Abstract: An ultrasonic transducer device includes a bottom electrode layer of a transducer cavity disposed over a substrate. The bottom electrode layer includes a bottom layer of a first type metal; a top layer of the first type metal; a second type metal disposed between the bottom layer and the top layer; and at least one intermediate layer of the first type metal disposed between the bottom layer and the top layer, the at least one intermediate layer configured so as to define at least two discrete layers of the second type metal.

Abstract: A composite catalyst for coal depolymerization, the catalyst includes an agent A and an agent B. The agent A includes an iron salt-based catalyst, and the agent B includes a metal salt-based catalyst different from the iron salt-based catalyst. The agent A and the agent B are alternately added during use.

Abstract: Aspects of the technology described herein related to an ultrasound device including a first integrated circuit substrate having first integrated ultrasound circuitry and a second integrated circuit substrate having second integrated ultrasound circuitry. The first and second integrated circuit substrates are arranged in a vertical stack. A first conductive pillar is electrically coupled, through a first redistribution layer, to the first integrated circuit substrate, and a second conductive pillar is electrically coupled, through the first and second redistribution layers, to the second integrated circuit substrate.

Abstract: Described herein are methods and apparatuses for packaging an ultrasound-on-a-chip. An ultrasound-on-a-chip may be coupled to a redistribution layer and to an interposer layer. Encapsulation may encapsulate the ultrasound-on-a-chip device and first metal pillars may extend through the encapsulation and electrically couple to the redistribution layer. Second metal pillars may extend through the interposer layer. The interposer layer may include aluminum nitride. The first metal pillars may be electrically coupled to the second metal pillars. A printed circuit board may be coupled to the interposer layer.

Abstract: Vertical packaging configurations for ultrasound chips are described. Vertical packaging may involve use of integrated interconnects other than wires for wire bonding. Examples of such integrated interconnects include edge-contact vias, through silicon vias and conductive pillars. Edge-contact vias are vias defined in a trench formed in the ultrasound chip. Multiple vias may be provided for each trench, thus increasing the density of vias. Such vias enable electric access to the ultrasound transducers. Through silicon vias are formed through the silicon handle and provide access from the bottom surface of the ultrasound chip. Conductive pillars, including copper pillars, are disposed around the perimeter of an ultrasound chip and provide access to the ultrasound transducers from the top surface of the chip. Use of these types of packaging techniques can enable a substantial reduction in the dimensions of an ultrasound device.

Abstract: A system that indicates the presence or absence of microorganisms in fluid food products. The system has a bottle for receiving sample to be tested. The bottle has a sensor that will monitor and detect changes in at least one sample parameter, but no additives that contain nutrients that support microbial growth. The bottle is placed in an incubator and the sensor in the bottle is monitored for changes. The incubator is programed so that, if the sensor detects that the value of the monitored parameter has reached a certain value, then the sample is determined to be positive for microbial growth.

Abstract: An ultrasonic transducer device is provided. In some embodiments, the ultrasonic transducer device includes a substrate having a membrane support layer formed on a bottom cavity layer, and an opening in the membrane support layer so as to form a transducer cavity. In some embodiments, the opening comprises a truncated circle shape.

Abstract: A system that indicates the presence or absence of microorganisms in fluid food products. The system has a bottle for receiving sample to be tested. The bottle has a sensor that will monitor and detect changes in at least one sample parameter, but no additives that contain nutrients that support microbial growth. The bottle is placed in an incubator and the sensor in the bottle is monitored for changes. The incubator is programed so that, if the sensor detects that the value of the monitored parameter has reached a certain value, then the sample is determined to be positive for microbial growth.

Abstract: Vertical packaging configurations for ultrasound chips are described. Vertical packaging may involve use of integrated interconnects other than wires for wire bonding. Examples of such integrated interconnects include edge-contact vias, through silicon vias and conductive pillars. Edge-contact vias are vias defined in a trench formed in the ultrasound chip. Multiple vias may be provided for each trench, thus increasing the density of vias. Such vias enable electric access to the ultrasound transducers. Through silicon vias are formed through the silicon handle and provide access from the bottom surface of the ultrasound chip. Conductive pillars, including copper pillars, are disposed around the perimeter of an ultrasound chip and provide access to the ultrasound transducers from the top surface of the chip. Use of these types of packaging techniques can enable a substantial reduction in the dimensions of an ultrasound device.

Abstract: An electronic face-identification device, which performs face scanning with ultrasonic waves, includes a housing and an ultrasound device disposed within the housing. The ultrasound device may be configured to transmit ultrasonic waves through air to a face and scan the face with the ultrasonic waves, to receive reflected waves through the air corresponding to reflections of the ultrasonic waves from the face, and to perform a recognition process for the face based on reflections of the ultrasonic waves from the face. The ultrasound device may include a plurality of ultrasound transducers, and electronic circuitry configured to transmit signals to the ultrasound transducers and receive signals from the ultrasound transducers. The face-identification device may be incorporated into various electronic equipment, such as hand-held equipment in the form of smartphones and tablet computers, as well as in larger scale installations at airports, workplace entryways, and the like.

