Abstract: Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a resist layer disposed on a conductive layer. The semiconductor package also has a bump disposed on the conductive layer. The bump has a top surface and one or more sidewalls. The semiconductor package further includes a surface finish disposed on the top surface and the one or more sidewalls of the bump. The semiconductor package may have the surface finish surround the top surface and sidewalls of the bumps to protect the bumps from Galvanic corrosion. The surface finish may include a nickel-palladium-gold (NiPdAu) surface finish. The semiconductor package may also have a seed disposed on a top surface of the resist layer, and a dielectric disposed on the seed. The dielectric may surround the sidewalls of the bump. The semiconductor package may include the seed to be an electroless copper seed.

Abstract: The present invention relates to a catalytic device and a vehicle air conditioning apparatus comprising the same and, more particularly, provides a catalytic device comprising: a case (140); a light source part (120) disposed to face an inner side of the case (140) so as to radiate light toward an inner surface of the case (140); and a catalyst part (130) which is disposed on the inner surface of the case (140) and in which a photocatalytic reaction is induced by light radiated from the light source part (120), wherein the catalyst part (130) is located at a first separation distance (L) from the light source part (120) in order that a maximum light energy (Pmax) of the light source part (120) is focused thereon.

Abstract: A sensing module substrate and a sensing module including the same are provided. The sensing module substrate includes a film substrate having a first surface and a second surface; sensing vias which penetrate the film substrate from the first surface to the second surface, each of the sensing vias being configured to be coupled to pixels of a semiconductor chip; and an interconnection pattern provided on at least one of the first surface and the second surface of the film substrate.

Abstract: A film type semiconductor package includes a film substrate; a metal pattern extending a first length in a first direction on the film substrate, having a first width in a second direction perpendicular to the first direction the first length being larger than the first width, and includes a plurality of through holes spaced apart from each other in the first direction; a semiconductor chip including a plurality of pads; and a plurality of bumps spaced apart from each other in the first direction, bonded with the metal pattern, and overlapping the plurality of through holes and connected to the pads of the semiconductor chip.

Abstract: A display apparatus includes a cabinet; a display panel provided on the cabinet; a door provided on the cabinet and configured to be opened and closed; a first detector configured to detect opening of the door and output a first signal in response to the door being opened; an image data receiver configured to receive content data from an image source device; and a first controller configured to control the display panel to display a first image corresponding to the content data received from the image source device and control the display panel to display a second image different from the first image in response to receiving the first signal.

Abstract: A method for analyzing a wafer map using a wafer map analyzer includes generating first wafer maps each displaying characteristics of a first wafer for a corresponding channel of a plurality of channels. The first wafer maps are auto-encoded together to extract a first feature. The method also includes determining whether the first feature is a valid pattern, classifying the type of the first feature based on unsupervised learning when the first feature is a valid pattern and extracting a representative image of features classified into the same type as the first feature.

Abstract: Display substrates and display devices with reduced electrical resistance are disclosed. One inventive aspect includes a switching device, a first wiring and a second wiring. The switching device includes a first semiconductor layer, first and second gate insulation layers, a source electrode and a drain electrode. The source and drain electrodes are formed to electrically connect, through the first and second gate insulation layers, to the first semiconductor layer. The second wiring is formed on the second gate insulation layer and electrically connected to the first wiring.

Abstract: A photocatalyst device including: a body; a light source part fixed to the body to irradiate ultraviolet light and having an LED and a substrate for fixing the LED thereto; a catalyst part fixed to the body to conduct photocatalytic reaction with the light irradiated by the light source part and thus to generate superoxygen radicals; and a heat radiating part disposed on the light source part to radiate the heat generated from the light source part, whereby the photocatalyst device purifies air and sterilizes and deodorizes the evaporator, while being easily mountable as a single module.

Abstract: The present invention relates to a photocatalytic apparatus and a heating, ventilating, and air conditioning (HVAC) equipment for a vehicle comprising the same and, more specifically, to a photocatalytic apparatus and HVAC equipment for a vehicle comprising the same, wherein the photocatalytic apparatus may sterilize and deodorize an evaporator in addition to purifying air introduced into an HVAC case and may continuously maintain sterilization and deodorization functions by efficiently radiating heat generated from the photocatalytic apparatus.

Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.

Abstract: The present invention relates to a photocatalyst device including: a body; a light source part fixed to the body to irradiate ultraviolet light and having an LED and a substrate for fixing the LED thereto; a catalyst part fixed to the body to conduct photocatalytic reaction with the light irradiated by the light source part and thus to generate superoxygen radicals; and a heat radiating part disposed on the light source part to radiate the heat generated from the light source part, whereby the photocatalyst device purifies air and sterilizes and deodorizes the evaporator, while being easily mountable as a single module.

