detachably mounted onto the positioning sets of the hanging wall of the chassis and the holding device. The holding device drives the processing module thereon to move along a third moving direction. The combined processing apparatus can be scheduled to switch the processing modules automatically according user's needs, such that the combined processing apparatus can process in a manner that meets the user's needs. Cost for purchasing the plurality of processing machines can be saved and the problem of occupying much room can be also avoided.

Abstract: Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.

Abstract: A projection apparatus including a projection device, a reflecting component, and an image capturing device is provided. The projection device is adapted to project an image light beam to form a projection image. The reflecting component is disposed on the projection device and has a reflecting surface. The image capturing device is disposed on the projection device and has an image capturing end. The image capturing end faces the reflecting surface. The reflecting surface is adapted to reflect the projection image to the image capturing end.

Abstract: An anti-fuse memory device includes an anti-fuse module, a reference current circuit and a controller. A write enable signal enables a write controller and a write buffer of the anti-fuse module to program a selected anti-fuse memory cell in an anti-fuse array of the anti-fuse module, and a timing controller of the anti-fuse module stops a program operation of the anti-fuse array after a sense amplifier of the anti-fuse module changes a state of a readout data signal for a predetermined time duration.