Abstract: A method of forming an ultrasonic transducer device includes forming an insulating layer having topographic features over a lower transducer electrode layer of a substrate; forming a conformal, anti-stiction layer over the insulating layer such that the conformal layer also has the topographic features; defining a cavity in a support layer formed over the anti-stiction layer; and bonding a membrane to the support layer.

Abstract: A method of forming an ultrasonic transducer device includes bonding a membrane to seal a transducer cavity with at least a portion of a getter material layer being exposed, the getter material layer comprising a portion of a bilayer stack compatible for use in damascene processing.

Abstract: A method of forming an ultrasound transducer device includes bonding a membrane to a substrate so as to form a sealed cavity between the membrane and the substrate. An exposed surface located within the sealed cavity includes a getter material that is electrically isolated from a bottom electrode of the cavity.

Abstract: Described herein are methods and apparatuses for packaging an ultrasound-on-a-chip. An ultrasound-on-a-chip may be coupled to a redistribution layer and to an interposer layer. Encapsulation may encapsulate the ultrasound-on-a-chip device and first metal pillars may extend through the encapsulation and electrically couple to the redistribution layer. Second metal pillars may extend through the interposer layer. The interposer layer may include aluminum nitride. The first metal pillars may be electrically coupled to the second metal pillars. A printed circuit board may be coupled to the interposer layer.

Abstract: Vertical packaging configurations for ultrasound chips are described. Vertical packaging may involve use of integrated interconnects other than wires for wire bonding. Examples of such integrated interconnects include edge-contact vias, through silicon vias and conductive pillars. Edge-contact vias are vias defined in a trench formed in the ultrasound chip. Multiple vias may be provided for each trench, thus increasing the density of vias. Such vias enable electric access to the ultrasound transducers. Through silicon vias are formed through the silicon handle and provide access from the bottom surface of the ultrasound chip. Conductive pillars, including copper pillars, are disposed around the perimeter of an ultrasound chip and provide access to the ultrasound transducers from the top surface of the chip. Use of these types of packaging techniques can enable a substantial reduction in the dimensions of an ultrasound device.

Abstract: An ultrasound device is described. The ultrasound device may include a cavity, a membrane, and a sensing electrode. When an electrical signal is applied to the sensing electrode and a static bias is applied to the membrane, the membrane vibrates within the cavity and produces ultrasonic signals. The cavity, the membrane, and the sensing electrode may be considered a capacitive micromachined ultrasonic transducer (CMUT). The sensing electrode may be shaped as a ring, whereby the central portion of the sensing electrode is removed. Removal of the central portion of the sensing electrode may reduce the parasitic capacitance without substantially affecting the production of ultrasonic signals by the CMUT. This, in turn, can result in an increase in the signal-to-noise ratio (SNR) of the ultrasonic signals. The ultrasound device may further include a bond pad configured for wire bonding, and a trench electrically isolating the bond pad from the membrane.

Abstract: Micromachined ultrasonic transducers having pressure ports are described. The micromachined ultrasonic transducers may comprise flexible membranes configured to vibrate over a cavity. The cavity may be sealed, in some instances by the membrane itself. A pressure port may provide access to the cavity, and thus control of the cavity pressure. In some embodiments, an ultrasound device including an array of micromachined ultrasonic transducers is provided, with pressure ports for at least some of the ultrasonic transducers. The pressure ports may be used to control pressure across the array.

Abstract: Aspects of the technology described herein relate to ultrasound transducer devices including capacitive micromachined ultrasonic transducers (CMUTs) and methods for forming CMUTs in ultrasound transducer devices. Some embodiments include forming a cavity of a CMUT by forming a first layer of insulating material on a first substrate, forming a second layer of insulating material on the first layer of insulating material, and then etching a cavity in the second insulating material. A second substrate may be bonded to the first substrate to seal the cavity. The first layer of insulating material may include, for example, aluminum oxide. The first substrate may include integrated circuitry. Some embodiments include forming through-silicon vias (TSVs) in the first substrate prior to forming the first and second insulating layers (TSV-Middle process) or subsequent to bonding the first and second substrates (TSV-Last process).

Abstract: Aspects of the disclosure described herein related to packaging an ultrasound-on-a-chip. In some embodiments, an apparatus includes an ultrasound-on-a-chip that has through-silicon vias (TSVs) and an interposer coupled to the ultrasound-on-a-chip and including vias, where the ultrasound-on-a-chip is coupled to the interposer such that the TSVs in the ultrasound-on-a-chip are electrically connected to the vias in the interposer. In some embodiments, an apparatus includes an ultrasound-on-a-chip having bond pads, an interposer that has bond pads and that is coupled to the ultrasound-on-a-chip, and wirebonds extending from the bond pads on the ultrasound-on-a-chip to the bond pads on the interposer.