Abstract: A display apparatus includes a signal receiver configured to receive an image signal having a plurality of gradations; a display configured to display an image based on the received image signal; a storage configured to store a plurality of calibration coefficients corresponding to more than two gradations from among the plurality of gradations to calibrate a uniformity of the image; and a controller configured to control the display to apply to the received image signal, a calibration coefficient corresponding to a gradation of the received image signal from among the plurality of gradations to display the image. With this, the uniformity of the image outputted from the display apparatus is exactly calibrated with respect to the plurality of gradations.

Abstract: Display substrates and display devices with reduced electrical resistance are disclosed. One inventive aspect includes a switching device, a first wiring and a second wiring. The switching device includes a first semiconductor layer, first and second gate insulation layers, a source electrode and a drain electrode. The source and drain electrodes are formed to electrically connect, through the first and second gate insulation layers, to the first semiconductor layer. The second wiring is formed on the second gate insulation layer and electrically connected to the first wiring.

Abstract: A method for forming a substrate structure for an electrical component includes placing an electrically insulating laminate on a substrate and applying hot pressure to the electrically insulating laminate by a heatable plate. An average temperature of a surface temperature distribution within a center area of the heatable plate is higher than 80° C. during applying the hot pressure. Further, an edge area of the heatable plate laterally surrounds the center area and a temperature of the heatable plate within the edge area decreases from the center area towards an edge of the heatable plate during applying the hot pressure. A temperature at a location located vertically above an edge of the substrate during applying the hot pressure is at least 5° C. lower than the average temperature of the surface temperature distribution within the center area.

Abstract: Examples relate to a die interconnect substrate comprising a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate further comprises a substrate structure comprising a substrate interconnect electrically insulated from the bridge die, wherein the bridge die is embedded in the substrate structure. The die interconnect substrate further comprises a first interface structure for attaching a semiconductor die to the substrate structure, wherein the first interface structure is connected to the first bridge die pad. The die interconnect substrate further comprises a second interface structure for attaching a semiconductor die to the substrate structure, wherein the second interface structure is connected to the substrate interconnect. A surface of the first interface structure and a surface of the second interface structure are at the same height.

Abstract: The present invention relates to a photocatalytic apparatus and a heating, ventilating, and air conditioning (HVAC) equipment for a vehicle comprising the same and, more specifically, to a photocatalytic apparatus and HVAC equipment for a vehicle comprising the same, wherein the photocatalytic apparatus may sterilize and deodorize an evaporator in addition to purifying air introduced into an HVAC case and may continuously maintain sterilization and deodorization functions by efficiently radiating heat generated from the photocatalytic apparatus.

Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.

Abstract: An accessory device of a portable electronic device is provided. The accessory device includes a first cover that is detachably attached to at least a portion of the electronic device, a second cover that is connected to the first cover, at least a portion of the second cover covering at least a portion of a display of the electronic device, and an electronic circuit that is arranged inside the first cover or the second cover. The electronic circuit may include a memory that stores at least some of codes or data that indicate one or more of identification information, a characteristic, a configuration, a structure, and a function that are associated with a protection cover. Various pieces of corresponding information may be output according to the kinds of applied accessories. Therefore, the consumers' product preference can be improved and the reliability of the electronic device can be secured.

Abstract: A display device includes a signal receiver configured to receive an image signal; a display including a plurality of modules each including a plurality of light sources, and display an image based on the received image signal; and a controller configured to perform first uniformity calibration between light sources within each individual module with regard to the modules, and second uniformity calibration between the modules, wherein the controller controls the first uniformity calibration to be applied to the image signal received in the signal receiver based on a first coefficient determined for each of the light sources within each individual module, controls the second uniformity calibration to be applied to the image signal subjected to the first uniformity calibration based on a second coefficient determined for each of the modules, and controls a calibrated image to be displayed based on the image signal subjected to the second uniformity calibration.

Abstract: A correlated double sampling (CDS) circuit includes a comparator and a first circuit. The comparator including, a first input terminal, a second input terminal, at least one output terminal, and a plurality of first transistors operably coupled between the at least one output terminal and the first and second input terminals. The first circuit includes at least one second transistor, the at least one second transistor operably coupled to the at least one output terminal and one of the first input terminal and the second input terminal, the at least one second transistor having at least one of (i) a different number of layers than the first transistors, and (ii) a different dimension than the first transistors.