Abstract: A hinge structure and a foldable display device are provided. The hinge structure includes a rotating shaft, a driving assembly and a connecting assembly. The driving assembly is connected to the connecting assembly and the rotating shaft, respectively, and is configured to drive the connecting assembly to move relatively to the rotating shaft in at least one of a hydraulic manner or a pneumatic manner under the drive of the rotating shaft when the rotating shaft rotates.

Abstract: The disclosure relates to a rotating module and an electronic device. The rotating module includes a support, a rotating member, and an elastic damping member. The rotating member includes a first rotating member and a second rotating member connected to the support respectively. A first end of the damping member is fixed to the support. A second end of the damping member is in contact with the rotating member for providing a damping force for relative rotation of the first rotating member and the second rotating member. The second end is an opposite end of the first end. The support is located between the rotating member and the damping member.

Abstract: Embodiments of the present disclosure relate to the field of communications, and disclose a traffic prediction method, including: acquiring traffic data of a first preset time period in a historical period, and pre-processing the traffic data; performing empirical mode decomposition (EMD) on pre-processed traffic data to obtain a plurality of component series; using a time series prediction model to fit the plurality of component series, and using a fitted time series prediction model to obtain a plurality of component prediction results for a second preset time period; accumulating all the component prediction results to obtain a traffic prediction result for the second preset time period. The present disclosure further provides a traffic prediction device and a storage medium.

Abstract: An ultrasound transducer device includes an electrode, a membrane, and vias. The membrane is separated from the electrode by a cavity between the membrane and the electrode. The vias electrically connect the electrode to a substrate disposed on an opposite side of the electrode from a side facing the membrane. The vias are disposed in the ultrasound transducer device such that greater than 50% of the vias overlap with the cavity in a plan view.

Abstract: Provided are a method and apparatus for generating a topological graph, an anomaly detection method and apparatus, a device and a storage medium. The method for generating a topological graph includes acquiring a preset event stream, where the preset event stream corresponds to a normal log execution path; determining a dependent event pair in the preset event stream; determining a range of a transfer interval corresponding to the dependent event pair, where a transfer interval represents the time difference between adjacent occurrences of two events in the dependent event pair; and generating an event topological graph according to the range of the transfer interval and the transfer probability corresponding to the dependent event pair, where the transfer probability represents the conditional probability between the two events in the dependent event pair.

Abstract: Aspects of the disclosure described herein related to packaging an ultrasound-on-a-chip. In some embodiments, an apparatus includes an ultrasound-on-a-chip that has through-silicon vias (TSVs) and an interposer coupled to the ultrasound-on-a-chip and including vias, where the ultrasound-on-a-chip is coupled to the interposer such that the TSVs in the ultrasound-on-a-chip are electrically connected to the vias in the interposer. In some embodiments, an apparatus includes an ultrasound-on-a-chip having bond pads, an interposer that has bond pads and that is coupled to the ultrasound-on-a-chip, and wirebonds extending from the bond pads on the ultrasound-on-a-chip to the bond pads on the interposer.

Abstract: Disclosed are a log parsing method and device, a server and a storage medium, relating to the field of network operation and maintenance. The method includes: acquiring (101) sample log data; performing (102) clustering processing on the sample log data according to the length of each sample log in the sample log data, and beginning and ending keywords of each sample log in the sample log data, to obtain a plurality of log clusters; determining (103) a quality score of each log cluster of the plurality of log clusters obtained by the clustering processing; and parsing (104) a log according to the plurality of log clusters and quality scores of the plurality of log clusters.

Abstract: An electronic face-identification device, which performs face scanning with ultrasonic waves, includes a housing and an ultrasound device disposed within the housing. The ultrasound device may be configured to transmit ultrasonic waves through air to a face and scan the face with the ultrasonic waves, to receive reflected waves through the air corresponding to reflections of the ultrasonic waves from the face, and to perform a recognition process for the face based on reflections of the ultrasonic waves from the face. The ultrasound device may include a plurality of ultrasound transducers, and electronic circuitry configured to transmit signals to the ultrasound transducers and receive signals from the ultrasound transducers. The face-identification device may be incorporated into various electronic equipment, such as hand-held equipment in the form of smartphones and tablet computers, as well as in larger scale installations at airports, workplace entryways, and the like.

Abstract: A ultrasonic transducer device includes a transducer bottom electrode layer disposed over a substrate, and a plurality of vias that electrically connect the bottom electrode layer with the substrate, wherein substantially an entirety of the plurality of vias are disposed directly below a footprint of a transducer cavity. Alternatively, the transducer bottom electrode layer includes a first metal layer in contact with the plurality of vias and a second metal layer formed on the first metal layer, the first metal layer including a same material as the plurality of vias.

Abstract: A coupling assembly includes at least one support part. The support part includes: a first connector including a first cam and a first pin shaft, the first pin shaft being arranged on a side of the first cam; and a second connector including a support plate, a connection block and a support projection, the support projection having a support surface. The connection block has a pin hole with an aperture larger than an outer diameter of the first pin shaft in a predetermined plane parallel to the support plate; the first pin shaft is mounted in the pin hole; the first connector assumes a posture paralleling the predetermined plane, and the first cam is in contact with a first position of the support surface; the second connector assumes a posture intersecting the predetermined plane, and the first cam is in contact with a second position of the support surface.