Abstract: The present disclosure relates to a key structure and an electronic apparatus. The key structure includes a housing; an electronic switch; a key cap; and a rocker, wherein the housing is provided with an opening configured to mount the key cap, the electronic switch is located inside the housing and corresponds to a position of the opening, and the key cap is mounted in the opening, and wherein the rocker has a first end fixed to the key cap and a second end hinged to the housing, and the rocker has a length larger than or equal to a first predetermined value.

Abstract: A composite catalyst for coal depolymerization, the catalyst includes an agent A and an agent B. The agent A includes an iron salt-based catalyst, and the agent B includes a metal salt-based catalyst different from the iron salt-based catalyst. The agent A and the agent B are alternately added during use.

Abstract: In one example embodiment, a transmitting device includes a memory configured to store computer-readable instructions and a processor configured to execute the computer-readable instructions. The processor is configured to prepare at least one packet, the at least one packet including a portion of a compressed representation of at least one data block, a packet offset value and a block identifier, the block identifier identifying the at least one data block, the packet offset value identifying the portion of the compressed representation of the at least one data block within the compressed representation of the at least one data block and broadcast the at least one packet.

Abstract: The present invention provides a low tack bubble free advertisement film, comprising an advertisement film layer, a dot glue layer and a release layer; a adhesion promoter layer is disposed between the back face of the advertisement film layer and the dot glue layer; the dot glue layer consists of over four independent, separable glue dots; and the area of the dot glue layer is 30-80% of the adhesion promoter layer. The present invention can provide a special advertisement film in the field of advertising consumables. The advertisement film has many advantages, such as low tack, totally bubble free, removable, and can be pasted for a long time. The present invention provides a convenient, efficient, feasible solution for advertising consumables.

Abstract: The present invention provides a low tack bubble free advertisement film, comprising an advertisement film layer, a dot glue layer and a release layer; a adhesion promoter layer is disposed between the back face of the advertisement film layer and the dot glue layer; the dot glue layer consists of over four independent, separable glue dots; and the area of the dot glue layer is 30-80% of the adhesion promoter layer. The present invention can provide a special advertisement film in the field of advertising consumables. The advertisement film has many advantages, such as low tack, totally bubble free, removable, and can be pasted for a long time. The present invention provides a convenient, efficient, feasible solution for advertising consumables.

Abstract: Plasmonic graphene is fabricated using thermally assisted self-assembly of plasmonic nanostructure on graphene. Silver nanostructures were deposited on graphene as an example.

Abstract: A system that indicates the presence or absence of microorganisms in fluid food products. The system has a bottle for receiving sample to be tested. The bottle has a sensor that will monitor and detect changes in at least one sample parameter, but no additives that contain nutrients that support microbial growth. The bottle is placed in an incubator and the sensor in the bottle is monitored for changes. The incubator is programed so that, if the sensor detects that the value of the monitored parameter has reached a certain value, then the sample is determined to be positive for microbial growth.

Abstract: Techniques for testing ultrasonic fingerprint sensors include operating a fingerprint impress simulator that may cyclically press a contact pad of the simulator against a platen of an ultrasonic sensor under test. A control electronics arrangement may operate the ultrasonic sensor under test and the fingerprint impress simulator, and may receive ultrasonic image data from the ultrasonic sensor under test. The ultrasonic sensor may include an ultrasonic transmitter and an ultrasonic sensor array disposed between the ultrasonic transmitter and the platen. The control electronics arrangement may cause the ultrasonic transmitter to emit an ultrasonic pulse, and may receive ultrasonic image data from the ultrasonic sensor array, the ultrasonic image data being converted from a detected portion of the ultrasonic pulse.

Abstract: In one example embodiment, a transmitting device includes a memory configured to store computer-readable instructions and a processor configured to execute the computer-readable instructions. The processor is configured to prepare at least one packet, the at least one packet including a portion of a compressed representation of at least one data block, a packet offset value and a block identifier, the block identifier identifying the at least one data block, the packet offset value identifying the portion of the compressed representation of the at least one data block within the compressed representation of the at least one data block and broadcast the at least one packet.

Abstract: Techniques for testing ultrasonic fingerprint sensors include operating a fingerprint impress simulator that may cyclically press a contact pad of the simulator against a platen of an ultrasonic sensor under test. A control electronics arrangement may operate the ultrasonic sensor under test and the fingerprint impress simulator, and may receive ultrasonic image data from the ultrasonic sensor under test. The ultrasonic sensor may include an ultrasonic transmitter and an ultrasonic sensor array disposed between the ultrasonic transmitter and the platen. The control electronics arrangement may cause the ultrasonic transmitter to emit an ultrasonic pulse, and may receive ultrasonic image data from the ultrasonic sensor array, the ultrasonic image data being converted from a detected portion of the ultrasonic pulse.