Patents by Inventor Jian-Hong Lin

Jian-Hong Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10777510
    Abstract: A semiconductor device and a method of manufacture thereof are provided. The method for manufacturing the semiconductor device includes forming a first dielectric layer on a substrate. Next, forming a first dummy metal layer on the first dielectric layer. Then, forming a second dielectric layer over the first dummy metal layer. Furthermore, forming an opening in the second dielectric layer and the first dummy metal layer. Then, forming a dummy via in the opening, wherein the dummy via extending through the second dielectric layer and at least partially through the first dummy metal layer. Finally, forming a second dummy metal layer on the second dielectric layer and contact the dummy via.
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: September 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jian-Hong Lin, Kuo-Yen Liu, Hsin-Chun Chang, Tzu-Li Lee, Yu-Ching Lee, Yih-Ching Wang
  • Publication number: 20200247101
    Abstract: A method for preparing a bifunctional film, including: (a) drying a first polymer solution to form a film to form an anti-adhesion layer; and (b) drying a second polymer solution over the anti-adhesion layer to form a film to form an attachment layer. The first polymer solution includes a first hydrophobic solution and a first hydrophilic solution, and in the first polymer solution, the weight ratio of the solute of the first hydrophobic solution to the solute of the first hydrophilic solution 1:0.01-1. Moreover, the second polymer solution consists of a second hydrophilic solution.
    Type: Application
    Filed: November 6, 2019
    Publication date: August 6, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Hsin-Hsin SHEN, Yu-Chi WANG, Ming-Chia YANG, Yu-Bing LIOU, Wei-Hong CHANG, Yun-Han LIN, Hsin-Yi HSU, Yun-Chung TENG, Chia-Jung LU, Yi-Hsuan LEE, Jian-Wei LIN, Kun-Mao KUO, Ching-Mei CHEN
  • Publication number: 20200151886
    Abstract: An information display system and an information display method are provided. The information display system includes a display screen, an image-capture device, and a processing device. The image-capture device captures a picture sequence. The processing device is coupled to the display screen and the image-capture device. The processing device recognizes at least one dynamic object in the picture sequence and generates a recognition frame and a recognition information corresponding to the dynamic object. The processing device tracks a recognition frame of a plurality of first pictures in the picture sequence to obtain a tracking result.
    Type: Application
    Filed: March 13, 2019
    Publication date: May 14, 2020
    Applicants: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Jian-Lung Chen, Chih-Chia Chang, Yu-Hsin Lin, Shin-Hong Kuo
  • Publication number: 20200144116
    Abstract: A manufacturing method of a chip package includes patterning a wafer to form a scribe trench, in which a light-transmissive function layer below the wafer is in the scribe trench, the light-transmissive function layer is between the wafer and a carrier, and a first included angle is formed between an outer wall surface and a surface of the wafer facing the light-transmissive function layer; cutting the light-transmissive function layer and the carrier along the scribe trench to form a chip package that includes a chip, the light-transmissive function layer, and the carrier; and patterning the chip to form an opening, in which the light-transmissive function layer is in the opening, a second included angle is formed between an inner wall surface of the chip and a surface of the chip facing the light-transmissive function layer, and is different from the first included angle.
    Type: Application
    Filed: October 30, 2019
    Publication date: May 7, 2020
    Inventors: Chia-Sheng LIN, Hui-Hsien WU, Jian-Hong CHEN, Tsang-Yu LIU, Kuei-Wei CHEN
  • Publication number: 20200116860
    Abstract: A proximity sensing device which is disposed under the OLED panel and has an emitting module and a receiving module, is provided. The emitting module can emit an invisible light which has a peak wavelength not less than 1000 nm. The receiving module is disposed adjacent to the emitting module and can receive a reflecting light from the reflected invisible light. Therefore, the invisible light passing through the OLED panel will not cause a bright spot on the panel.
    Type: Application
    Filed: March 25, 2019
    Publication date: April 16, 2020
    Applicant: Everlight Electronics Co., Ltd.
    Inventors: Shih-Wen Lai, Yi-Ting Huang, Jing-Hong Lai, Chih-Hao Hsu, Chia-Wei Yang, Chih-Min Lin, Chieh-Yu Kang, Kuang-Mao Lu, Jian-Hong Fan
  • Patent number: 10614780
    Abstract: The present disclosure provides a method and system of displaying information, applied to a transparent display configured on a vehicle. The method includes: capturing an image including a target at a first time point; identifying the target in the image, so as to acquire a first relative position of the target; acquiring first identification information of the target; acquiring relative moving information between the vehicle and the target; estimating a first estimated position and first estimated time of the target that appears in a display region of the transparent display according to the first relative position of the target, the first time point and the relative moving information; and displaying prompting information corresponding to the target on the transparent display according to the first estimated time, the first estimated position of the target and the first identification information of the target.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: April 7, 2020
    Assignees: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Chih-Chia Chang, Yu-Hsin Lin, Jian-Lung Chen, Pi-Hsien Wang, Shin-Hong Kuo
  • Publication number: 20190385573
    Abstract: The present disclosure provides a method and system of displaying information, applied to a transparent display configured on a vehicle. The method includes: capturing an image including a target at a first time point; identifying the target in the image, so as to acquire a first relative position of the target; acquiring first identification information of the target; acquiring relative moving information between the vehicle and the target; estimating a first estimated position and first estimated time of the target that appears in a display region of the transparent display according to the first relative position of the target, the first time point and the relative moving information; and displaying prompting information corresponding to the target on the transparent display according to the first estimated time, the first estimated position of the target and the first identification information of the target.
