Patents by Inventor Jie Hua

Jie Hua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12249599
    Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.
    Type: Grant
    Filed: March 31, 2023
    Date of Patent: March 11, 2025
    Assignee: Apple Inc.
    Inventors: Wei Chen, Jie-Hua Zhao, Jun Zhai, Po-Hao Chang, Hsien-Che Lin, Ying-Chieh Ke, Kunzhong Hu
  • Publication number: 20250046674
    Abstract: A module comprising: a module substrate; a system-on-chip die coupled to the module substrate; a thermal interface material layer coupled to the system-on-chip die; a stiffener structure positioned around the system-on-chip die and coupled to the module substrate; and a lid having a first portion coupled to the thermal interface material layer, a second portion coupled to the stiffener structure and a recessed region formed around the first portion and having a reduced thickness relative to the first portion and the second portion.
    Type: Application
    Filed: August 3, 2023
    Publication date: February 6, 2025
    Inventors: Suk-Kyu Ryu, Wei Hu, Jie-Hua Zhao, Myung Jin Yim
  • Publication number: 20240421013
    Abstract: Integrated circuit (IC) structure, IC die structures and methods of fabrication are described in which one or more edge recesses are formed in an IC die. Upon direct bonding to an electronic component, a molding compound can be applied to the bonded structure where the molding compound fills the one or more edge recesses and encroached underneath the IC die and between the IC die and the electronic component.
    Type: Application
    Filed: February 23, 2024
    Publication date: December 19, 2024
    Inventors: Jixuan Gong, Vidhya Ramachandran, Jie-Hua Zhao, Young Doo Jeon, Wei Chen, Jun Zhai
  • Publication number: 20240421126
    Abstract: Integrated circuit (IC) structures, electronic modules, and methods of fabrication are described in which direct bonded interfaces are removed at corners or edges to counteract the potential for non-bonding or delamination. This can be accomplished during singulation, in which a side recess is formed through an entire thickness of an electronic component and into a direct bonded die, followed by final singulation of the IC structure.
    Type: Application
    Filed: March 7, 2024
    Publication date: December 19, 2024
    Inventors: Chi Nung Ni, Wei Chen, Weiming Chris Chen, Vidhya Ramachandran, Jie-Hua Zhao, Suk-Kyu Ryu, Myung Jin Yim, Chih-Ming Chung, Jun Zhai, Young Doo Jeon, Seungjae Lee
  • Publication number: 20240395686
    Abstract: Electronic packages and electronic systems are described in which a package redistribution layer of the electronic package includes structural features such a via line connections to reduce stress concentration, particularly when the package redistribution layer is formed of organic dielectric materials.
    Type: Application
    Filed: May 26, 2023
    Publication date: November 28, 2024
    Inventors: Wei Chen, Jie-Hua Zhao, Jun Zhai, Kunzhong Hu, Arun Sasi, Balaji Nandhivaram Muthuraman, Zezhou Liu
  • Patent number: 12141265
    Abstract: Systems and methods are provided for facilitating account login, wherein the method is implemented by a first server that is associated with a first account. In some embodiments, the method comprises receiving, from a terminal device, a request to log into a second account associated with a second server, wherein the request includes a first identifier associated with the first account and a second identifier associated with the second server. The method further comprises generating account information to be transmitted to the second server based on the first identifier; and transmitting the account information to the second server based on the second identifier; wherein the transmission of the account information enables the second account to be automatically logged into at the second server.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: November 12, 2024
    Assignee: Advanced New Technologies Co., Ltd.
    Inventor: Jie Hua
  • Patent number: 12119275
    Abstract: Modules and methods of assembly are described. A module includes a lid mounted on a module substrate and covering a component. A stiffener structure may optionally be mounted between the lid and module substrate. A recess can be formed in any of an outer wall bottom surface of the lid, and top or bottom surface of the stiffener structure such that an adhesive layer at least partially fills the recess.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: October 15, 2024
    Assignee: Apple Inc.
    Inventors: Wei Chen, Jie-Hua Zhao, Jun Zhai
  • Publication number: 20240249989
    Abstract: Microelectronic structures with selectively applied underfill material and/or edge bond material are described. In an embodiment, isolated underfill regions and/or edge bond regions are applied to adjacent to one or more edges of an electronic device and form a plurality of vent openings along the one or more edges.
    Type: Application
    Filed: January 23, 2023
    Publication date: July 25, 2024
    Inventors: Wei Chen, Balaji Nandhivaram Muthuraman, Arun Sasi, Jie-Hua Zhao, Suk-Kyu Ryu, Jun Zhai, Dominic Morache, Young Doo Jeon
  • Publication number: 20240039539
    Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.
    Type: Application
    Filed: October 5, 2023
    Publication date: February 1, 2024
    Inventors: Sanjay Dabral, Bahattin Kilic, Jie-Hua Zhao, Kunzhong Hu, Suk-Kyu Ryu
  • Patent number: 11831312
    Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: November 28, 2023
    Assignee: Apple Inc.
    Inventors: Sanjay Dabral, Bahattin Kilic, Jie-Hua Zhao, Kunzhong Hu, Suk-Kyu Ryu
  • Publication number: 20230317624
    Abstract: Microelectronic packages and methods of fabrication are described. In an embodiment, a redistribution layer spans across multiple components, and includes a region of patterned wiring traces that may mitigate stress in the RDL between the multiple components.
    Type: Application
    Filed: November 28, 2022
    Publication date: October 5, 2023
    Inventors: Wei Chen, Yi Xu, Jie-Hua Zhao, Jun Zhai
  • Publication number: 20230317708
    Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 5, 2023
    Inventors: Wei Chen, Jie-Hua Zhao, Jun Zhai, Po-Hao Chang, Hsien-Che Lin, Ying-Chieh Ke, Kunzhong Hu
  • Patent number: D998558
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: September 12, 2023
    Assignee: SBI SMART BRANDS INTERNATIONAL (AMERICA) LIMITED
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D1021279
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: April 2, 2024
    Assignee: CIXI HUAZHIJIE PLASTIC PRODUCT CO., LTD.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D1035169
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: July 9, 2024
    Assignee: CIXI HUAZHIJIE PLASTIC PRODUCT CO., LTD.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D1043280
    Type: Grant
    Filed: June 14, 2022
    Date of Patent: September 24, 2024
    Assignee: CIXI HUAZHIJIE PLASTIC PRODUCT CO., LTD.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D1056653
    Type: Grant
    Filed: October 31, 2022
    Date of Patent: January 7, 2025
    Assignee: CIXI HUAZHIJIE PLASTIC PRODUCT CO., LTD.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D1066195
    Type: Grant
    Filed: June 19, 2023
    Date of Patent: March 11, 2025
    Assignee: CIXI HUAZHIJIE PLASTIC PRODUCT CO., LTD.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D1069526
    Type: Grant
    Filed: January 30, 2024
    Date of Patent: April 8, 2025
    Assignee: CIXI HUAZHIJIE PLASTIC PRODUCT CO., LTD.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D1073419
    Type: Grant
    Filed: July 13, 2023
    Date of Patent: May 6, 2025
    Assignee: CIXI HUAZHIJIE PLASTIC PRODUCTS CO., LTD.
    Inventors: Jie Hua, Shimin Hua