Patents by Inventor Jie Hua

Jie Hua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190348366
    Abstract: A method of forming an integrated circuit (IC) package with improved performance and reliability is disclosed. The method includes forming a singulated IC die, coupling the singulated IC die to a carrier substrate, and forming a routing structure. The singulated IC die has a conductive via and the conductive via has a peripheral edge. The routing structure has a conductive structure coupled to the conductive via. The routing structure further includes a cap region overlapping an area of the conductive via, a routing region having a first width from a top-down view, and an intermediate region having a second width from the top-down view along the peripheral edge of the conductive via. The intermediate region is arranged to couple the cap region to the routing region and the second width is greater than the first width.
    Type: Application
    Filed: July 24, 2019
    Publication date: November 14, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jie CHEN, Ying-Ju CHEN, Hsien-Wei CHEN, Der-Chyang YEH, Chen-Hua YU
  • Publication number: 20190347998
    Abstract: A pixel driving circuit, a driving method thereof, and a display device are provided. According to the pixel driving circuit, a data voltage is provided to a first electrode of a driving transistor; a storage sub-circuit is charged or discharged; a first voltage signal from a first voltage terminal is provided to a control electrode of the driving transistor, and a second voltage signal from a second voltage terminal or a third voltage signal from a third voltage terminal is provided to a first node; the data voltage and a threshold voltage of the driving transistor are written to the control electrode of the driving transistor, to turn on a second electrode of the driving transistor and the third voltage terminal, to control a light-emitting element to emit light.
    Type: Application
    Filed: November 29, 2018
    Publication date: November 14, 2019
    Inventors: Lei Hua, Jie Ling, Donghui Wang
  • Publication number: 20190319626
    Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.
    Type: Application
    Filed: February 4, 2019
    Publication date: October 17, 2019
    Inventors: Sanjay Dabral, Bahattin Kilic, Jie-Hua Zhao, Kunzhong Hu, Suk-Kyu Ryu
  • Patent number: 10366953
    Abstract: An integrated circuit (IC) package with improved performance and reliability is disclosed. The IC package includes an IC die and a routing structure. The IC die includes a conductive via having a peripheral edge. The routing structure includes a conductive structure coupled to the conductive via. The conductive structure may include a cap region, a routing region, and an intermediate region. The cap region may overlap an area of the conductive via. The routing region may have a first width and the intermediate region may have a second width along the peripheral edge of the conductive via, where the second width may be greater than the first width. The intermediate region may be arranged to connect the cap region to the routing region.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: July 30, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jie Chen, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Ying-Ju Chen
  • Publication number: 20190223904
    Abstract: A pericardium puncture needle assembly includes a puncture needle and a guide wire capable of sliding in the puncture needle; or includes an outer sleeve and a guide wire capable of sliding in the outer sleeve; or includes an outer sleeve and a puncture needle and a guide wire capable of sliding in the outer sleeve, wherein after the puncture needle is pulled out of the outer sleeve, the guide wire is capable of sliding in the outer sleeve. The guide wire is made of a highly elastic material and includes a far-end bent segment. The far-end bent segment is formed by bending the guide wire and has a preset bending shape, and is suitable for being recovered from a stretching state to the preset bending shape. The tip of the far-end bent segment has a pointed structure.
    Type: Application
    Filed: April 1, 2019
    Publication date: July 25, 2019
    Inventors: Ji FENG, Jie GONG, Xin HUA, Chang-sheng MA, Sophia Wang HANSEN
  • Publication number: 20190199706
    Abstract: Systems and methods are provided for facilitating account login, wherein the method is implemented by a first server that is associated with a first account. In some embodiments, the method comprises receiving, from a terminal device, a request to log into a second account associated with a second server, wherein the request includes a first identifier associated with the first account and a second identifier associated with the second server. The method further comprises generating account information to be transmitted to the second server based on the first identifier; and transmitting the account information to the second server based on the second identifier; wherein the transmission of the account information enables the second account to be automatically logged into at the second server.
    Type: Application
    Filed: February 28, 2019
    Publication date: June 27, 2019
    Inventor: Jie HUA
  • Patent number: 10313327
    Abstract: Systems and methods are provided for facilitating account login, wherein the method is implemented by a first server that is associated with a first account. In some embodiments, the method comprises receiving, from a terminal device, a request to log into a second account associated with a second server, wherein the request includes a first identifier associated with the first account and a second identifier associated with the second server. The method further comprises generating account information to be transmitted to the second server based on the first identifier; and transmitting the account information to the second server based on the second identifier; wherein the transmission of the account information enables the second account to be automatically logged into at the second server.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: June 4, 2019
    Assignee: Alibaba Group Holding Limited
    Inventor: Jie Hua
  • Patent number: 9656856
    Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: May 23, 2017
    Assignee: Apple Inc.
    Inventors: Tongbi Jiang, Jie-Hua Zhao, Peter G. Hartwell
  • Patent number: 9633953
    Abstract: A methodology for addressing package warpage is described. In an embodiment a package includes a die mounted on a wiring board. Portion of a metal plane within the wiring board includes a reduced portion, characterized by a reduced thickness that is less than a baseline thickness.
    Type: Grant
    Filed: October 20, 2014
    Date of Patent: April 25, 2017
    Assignee: Apple Inc.
    Inventors: Jun Chung Hsu, Jie-Hua Zhao
  • Publication number: 20160340175
    Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
    Type: Application
    Filed: August 2, 2016
    Publication date: November 24, 2016
    Inventors: Tongbi Jiang, Jie-Hua Zhao, Peter G. Hartwell
  • Patent number: D786315
    Type: Grant
    Filed: February 14, 2016
    Date of Patent: May 9, 2017
    Assignee: Cixi Huazhijie Plastic Product Co., Ltd.
    Inventors: Shimin Hua, Jie Hua
  • Patent number: D786635
    Type: Grant
    Filed: August 23, 2015
    Date of Patent: May 16, 2017
    Assignee: Cixi Huazhijie Plastic Product Co., Ltd.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D815153
    Type: Grant
    Filed: February 14, 2016
    Date of Patent: April 10, 2018
    Assignee: Cixi Huazhijie Plastic Product Co., Ltd.
    Inventors: Shimin Hua, Jie Hua
  • Patent number: D822292
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: July 3, 2018
    Assignees: Cixi Huazhijie Plastic Co., Ltd., Shanghai Uwin International Trade Co., Ltd.
    Inventors: Jie Hua, Yi Qing
  • Patent number: D852432
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: June 25, 2019
    Assignee: Cixi Huazhijie Plastic Co., Ltd.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D852433
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: June 25, 2019
    Assignee: Cixi Huazhijie Plastic Product Co., Ltd.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D852434
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: June 25, 2019
    Assignee: Cixi Huazhijie Plastic Product Co., Ltd.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D862182
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: October 8, 2019
    Assignee: CIXI HUAZHIJIE PLASTIC PRODUCT CO., LTD.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D863902
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: October 22, 2019
    Assignee: CIXI HUAZHIJIE PLASTIC PRODUCT CO., LTD.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D863903
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: October 22, 2019
    Assignee: CIXI HUAZHIJIE PLASTIC PRODUCT CO., LTD.
    Inventors: Jie Hua, Shimin Hua