Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.

Abstract: The present invention discloses a shovel handle connecting device, including a connecting assembly configured to connect a shovel handle and a shovel scoop, wherein the connecting assembly includes a connecting member and a connecting seat; a front end of the connecting member is provided with a connecting portion and a limiting portion, a limiting fastener is arranged on the connecting portion, and the connecting seat is embedded in the shovel scoop; the connecting seat is internally provided with a connecting groove allowing the connecting portion to be inserted therein, and an inner wall of the connecting groove is provided with a limiting groove allowing the limiting fastener to be snapped therein; the connecting member is inserted and fixed in the connecting seat; and one section of an outer side wall of the limiting portion and one section of an inner side wall of the connecting seat are formed into an accommodating cavity in an enclosure mode, and one end of the shovel handle is inserted and fixed in t

Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.

Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.

Abstract: A seedling transplanting device, includes: a handheld rod (1); a seedling digging assembly; wherein the seedling digging assembly includes: a fixed insertion member (2); a movable insertion member (3) with a top and a bottom, the movable insertion member is separated by a space from the fixed insertion member (2); and a driving assembly connected to the movable insertion member, the driving assembly causes the movable insertion member (3) to swing toward the fixed insertion member (2). The driving assembly causes the movable insertion member to swing toward the fixed insertion member, and after the seedling is taken out, the soil with the seedling will not drop out from the bottom of the fixed insertion member and the movable insertion member.

Abstract: The present invention discloses a seedling transplanting device, which comprises: a handheld rod (1); a seedling digging assembly; wherein the seedling digging assembly comprises: a fixed insertion member (2); a movable insertion member (3) with a top and a bottom, the movable insertion member is separated by a space from the fixed insertion member (2); and a driving assembly connected to the movable insertion member, the driving assembly causes the movable insertion member (3) to swing toward the fixed insertion member (2). In the present invention, the driving assembly causes the movable insertion member to swing toward the fixed insertion member, and after the seedling is taken out, the soil with the seedling will not drop out from the bottom of the fixed insertion member and the movable insertion member.

Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.

Abstract: Systems and methods are provided for facilitating account login, wherein the method is implemented by a first server that is associated with a first account. In some embodiments, the method comprises receiving, from a terminal device, a request to log into a second account associated with a second server, wherein the request includes a first identifier associated with the first account and a second identifier associated with the second server. The method further comprises generating account information to be transmitted to the second server based on the first identifier; and transmitting the account information to the second server based on the second identifier; wherein the transmission of the account information enables the second account to be automatically logged into at the second server.