Abstract: A hinge includes a base and a rotating component. The base extends along a first direction, and the rotating component includes a floating plate and a rotating assembly. A first mounting position and a second mounting position are on the floating plate and spaced apart along a second direction. The second direction is orthogonal to the first direction. A first end of the rotating assembly is pivotably coupled to the base, a second end of the rotating assembly is pivotably coupled to the first mounting position and the second mounting position. The rotating assembly is slidable relative to the second mounting position along the second direction.

Abstract: A support assembly, a foldable display screen and a terminal device are provided. The support assembly includes a first support member, a second support member and a third support member. The second support member has a first side and a second side. The first support member is rotatably arranged to the first side of the second support member, and the third support member is rotatably arranged to the second side of the second support member. The first support member is movable between a first locked position and a first unlocked position. The first support member is configured to rotate relative to the second support member, and the second support member and the third support member are configured to be fixed relative to each other when the first support member is in the first locked position. The second support member is configured to rotate relative to the third support member when the first support member is in the first unlocked position.

Abstract: Embodiments of the present application relate to the technical field of communications, and provide a data analysis method, including: obtaining network performance index data before a network is updated as a first data, and obtaining network performance index data after the network is updated as a second data; and outputting a network performance analysis result after the network is updated according to a data volatility of the second data relative to the first data. Embodiments of the present application further provide an electronic device and a storage medium.

Abstract: An ultrasonic transducer device is provided. In some embodiments, the ultrasonic transducer device includes a substrate having a membrane support layer formed on a bottom cavity layer, and an opening in the membrane support layer so as to form a transducer cavity. In some embodiments, the opening comprises a truncated circle shape.

Abstract: A coupling assembly includes: a screw rod; a holder mounted on the screw rod; a shaft sleeve set and a connection rod set. The shaft sleeve set includes: a first shaft sleeve embedded in the holder; and a second shaft sleeve fitted over the screw rod at an outer side and slidable on the screw rod. The connection rod set includes: a first connection rod having an end fixedly coupled to the first shaft sleeve; and a second connection rod having an end fixedly coupled to the second shaft sleeve, the second connection rod and the first connection rod crossing and being coupled at a junction. The first connection rod and the second connection rod cross to form an angle.

Abstract: Described herein are methods and apparatuses for packaging an ultrasound-on-a-chip. An ultrasound-on-a-chip may be coupled to a redistribution layer and to an interposer layer. Encapsulation may encapsulate the ultrasound-on-a-chip device and first metal pillars may extend through the encapsulation and electrically couple to the redistribution layer. Second metal pillars may extend through the interposer layer. The interposer layer may include aluminum nitride. The first metal pillars may be electrically coupled to the second metal pillars. A printed circuit board may be coupled to the interposer layer.

Abstract: An ultrasound transducer device includes: a first insulating layer formed on a first integrated circuit substrate; a second insulating layer formed on the first insulating layer; a third insulating layer formed on the second insulating layer, and a second substrate bonded to the first integrated circuit. A first cavity is formed in the third insulating layer. The second substrate is bonded to the first integrated circuit such that the first cavity is sealed.

Abstract: A method of forming an ultrasound transducer device includes bonding a membrane to a substrate so as to form a sealed cavity between the membrane and the substrate. An exposed surface located within the sealed cavity includes a getter material that is electrically isolated from a bottom electrode of the cavity.

Abstract: A method of forming an ultrasonic transducer device involves depositing a first layer on a substrate, depositing a second layer on the first layer, patterning the second layer at a region corresponding to a location of a transducer cavity, depositing a third layer that refills regions created by patterning the second layer, planarizing the third layer to a top surface of the second layer, removing the second layer, conformally depositing a fourth layer over the first layer and the third layer, defining the transducer cavity in a support layer formed over the fourth layer; and bonding a membrane to the support layer.

Abstract: An ultrasonic transducer device includes a patterned film stack disposed on first regions of a substrate, the patterned film stack including a metal electrode layer and a bottom cavity layer formed on the metal electrode layer. The ultrasonic transducer device further includes a planarized insulation layer disposed on second regions of the substrate layer, a cavity formed in a membrane support layer and a CMP stop layer, the CMP stop layer including a top layer of the patterned film stack and the membrane support layer formed over the patterned film stack and the planarized insulation layer. The ultrasonic transducer device also includes a membrane bonded to the membrane support layer. The CMP stop layer underlies portions of the membrane support layer but not the cavity.

