Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.

Abstract: Techniques for fabricating a semiconductor package having magnetic materials embedded therein are described. For one technique, fabrication of package includes: forming a pad and a conductive line on a build-up layer; forming a raised pad structure on the build-up layer, the raised pad comprising a pillar structure on the pad; encapsulating the conductive line and the raised pad structure in a magnetic film comprising one or more magnetic fillers; planarizing a top surface of the magnetic film until top surfaces of the raised pad structure and the magnetic film are co-planar; depositing a primer layer on the top surfaces; removing one or more portions of the primer layer above the raised pad structure to create an opening; and forming a via in the opening on the raised pad structure. The primer layer may comprise one or more of a build-up layer, a photoimageable dielectric layer, and a metal mask.

Abstract: An air blower device of an air-conditioning system for a vehicle including: a blower case including a duct part having an indoor air inlet and an outdoor air inlet, an air blowing part connected with an inlet of an air-conditioning case and a connection part for connecting the duct part with the air blowing part, the connection part having an insertion part of which the certain area is hollowed; an indoor and outdoor air converting door disposed inside the duct part of the blower case to open and close the indoor air inlet and the outdoor air inlet; an air blower is disposed inside the air blowing part of the blower case to forcedly blow air; an electric dust collector located at the connection part through the insertion part of the blower case; and a cover for opening and closing the insertion part of the blower case.

Abstract: A display device is provided, which includes a display, a ditherer configured to perform dithering of video data displayed on the display, an illumination sensor configured to sense illumination around the display device, and a processor configured to control driving of the ditherer on the basis of a grayscale level of the video data if or when the sensed illumination is lower than a predetermined value.

Abstract: Examples relate to a die interconnect substrate comprising a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate further comprises a substrate structure comprising a substrate interconnect electrically insulated from the bridge die, wherein the bridge die is embedded in the substrate structure. The die interconnect substrate further comprises a first interface structure for attaching a semiconductor die to the substrate structure, wherein the first interface structure is connected to the first bridge die pad. The die interconnect substrate further comprises a second interface structure for attaching a semiconductor die to the substrate structure, wherein the second interface structure is connected to the substrate interconnect. A surface of the first interface structure and a surface of the second interface structure are at the same height.

Abstract: An operating method of an image display apparatus includes detecting a screen aspect ratio of an input image; determining rotation control information regarding a tiled display of the image display apparatus, the tiled display including a plurality of individually rotatable display modules, according to the detected screen aspect ratio of the input image; rotating each of the plurality of display modules according to the determined rotation control information; and controlling the plurality of display modules to display the input image according to the determined rotation control information.

Abstract: Provided are a decoration sheet and a method for producing same, the decoration sheet sequentially comprising a thermosetting resin layer, a deposition layer, and a base layer, wherein the thermosetting resin layer has a micropattern on a surface thereof, and the elongation rate of the sheet is 200% to 300%.

Abstract: A film-type semiconductor package includes a metal lead portion arranged on a film substrate, a semiconductor chip including a pad, and a bump connecting the metal lead portion to the pad of the semiconductor chip. The bump includes a metal pillar arranged on the pad and including a first metal and a soldering portion arranged on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal.

Abstract: Embodiments include an electronic package that includes a first layer that comprises a dielectric material and a second layer over the first layer, where the second layer comprises a magnetic material. In an embodiment, a third layer is formed over the second layer, where the third layer comprises a dielectric material. In an embodiment, the third layer entirely covers a first surface of the second layer. In an embodiment a first conductive layer and a second conductive layer are embedded within the second layer. In an embodiment, sidewalls of the first conductive layer and the second conductive layer are substantially vertical.

Abstract: Embodiments include an inductor that comprises an inductor trace and a magnetic body surrounding the inductor trace. In an embodiment, the magnetic body comprises a first step surface and a second step surface. Additional embodiments include an inductor that includes a barrier layer. In an embodiment, an inductor trace is formed over a first surface of the barrier layer. Embodiments include a first magnetic body over the inductor trace and the first surface of the barrier layer, and a second magnetic body over a second surface of the barrier layer opposite the first surface. In an embodiment, a width of the second magnetic body is greater than a width of the first magnetic body.

Abstract: Provided is a method of inducing oligodendrocyte precursor cells (OPCs) through direct reprogramming from human somatic cells into which a nucleic acid molecule encoding an Oct4 protein or Oct4 protein-treated human somatic cells. The method of inducing OPCs by treating Oct4-overexpressing human somatic cells with a low molecular weight substance may establish OPCs with high efficiency in a short period of time through direct reprogramming without via neural stem cells, and thus the OPCs are useful as a cell therapeutic agent for an intractable demyelinating disease.

