Abstract: A method for determining a consistency coefficient of a power-law cement grout includes: determining a water-cement ratio of the power-law cement grout; according to engineering practice requirements, determining a time required to determine the consistency coefficient of the power-law cement grout; and obtaining the consistency coefficient of the power-law cement grout. The method is accurate and reliable, requires less calculation, etc.; and has very high practical value and popularization value in environmental protection and ecological restoration.

Abstract: Embodiments of the present disclosure provide a method and a device for music play. The method comprises receiving a first operation instruction in a target application for playing music; in response to the first operation instruction, presenting a first interface of the target application, the first interface including an operation control for enhancing a play effect of the music through at least one processing, the processing being used for representing music content in a way more than sound; receiving a second operation instruction for the operation control; processing the music based on the second operation instruction during a process of playing the music.

Abstract: A method for determining a three-dimensional tortuosity of a loose and broken rock-soil mass, includes the following steps: a particle grading curve of the loose and broken rock-soil mass is obtained by utilizing a particle size analysis, and followed by calculating an equivalent particle size and an average particle size; a porosity of the loose and broken rock-soil mass is obtained by utilizing a moisture content test, a density test, and a specific gravity test; the three-dimensional tortuosity of the loose and broken rock-soil mass is obtained by utilizing the equivalent particle size, the average particle size and the porosity of the loose and broken rock-soil mass. The method has the advantages of simple logic, accuracy and reliability, simple and fast parameter determination, and has high practical value and promotion value in the field of environmental protection and ecological restoration technology.

Abstract: A method for adjusting system drive letters comprises acquires a system drive letter of an action hard disk in response to the identified action hard disk. If a plugging position of the action hard disk is the extension slot, the slot value corresponding to the action hard disk is acquired. The system drive letter is changed to a slot drive letter based on the slot value. If the system drive letter is shifted, the system drive letter is adjusted to be the slot drive letter for reducing the condition of failing to search or call the files in the action hard disk based on the original system drive letter. A convenience of searching or calling the files in the action hard disk is improved. An electronic device and a computer readable storage medium applying the method are also disclosed.

Abstract: A method for setting a boot disk of a HBA card comprises acquires a physical layer port number corresponding to a slot of a target hard disk. A first identifier for the physical layer port number in a BIOS configuration page in the HBA card is configured. A second identifier for the target hard disk in the BIOS configuration page is configured. The second identifier is written into boot device items of the BIOS configuration page for fixing the target hard disk as a boot disk of the HBA card. The HBA card fails to identify other hard disk as the boot disk under any conditions. Drive letters of the HBA card and the rule of distributing the drive letters are unchanged, and a stability of a system is maintained. An apparatus and a computer readable storage medium applying the method are also disclosed.

Abstract: A method and device for detecting urea are provided. The method for detecting urea includes the following steps. A derivatization reagent reacts with a sample to obtain a mixture, wherein a reaction time period for reacting urea in the sample with the derivatization reagent to form a derivative product is controlled. The derivative product is separated from the mixture. The amount of separated derivative product is analyzed to determine the concentration of urea in the sample.

Abstract: A package includes a corner, a device die, a plurality of redistribution lines underlying the device die, and a plurality of metal pads electrically coupled to the plurality of redistribution lines. The plurality of metal pads includes a corner metal pad closest to the corner, wherein the corner metal pad is a center-facing pad having a bird-beak direction substantially pointing to a center of the package. The plurality of metal pads further includes a metal pad farther away from the corner than the corner metal pad, wherein the metal pad is a non-center-facing pad having a bird-beak direction pointing away from the center of the package.

Abstract: The present disclosure discloses a vibration exciter comprising: a housing having a housing cavity, a stator assembly fixed in the housing, and a vibrator assembly housed in the housing cavity and driven to vibrate by the stator assembly; the stator assembly comprises a pole core fixedly attached to the inner side of the housing and a magnet fixedly attached to the side of the pole core that is back from the housing; the vibrator assembly includes a bracket housed in the housing cavity, a coil wound on the outside of the bracket, a counterweight fixed to the bracket, and a column assembly fixed to the end of the bracket and elastically connected to the housing; the bracket is a solid structure. When the coil is wound, it is wrapped around the bracket and column assembly, which is not easily deformed and improves the consistency of the coil shape.

Abstract: A method of forming a package includes bonding a device die to an interposer wafer, with the interposer wafer including metal lines and vias, forming a dielectric region to encircle the device die, and forming a through-via to penetrate through the dielectric region. The through-via is electrically connected to the device die through the metal lines and the vias in the interposer wafer. The method further includes forming a polymer layer over the dielectric region, and forming an electrical connector. The electrical connector is electrically coupled to the through-via through a conductive feature in the polymer layer. The interposer wafer is sawed to separate the package from other packages.

Abstract: A method of forming an integrated circuit (IC) package with improved performance and reliability is disclosed. The method includes forming a singulated IC die, coupling the singulated IC die to a carrier substrate, and forming a routing structure. The singulated IC die has a conductive via and the conductive via has a peripheral edge. The routing structure has a conductive structure coupled to the conductive via. The routing structure further includes a cap region overlapping an area of the conductive via, a routing region having a first width from a top-down view, and an intermediate region having a second width from the top-down view along the peripheral edge of the conductive via. The intermediate region is arranged to couple the cap region to the routing region and the second width is greater than the first width.

Abstract: A screen capture method includes: determining a first touch control operation, where the first touch control operation is a movement operation in which a plurality of touch control points move by a distance greater than or equal to a first preset distance threshold in a first screen, the first screen includes N split-screens, and N is a positive integer greater than 1; determining whether start positions of the plurality of touch control points during the movement in the first touch control operation are all located in a target split-screen in the first screen, where the target split-screen is any one of the N split-screens; and if the start positions of the plurality of touch control points during the movement are all located in the target split-screen in the first screen, capturing current display content of the target split-screen as a first screenshot.

Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.

Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.

Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.

Abstract: Microelectronic packages and methods of fabrication are described. In an embodiment, a redistribution layer spans across multiple components, and includes a region of patterned wiring traces that may mitigate stress in the RDL between the multiple components.