Abstract: A hinge component, a foldable screen assembly and a foldable terminal device are provided. The hinge component includes a support assembly and a linkage assembly, the support assembly includes at least three support members, the at least three support members are arranged side by side, and two adjacent support members are movably connected. The linkage assembly is connected with the at least three support members to achieve a mutual linkage of the at least three support members.

Abstract: A support assembly, a foldable display screen and a terminal device are provided. The support assembly includes a first support member, a second support member and a third support member. The second support member has a first side and a second side. The first support member is rotatably arranged to the first side of the second support member, and the third support member is rotatably arranged to the second side of the second support member. The first support member is movable between a first locked position and a first unlocked position. The first support member is configured to rotate relative to the second support member, and the second support member and the third support member are configured to be fixed relative to each other when the first support member is in the first locked position. The second support member is configured to rotate relative to the third support member when the first support member is in the first unlocked position.

Abstract: A rubber reinforcing filler and a method for preparing rubber reinforcing filler by activation and modification of coal gangue are provided. The method includes the following steps: providing coal gangue raw material; crushing coal gangue raw materials; the crushed coal gangue raw materials are ultrafine grinding to obtain coal gangue particles; coal gangue particles were obtained by air flow classification. Activation of coal gangue particles; the activated gangue particles were surface modified and ground to obtain the modified gangue particles. The invention relates to the field of comprehensive utilization of coal gangue and the technical field of rubber filler. The method is simple and effective, which can complete the blending modification of coupling agent and activated coal gangue particles for surface modification at low cost, so as to avoid the waste of materials in the traditional modification process and realize the preparation of high quality rubber reinforcing filler.

Abstract: A method of forming an ultrasonic transducer device includes bonding a membrane to seal a transducer cavity with at least a portion of a getter material layer being exposed, the getter material layer comprising a portion of a bilayer stack compatible for use in damascene processing.

Abstract: Aspects of the technology described herein relate to ultrasound transducer devices including capacitive micromachined ultrasonic transducers (CMUTs) and methods for forming CMUTs in ultrasound transducer devices. Some embodiments include forming a cavity of a CMUT by forming a first layer of insulating material on a first substrate, forming a second layer of insulating material on the first layer of insulating material, and then etching a cavity in the second insulating material. A second substrate may be bonded to the first substrate to seal the cavity. The first layer of insulating material may include, for example, aluminum oxide. The first substrate may include integrated circuitry. Some embodiments include forming through-silicon vias (TSVs) in the first substrate prior to forming the first and second insulating layers (TSV-Middle process) or subsequent to bonding the first and second substrates (TSV-Last process).

Abstract: A method of forming an ultrasonic transducer device includes forming and patterning a film stack over a substrate, the film stack comprising a metal electrode layer and a chemical mechanical polishing (CMP) stop layer formed over the metal electrode layer; forming an insulation layer over the patterned film stack; planarizing the insulation layer to the CMP stop layer; measuring a remaining thickness of the CMP stop layer; and forming a membrane support layer over the patterned film stack, wherein the membrane support layer is formed at thickness dependent upon the measured remaining thickness of the CMP stop layer, such that a combined thickness of the CMP stop layer and the membrane support layer corresponds to a desired transducer cavity depth.

Abstract: A method of forming an ultrasonic transducer device includes forming an insulating layer having topographic features over a lower transducer electrode layer of a substrate; forming a conformal, anti-stiction layer over the insulating layer such that the conformal layer also has the topographic features; defining a cavity in a support layer formed over the anti-stiction layer; and bonding a membrane to the support layer.

Abstract: A method of manufacturing an ultrasound imaging device involves forming an interposer structure, including forming a first metal material within openings through a substate and on top and bottom surfaces of the substrate, patterning the first metal material, forming a dielectric layer over the patterned first metal material, forming openings within the dielectric layer to expose portions of the patterned first metal material, filling the openings with a second metal material, forming a third metal material on the top and bottom surfaces of the substrate, and patterning the third metal material. The method further involves forming a packaging structure for an ultrasound-on-chip device, including attaching a multi-layer flex substrate to a carrier wafer, bonding a first side of an ultrasound-on-chip device to the multi-layer flex substrate, bonding a second side of the ultrasound-on-chip device to a first side of the interposer structure, and removing the carrier wafer.

Abstract: A foldable screen includes a screen assembly and a housing assembly, the housing assembly includes at least three housings, and the screen assembly covers the at least three housings. The foldable screen includes linked connection assemblies, any two adjacent housings in the at least three housings are connected by the linked connection assemblies, and the at least three housings are unfolded or folded relative to each other at the same time by the linked connection assemblies.