Abstract: An electronic device with an ability to perform touch detection includes an ultrasound touch sensor disposed within a housing and configured to detect physical contact with an exterior surface of the housing. The sensor may emit ultrasonic sound waves, receive reflected ultrasonic sound waves reflected from a surface portion corresponding to the physical contact at the exterior surface of the housing, and compare the reflected ultrasonic sound waves to a stored reflection pattern. Based on determining a match between the reflected ultrasonic sound waves and the stored reflection pattern, the electronic device may activate a function. The sensor may be part of an ultrasound-on-a-chip device.

Abstract: A ultrasonic transducer device includes a transducer bottom electrode layer disposed over a substrate, and a plurality of vias that electrically connect the bottom electrode layer with the substrate, wherein substantially an entirety of the plurality of vias are disposed directly below a footprint of a transducer cavity. Alternatively, the transducer bottom electrode layer includes a first metal layer in contact with the plurality of vias and a second metal layer formed on the first metal layer, the first metal layer including a same material as the plurality of vias.

Abstract: An ultrasonic transducer device includes a bottom electrode layer of a transducer cavity disposed over a substrate, and a plurality of vias that electrically connect the bottom electrode layer with the substrate. A bottom cavity layer is disposed over the bottom electrode layer, and one or more openings are formed in the bottom cavity layer so as to expose a region of the bottom electrode layer, wherein locations of the one or more openings are segments that are disposed proximate an outer perimeter of the transducer cavity and substantially correspond to locations where the plurality of vias are not disposed directly beneath.

Abstract: The present disclosure relates to a key structure and an electronic apparatus. The key structure includes a housing; an electronic switch; a key cap; and a rocker, wherein the housing is provided with an opening configured to mount the key cap, the electronic switch is located inside the housing and corresponds to a position of the opening, and the key cap is mounted in the opening, and wherein the rocker has a first end fixed to the key cap and a second end hinged to the housing, and the rocker has a length larger than or equal to a first predetermined value.

Abstract: It is a teaching system for remote hydraulic experiments based on combination of virtual and real, belonging to the field of teaching application. In the virtual simulation teaching system for remote hydraulic experiments based on combination of virtual and real, the virtual and real combination part involves that a hydraulic circuit is simulated by a student by remotely calling the Automation Studio software on the experimental platform, the hydraulic circuit is modified and optimized according to the idea of the student, and the hydraulic experimental platform is connected finally to perform actual operations. The system is also added with a network HD ball machine, a network video recorder, a switch, a ball machine bracket, a router and other devices to form a feedback system, so the student can observe the real-time operation of the hydraulic experimental platform through the feedback system.

Abstract: A method of forming an ultrasonic transducer device includes forming and patterning a film stack over a substrate, the film stack comprising a metal electrode layer and a chemical mechanical polishing (CMP) stop layer formed over the metal electrode layer; forming an insulation layer over the patterned film stack; planarizing the insulation layer to the CMP stop layer; measuring a remaining thickness of the CMP stop layer; and forming a membrane support layer over the patterned film stack, wherein the membrane support layer is formed at thickness dependent upon the measured remaining thickness of the CMP stop layer, such that a combined thickness of the CMP stop layer and the membrane support layer corresponds to a desired transducer cavity depth.

Abstract: A method of forming an ultrasonic transducer device includes forming a patterned metal electrode layer over a substrate, the patterned metal electrode layer comprising a lower layer and an upper layer formed on the lower layer; forming an insulation layer over the patterned metal electrode layer; and planarizing the insulation layer to the upper layer of the patterned metal electrode layer, wherein the upper layer comprises a electrically conductive material that serves as a chemical mechanical polishing (CMP) stop layer that has CMP selectivity with respect to the insulation layer and the lower layer, and wherein the upper layer has a CMP removal rate slower than that of the insulation layer.

Abstract: A method of forming a multiple layer, hybrid interposer structure includes forming a plurality of first openings through a substrate, the substrate comprising a heat spreading material; forming a first metal material within the plurality of first openings and on top and bottom surfaces of the substrate; patterning the first metal material; forming a dielectric layer over the patterned first metal material; forming a plurality of second openings within the dielectric layer to expose portions of the patterned first metal material on the top and bottom surfaces of the substrate; filling the plurality of second openings with a second metal material, in contact with the exposed portions of the patterned first metal material; forming a third metal material on the top and bottom surfaces of the substrate, the third metal material in contact with the second metal material and the dielectric layer; and patterning the third metal material.

Abstract: An ultrasound fingerprint sensor is described. The ultrasound fingerprint sensor may incorporate capacitive ultrasound sensing technology, for example in the form of an array of capacitive ultrasonic transducers. The ultrasound fingerprint sensor may be incorporated into various electronic equipment, such as mobile electronic equipment in the form of smartphones and tablet computers, as well as in biometric sensing equipment, such as fingerprint access terminals.

Abstract: Aspects of the technology described herein relate to sensing a fingerprint of a subject via an ultrasound fingerprint sensor. Certain aspects relate to transmitting and receiving ultrasound data at multiple different frequencies to provide sensing data from different depths within the skin of the subject. Since different ultrasound frequencies are expected to penetrate a subject's skin to different degrees, sensing a finger at multiple ultrasound frequencies may provide information on different physical aspects of the finger. For instance, sound ultrasound frequencies may sense a surface of the skin, whereas other ultrasound frequencies may penetrate through one or more of the epidermal, dermal or subcutaneous layers. The ultrasound fingerprint apparatus may have utility in various applications, including but not limited to mobile electronic devices, such as mobile phones or tablet computers, a laptop computer or biometric access equipment.