    Type: Application
    Filed: September 6, 2018
    Publication date: December 19, 2019
    Applicants: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Chih-Chia Chang, Yu-Hsin Lin, Jian-Lung Chen, Pi-Hsien Wang, Shin-Hong Kuo
  • Patent number: 10475742
    Abstract: A method of forming a semiconductor device structure includes: forming a first conductive structure over a substrate, the first conductive structure including twin boundaries; and wherein the forming the first conductive structure includes manipulating process conditions so as to promote formation of the twin boundaries resulting in a promoted density of twin boundaries such that the first conductive structure has an increased failure current density (FCD) relative to a baseline FCD of an otherwise substantially corresponding second conductive structure which has an unpromoted density of twin boundaries, the unpromoted density being less than the promoted density and such that the first conductive structure has a resistance which is substantially the same as the second conductive structure.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: November 12, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jian-Hong Lin, Chwei-Ching Chiu, Yung-Huei Lee, Chien-Neng Liao, Yu-Lun Chueh, Tsung-Cheng Chan, Chun-Lung Huang
  • Patent number: 10431541
    Abstract: A semiconductor device for fabricating an IC is provided. The semiconductor device includes an interconnect structure and a first conductive line. The interconnect structure is made of conductive material and includes a first interconnect portion and a second interconnect portion. The second interconnect portion is connected to a first end of the first interconnect portion, and a width of the second interconnect portion is less than a width of the first interconnect portion. The first conductive line is arranged over or below the first interconnect portion and providing an electrical connection between the interconnect structure and an electrical structure. A distance between the first conductive line and the first end is less than a distance between the first conductive line and a second end of the first interconnect portion which is opposite to the first end.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: October 1, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jian-Hong Lin, Hsin-Chun Chang, Hui Lee, Yung-Sheng Huang, Yung-Huei Lee
  • Patent number: 10283450
    Abstract: A method, for forming a semiconductor device structure, includes: forming a conductive structure over a substrate, wherein the conductive structure includes twin boundaries. The forming the conductive structure includes: manipulating process conditions so as to promote formation of the twin boundaries and yet control a density of the twin boundaries to be outside a range for which a portion of a curve is an asymptote of a constant value, the curve representing values of an atomic migration ratio corresponding to values of the density of the twin boundaries.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: May 7, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jian-Hong Lin, Chwei-Ching Chiu, Yung-Huei Lee, Chien-Neng Liao, Yu-Lun Chueh, Tsung-Cheng Chan, Chun-Lung Huang
  • Publication number: 20190103351
    Abstract: A method of forming a semiconductor device structure includes: forming a first conductive structure over a substrate, the first conductive structure including twin boundaries; and wherein the forming the first conductive structure includes manipulating process conditions so as to promote formation of the twin boundaries resulting in a promoted density of twin boundaries such that the first conductive structure has an increased failure current density (FCD) relative to a baseline FCD of an otherwise substantially corresponding second conductive structure which has an unpromoted density of twin boundaries, the unpromoted density being less than the promoted density and such that the first conductive structure has a resistance which is substantially the same as the second conductive structure.
    Type: Application
    Filed: November 30, 2018
    Publication date: April 4, 2019
    Inventors: Jian-Hong LIN, Chwei-Ching CHIU, Yung-Huei LEE, Chien-Neng LIAO, Yu-Lun CHUEH, Tsung-Cheng CHAN, Chun-Lung HUANG
  • Patent number: 10216305
    Abstract: A flexible display panel and device are provided. Data connection touch lines bypass a camera module to electrically couple the data lines at the two sides of the camera module together. Light emitting display can be achieved in a non-display region, thereby increasing a light emitting display area of the flexible display panel.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: February 26, 2019
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Shuang Li, Jian-hong Lin
  • Publication number: 20190035858
    Abstract: A touch array substrate and a touch panel are provided and the touch array substrate has a substrate, an organic electroluminescent pixel unit layer disposed on the substrate, wherein the organic electroluminescent pixel unit layer has an anode layer, a light emitting layer, and a cathode layer, all of which are stacked in sequence. The cathode layer consists of a plurality of sub-cathodes disposed at intervals, and the sub-cathodes are electrically connected to each other.
    Type: Application
    Filed: September 6, 2017
    Publication date: January 31, 2019
    Inventors: Shuang LI, Jian-hong LIN
  • Publication number: 20190034011
    Abstract: A flexible display panel and device are provided. Data connection touch lines bypass a camera module to electrically couple the data lines at the two sides of the camera module together. Light emitting display can be achieved in a non-display region, thereby increasing a light emitting display area of the flexible display panel.
