Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.

Abstract: A seedling transplanting device, includes: a handheld rod (1); a seedling digging assembly; wherein the seedling digging assembly includes: a fixed insertion member (2); a movable insertion member (3) with a top and a bottom, the movable insertion member is separated by a space from the fixed insertion member (2); and a driving assembly connected to the movable insertion member, the driving assembly causes the movable insertion member (3) to swing toward the fixed insertion member (2). The driving assembly causes the movable insertion member to swing toward the fixed insertion member, and after the seedling is taken out, the soil with the seedling will not drop out from the bottom of the fixed insertion member and the movable insertion member.

Abstract: The present invention discloses a seedling transplanting device, which comprises: a handheld rod (1); a seedling digging assembly; wherein the seedling digging assembly comprises: a fixed insertion member (2); a movable insertion member (3) with a top and a bottom, the movable insertion member is separated by a space from the fixed insertion member (2); and a driving assembly connected to the movable insertion member, the driving assembly causes the movable insertion member (3) to swing toward the fixed insertion member (2). In the present invention, the driving assembly causes the movable insertion member to swing toward the fixed insertion member, and after the seedling is taken out, the soil with the seedling will not drop out from the bottom of the fixed insertion member and the movable insertion member.

Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.

Abstract: Systems and methods are provided for facilitating account login, wherein the method is implemented by a first server that is associated with a first account. In some embodiments, the method comprises receiving, from a terminal device, a request to log into a second account associated with a second server, wherein the request includes a first identifier associated with the first account and a second identifier associated with the second server. The method further comprises generating account information to be transmitted to the second server based on the first identifier; and transmitting the account information to the second server based on the second identifier; wherein the transmission of the account information enables the second account to be automatically logged into at the second server.

Abstract: Systems and methods are provided for facilitating account login, wherein the method is implemented by a first server that is associated with a first account. In some embodiments, the method comprises receiving, from a terminal device, a request to log into a second account associated with a second server, wherein the request includes a first identifier associated with the first account and a second identifier associated with the second server. The method further comprises generating account information to be transmitted to the second server based on the first identifier; and transmitting the account information to the second server based on the second identifier; wherein the transmission of the account information enables the second account to be automatically logged into at the second server.

Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.