Abstract: A coupling assembly includes: a screw rod; a holder mounted on the screw rod; a shaft sleeve set and a connection rod set. The shaft sleeve set includes: a first shaft sleeve embedded in the holder; and a second shaft sleeve fitted over the screw rod at an outer side and slidable on the screw rod. The connection rod set includes: a first connection rod having an end fixedly coupled to the first shaft sleeve; and a second connection rod having an end fixedly coupled to the second shaft sleeve, the second connection rod and the first connection rod crossing and being coupled at a junction. The first connection rod and the second connection rod cross to form an angle.

Abstract: The disclosure relates to a rotating module and an electronic device. The rotating module includes a support, a rotating member, and an elastic damping member. The rotating member includes a first rotating member and a second rotating member connected to the support respectively. A first end of the damping member is fixed to the support. A second end of the damping member is in contact with the rotating member for providing a damping force for relative rotation of the first rotating member and the second rotating member. The second end is an opposite end of the first end. The support is located between the rotating member and the damping member.

Abstract: An ultrasonic transducer is described. The ultrasonic transducer comprises a membrane and a substrate disposed opposite the membrane such that a cavity is formed therebetween. The substrate comprises an electrode region and pedestals protruding from a surface of the substrate and having a height greater than a height of the electrode region, the pedestals being electrically isolated from the electrode region.

Abstract: Vertical packaging configurations for ultrasound chips are described. Vertical packaging may involve use of integrated interconnects other than wires for wire bonding. Examples of such integrated interconnects include edge-contact vias, through silicon vias and conductive pillars. Edge-contact vias are vias defined in a trench formed in the ultrasound chip. Multiple vias may be provided for each trench, thus increasing the density of vias. Such vias enable electric access to the ultrasound transducers. Through silicon vias are formed through the silicon handle and provide access from the bottom surface of the ultrasound chip. Conductive pillars, including copper pillars, are disposed around the perimeter of an ultrasound chip and provide access to the ultrasound transducers from the top surface of the chip. Use of these types of packaging techniques can enable a substantial reduction in the dimensions of an ultrasound device.

Abstract: Aspects of the disclosure described herein related to packaging an ultrasound-on-a-chip. In some embodiments, an apparatus includes an ultrasound-on-a-chip that has through-silicon vias (TSVs) and an interposer coupled to the ultrasound-on-a-chip and including vias, where the ultrasound-on-a-chip is coupled to the interposer such that the TSVs in the ultrasound-on-a-chip are electrically connected to the vias in the interposer. In some embodiments, an apparatus includes an ultrasound-on-a-chip having bond pads, an interposer that has bond pads and that is coupled to the ultrasound-on-a-chip, and wirebonds extending from the bond pads on the ultrasound-on-a-chip to the bond pads on the interposer.

Abstract: It is a teaching system for remote hydraulic experiments based on combination of virtual and real, belonging to the field of teaching application. In the virtual simulation teaching system for remote hydraulic experiments based on combination of virtual and real, the virtual and real combination part involves that a hydraulic circuit is simulated by a student by remotely calling the Automation Studio software on the experimental platform, the hydraulic circuit is modified and optimized according to the idea of the student, and the hydraulic experimental platform is connected finally to perform actual operations. The system is also added with a network HD ball machine, a network video recorder, a switch, a ball machine bracket, a router and other devices to form a feedback system, so the student can observe the real-time operation of the hydraulic experimental platform through the feedback system.

Abstract: Aspects of the technology described herein relate to sensing a fingerprint of a subject via an ultrasound fingerprint sensor. Certain aspects relate to transmitting and receiving ultrasound data at multiple different frequencies to provide sensing data from different depths within the skin of the subject. Since different ultrasound frequencies are expected to penetrate a subject's skin to different degrees, sensing a finger at multiple ultrasound frequencies may provide information on different physical aspects of the finger. For instance, sound ultrasound frequencies may sense a surface of the skin, whereas other ultrasound frequencies may penetrate through one or more of the epidermal, dermal or subcutaneous layers. The ultrasound fingerprint apparatus may have utility in various applications, including but not limited to mobile electronic devices, such as mobile phones or tablet computers, a laptop computer or biometric access equipment.

Abstract: Micromachined ultrasonic transducers having a self-assembled monolayer formed on a surface of a sealed cavity are described. A micromachined ultrasonic transducer may include a flexible membrane configured to vibrate over a sealed cavity, and the self-assembled monolayer may coat some or all of the interior surfaces of the sealed cavity. During fabrication, the sealed cavity may be formed by bonding the membrane to a substrate such that the sealed cavity is between the membrane and the substrate. An access hole may be formed through the membrane to the sealed cavity and the self-assembled monolayer is formed on surface(s) of the sealed cavity by introducing precursors into the sealed cavity through the access hole.

Abstract: Described herein are methods and apparatuses for packaging an ultrasound-on-a-chip. An ultrasound-on-a-chip may be coupled to a redistribution layer and to an interposer layer. Encapsulation may encapsulate the ultrasound-on-a-chip device and first metal pillars may extend through the encapsulation and electrically couple to the redistribution layer. Second metal pillars may extend through the interposer layer. The interposer layer may include aluminum nitride. The first metal pillars may be electrically coupled to the second metal pillars. A printed circuit board may be coupled to the interposer layer.