    Type: Application
    Filed: November 8, 2017
    Publication date: January 31, 2019
    Inventors: Shuang LI, Jian-hong LIN
  • Publication number: 20180269148
    Abstract: A semiconductor device for fabricating an IC is provided. The semiconductor device includes an interconnect structure and a first conductive line. The interconnect structure is made of conductive material and includes a first interconnect portion and a second interconnect portion. The second interconnect portion is connected to a first end of the first interconnect portion, and a width of the second interconnect portion is less than a width of the first interconnect portion. The first conductive line is arranged over or below the first interconnect portion and providing an electrical connection between the interconnect structure and an electrical structure. A distance between the first conductive line and the first end is less than a distance between the first conductive line and a second end of the first interconnect portion which is opposite to the first end.
    Type: Application
    Filed: March 20, 2017
    Publication date: September 20, 2018
    Inventors: Jian-Hong LIN, Hsin-Chun CHANG, Hui LEE, Yung-Sheng HUANG, Yung-Huei LEE
  • Publication number: 20180151511
    Abstract: A semiconductor device and a method of manufacture thereof are provided. The method for manufacturing the semiconductor device includes forming a first dielectric layer on a substrate. Next, forming a first dummy metal layer on the first dielectric layer. Then, forming a second dielectric layer over the first dummy metal layer. Furthermore, forming an opening in the second dielectric layer and the first dummy metal layer. Then, forming a dummy via in the opening, wherein the dummy via extending through the second dielectric layer and at least partially through the first dummy metal layer. Finally, forming a second dummy metal layer on the second dielectric layer and contact the dummy via.
    Type: Application
    Filed: January 3, 2017
    Publication date: May 31, 2018
    Inventors: Jian-Hong Lin, Kuo-Yen Liu, Hsin-Chun Chang, Tzu-Li Lee, Yu-Ching Lee, Yih-Ching Wang
  • Patent number: 9941159
    Abstract: A method of making a semiconductor device includes forming a first opening in an insulating layer, forming a second opening in the insulating layer, forming a third opening in the insulating layer and filling the first opening, the second opening and the third opening with a conductive material. The first opening has a width and a length. The second opening has a width less than the length of the first opening, and is electrically connected to the first opening. The third opening has a width less than the width of the second opening, and is electrically connected to the second opening.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: April 10, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jian-Hong Lin, Hsin-Chun Chang, Shiou-Fan Chen, Chwei-Ching Chiu, Yung-Huei Lee
  • Patent number: 9904389
    Abstract: The present invention provides a touch panel wire arrangement circuit, the touch panel wire arrangement circuit comprises: an ITO region, metal wires, a touch control hole and an integrated circuit; the touch panel wire arrangement circuit further comprises: a rear end switch set, and the rear end switch set comprises: a plurality of switches, and a G electrode of each switch in the plurality of switches is inputted with a switch signal, and D electrodes of the plurality of switches are sequentially coupled to rear ends of the metal wires, and S electrodes of the plurality of switches are inputted with at least one voltage signals; the switch signal is: a signal at high voltage level as a touch panel TP signal does not function; the voltage signal is a common voltage V-com signal as the touch panel is in a display state.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: February 27, 2018
    Assignees: Shenzhen China Star Optoelectronics Technology Co., Ltd, Wuhan China Star Optoelectronics Technology Co., Ltd
    Inventor: Jian-Hong Lin
  • Publication number: 20180046044
    Abstract: An embedded touch panel and the manufacturing method thereof are disclosed. The embedded touch panel includes a TFT substrate, a liquid crystal layer, a color filter, a polarizer and a glass cover arranged in sequence, wherein the polarizer is a non-conductive polarizer. A transparent conductive layer is arranged between the polarizer and the color filter. The TFT substrate includes at least one grounded pin, and the transparent conductive layer electrically connects with the grounded pin on the TFT substrate. In view of the above, the transparent conductive layer and the non-conductive polarizer may replace the high impedance polarizer of the embedded touch panel so as to greatly reduce the manufacturing cost. In addition, by bonding the frame of the polarizer, the bubble issue occurring when bonding the polarizer may be avoided.
    Type: Application
    Filed: January 29, 2016
    Publication date: February 15, 2018
    Applicant: Wuhan China Star Optoelectronics Technology Co., Ltd.
    Inventors: Yao-li HUANG, Gui CHEN, Jian-hong LIN
  • Patent number: 9875964
    Abstract: Semiconductor device components and methods are disclosed. In one embodiment, a semiconductor device component includes a conductive segment having a first surface, a second surface opposite the first surface, a first end, and a second end opposite the first end. A first via is coupled to the second surface of the conductive segment at the first end. A second via is coupled to the first surface of the conductive segment at the second end, and a third via is coupled to the second surface of the conductive segment at the second end.
    Type: Grant
    Filed: January 28, 2014
    Date of Patent: January 23, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Bi-Ling Lin, Jian-Hong Lin, Ming-Hong Hsieh, Lee-Der Chen, Jiaw-Ren Shih, Chwei-Ching Chiu