Patents by Inventor Jie Hua

Jie Hua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11483954
    Abstract: A shovel handle connecting device includes a connecting assembly configured to connect a shovel handle and a shovel scoop. The connecting assembly includes a connecting seat embedded in the shovel scoop and a connecting member inserted and fixed in the connecting seat; a front end of the connecting member is provided with a connecting portion and a limiting portion, a limiting fastener is arranged on the connecting portion; the connecting seat is internally provided with a connecting groove allowing the connecting portion to be inserted therein, and an inner wall of the connecting groove is provided with a limiting groove allowing the limiting fastener to be snapped therein; an outer side wall of the limiting portion and an inner side wall of the connecting seat are formed into an accommodating cavity in an enclosure mode, and one end of the shovel handle is inserted and fixed in the accommodating cavity.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: November 1, 2022
    Assignee: CiXi HuaJie Plastic Product Co., Ltd.
    Inventors: Jie Hua, Shimin Hua
  • Publication number: 20220231687
    Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.
    Type: Application
    Filed: February 23, 2022
    Publication date: July 21, 2022
    Inventors: Sanjay Dabral, Bahattin Kilic, Jie-Hua Zhao, Kunzhong Hu, Suk-Kyu Ryu
  • Publication number: 20220215082
    Abstract: Systems and methods are provided for facilitating account login, wherein the method is implemented by a first server that is associated with a first account. In some embodiments, the method comprises receiving, from a terminal device, a request to log into a second account associated with a second server, wherein the request includes a first identifier associated with the first account and a second identifier associated with the second server. The method further comprises generating account information to be transmitted to the second server based on the first identifier; and transmitting the account information to the second server based on the second identifier; wherein the transmission of the account information enables the second account to be automatically logged into at the second server.
    Type: Application
    Filed: March 21, 2022
    Publication date: July 7, 2022
    Inventor: Jie Hua
  • Patent number: 11309895
    Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: April 19, 2022
    Assignee: Apple Inc.
    Inventors: Sanjay Dabral, Bahattin Kilic, Jie-Hua Zhao, Kunzhong Hu, Suk-Kyu Ryu
  • Patent number: 11281762
    Abstract: Systems and methods are provided for facilitating account login, wherein the method is implemented by a first server that is associated with a first account. In some embodiments, the method comprises receiving, from a terminal device, a request to log into a second account associated with a second server, wherein the request includes a first identifier associated with the first account and a second identifier associated with the second server. The method further comprises generating account information to be transmitted to the second server based on the first identifier; and transmitting the account information to the second server based on the second identifier; wherein the transmission of the account information enables the second account to be automatically logged into at the second server.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: March 22, 2022
    Assignee: ALIBABA GROUP HOLDING LIMITED
    Inventor: Jie Hua
  • Publication number: 20210305227
    Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.
    Type: Application
    Filed: September 4, 2020
    Publication date: September 30, 2021
    Inventors: Wei Chen, Jie-Hua Zhao, Jun Zhai, Po-Hao Chang, Hsien-Che Lin, Ying-Chieh Ke, Kunzhong Hu
  • Publication number: 20210243932
    Abstract: The present invention discloses a shovel handle connecting device, including a connecting assembly configured to connect a shovel handle and a shovel scoop, wherein the connecting assembly includes a connecting member and a connecting seat; a front end of the connecting member is provided with a connecting portion and a limiting portion, a limiting fastener is arranged on the connecting portion, and the connecting seat is embedded in the shovel scoop; the connecting seat is internally provided with a connecting groove allowing the connecting portion to be inserted therein, and an inner wall of the connecting groove is provided with a limiting groove allowing the limiting fastener to be snapped therein; the connecting member is inserted and fixed in the connecting seat; and one section of an outer side wall of the limiting portion and one section of an inner side wall of the connecting seat are formed into an accommodating cavity in an enclosure mode, and one end of the shovel handle is inserted and fixed in t
    Type: Application
    Filed: July 24, 2019
    Publication date: August 12, 2021
    Inventors: Jie HUA, Shimin HUA
  • Publication number: 20200389172
    Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.
    Type: Application
    Filed: June 25, 2020
    Publication date: December 10, 2020
    Inventors: Sanjay Dabral, Bahattin Kilic, Jie-Hua Zhao, Kunzhong Hu, Suk-Kyu Ryu
  • Patent number: 10742217
    Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: August 11, 2020
    Assignee: Apple Inc.
    Inventors: Sanjay Dabral, Bahattin Kilic, Jie-Hua Zhao, Kunzhong Hu, Suk-Kyu Ryu
  • Patent number: 10687459
    Abstract: A seedling transplanting device, includes: a handheld rod (1); a seedling digging assembly; wherein the seedling digging assembly includes: a fixed insertion member (2); a movable insertion member (3) with a top and a bottom, the movable insertion member is separated by a space from the fixed insertion member (2); and a driving assembly connected to the movable insertion member, the driving assembly causes the movable insertion member (3) to swing toward the fixed insertion member (2). The driving assembly causes the movable insertion member to swing toward the fixed insertion member, and after the seedling is taken out, the soil with the seedling will not drop out from the bottom of the fixed insertion member and the movable insertion member.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: June 23, 2020
    Assignee: Cixi Huazhijie Plastic Product Co., Ltd.
    Inventors: Jie Hua, Shimin Hua
  • Publication number: 20200077575
    Abstract: The present invention discloses a seedling transplanting device, which comprises: a handheld rod (1); a seedling digging assembly; wherein the seedling digging assembly comprises: a fixed insertion member (2); a movable insertion member (3) with a top and a bottom, the movable insertion member is separated by a space from the fixed insertion member (2); and a driving assembly connected to the movable insertion member, the driving assembly causes the movable insertion member (3) to swing toward the fixed insertion member (2). In the present invention, the driving assembly causes the movable insertion member to swing toward the fixed insertion member, and after the seedling is taken out, the soil with the seedling will not drop out from the bottom of the fixed insertion member and the movable insertion member.
    Type: Application
    Filed: March 13, 2017
    Publication date: March 12, 2020
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D876022
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: February 18, 2020
    Assignee: CIXI HUAZHIJIE PLASTIC PRODUCT CO., LTD.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D896045
    Type: Grant
    Filed: July 4, 2019
    Date of Patent: September 15, 2020
    Assignee: CIXI HUAZHIJIE PLASTIC PRODUCT CO., LTD.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D903950
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: December 1, 2020
    Assignee: CIXI HUAZHIJIE PLASTIC PRODUCT CO., LTD.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D908323
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: January 26, 2021
    Assignee: CIXI HUAJIE PLASTIC PRODUCT CO., LTD.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D942777
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: February 8, 2022
    Assignee: CIXI HUAZHIJIE PLASTIC PRODUCT CO., LTD.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D943371
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: February 15, 2022
    Assignee: CIXI HUAZHIJIE PLASTIC PRODUCT CO., LTD.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D947626
    Type: Grant
    Filed: January 31, 2021
    Date of Patent: April 5, 2022
    Assignee: CIXI HUAZHIJIE PLASTIC PRODUCT CO., LTD.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D952957
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: May 24, 2022
    Assignee: CIXI HUAZHIJIE PLASTIC PRODUCT CO., LTD.
    Inventors: Jie Hua, Shimin Hua
  • Patent number: D959940
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: August 9, 2022
    Assignee: CIXI HUAZHIJIE PLASTIC PRODUCT CO., LTD.
    Inventors: Jie Hua, Shimin Hua