Abstract: An air blower device of an air-conditioning system for a vehicle including: a blower case including a duct part having an indoor air inlet and an outdoor air inlet, an air blowing part connected with an inlet of an air-conditioning case and a connection part for connecting the duct part with the air blowing part, the connection part having an insertion part of which the certain area is hollowed; an indoor and outdoor air converting door disposed inside the duct part of the blower case to open and close the indoor air inlet and the outdoor air inlet; an air blower is disposed inside the air blowing part of the blower case to forcedly blow air; an electric dust collector located at the connection part through the insertion part of the blower case; and a cover for opening and closing the insertion part of the blower case.

Abstract: A correlated double sampling (CDS) circuit includes a comparator and a first circuit. The comparator including, a first input terminal, a second input terminal, at least one output terminal, and a plurality of first transistors operably coupled between the at least one output terminal and the first and second input terminals. The first circuit includes at least one second transistor, the at least one second transistor operably coupled to the at least one output terminal and one of the first input terminal and the second input terminal, the at least one second transistor having at least one of (i) a different number of layers than the first transistors, and (ii) a different dimension than the first transistors.

Abstract: A method for forming a substrate structure for an electrical component includes placing an electrically insulating laminate on a substrate and applying hot pressure to the electrically insulating laminate by a heatable plate. An average temperature of a surface temperature distribution within a center area of the heatable plate is higher than 80° C. during applying the hot pressure. Further, an edge area of the heatable plate laterally surrounds the center area and a temperature of the heatable plate within the edge area decreases from the center area towards an edge of the heatable plate during applying the hot pressure. A temperature at a location located vertically above an edge of the substrate during applying the hot pressure is at least 5° C. lower than the average temperature of the surface temperature distribution within the center area.

Abstract: An electrification apparatus for an electrostatic dust collector, including: a first electrode part having a shape of a plate having a plurality of through holes formed thereon in such a manner as to apply one of positive and negative electrodes thereto; and a second electrode part having protrusions each having a plurality of fine conductive fibers in such a manner as to protrude outwardly from the through holes of the first electrode part, whereby electrification performance is improved and harmful ozone and electromagnetic waves are reduced.

Abstract: An electrical dust-collecting filter is provided. The electrical dust-collecting filter includes a dust-collecting unit having a dust-collecting body and dust-collecting electrodes configured to generate an electrical field in the dust-collecting body. The dust-collecting body has a plurality of air channels laterally formed therethrough and discharge apertures formed in upper and lower surfaces thereof at inlets of the plurality of air channels. A discharge unit is integrally formed with the dust-collecting unit at the inlets of the plurality of air channels to facilitate corona discharge in air introduced into the inlets of the plurality of air channels.

Abstract: Disclosed embodiments include an embedded thin-film capacitor and a magnetic inductor that are assembled in two adjacent build-up layers of a semiconductor package substrate. The thin-film capacitor is seated on a surface of a first of the build-up layers and the magnetic inductor is partially disposed in a recess in the adjacent build up layer. The embedded thin-film capacitor and the integral magnetic inductor are configured within a die shadow that is on a die side of the semiconductor package substrate.

Abstract: A film-type semiconductor package includes a metal lead portion arranged on a film substrate, a semiconductor chip including a pad, and a bump connecting the metal lead portion to the pad of the semiconductor chip. The bump includes a metal pillar arranged on the pad and including a first metal and a soldering portion arranged on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal.

Abstract: Disclosed are fingerprint sensor packages and display apparatuses including the same. The fingerprint sensor package comprises a flexible film having a top surface and a bottom surface opposite to the top surface, a fingerprint sensor surrounded by a cap, and a display driver integrated circuit on the flexible film. The fingerprint sensor and the display driver integrated circuit are mounted on the top surface of the flexible film.

Abstract: The present invention provides a vacuum thermoforming adhesive composition containing a polyurethane polymer and an acrylic polymer and having a difference in melting temperature and cross-linking temperature of 30-60° C. In addition, provided is a vacuum thermoforming decoration sheet comprising: an adhesive layer, a substrate layer formed on the adhesive layer; a printing layer formed on the substrate layer, and a transparent substrate layer formed on the printing layer, wherein the adhesive layer is formed from the defroster vacuum thermoforming adhesive composition.