Patents by Inventor Jin Chae

Jin Chae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240429080
    Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.
    Type: Application
    Filed: September 5, 2024
    Publication date: December 26, 2024
    Inventors: Sunna Chung, Ryan Park, Jin Chae, Matthew Stanton Whitlock, Jonathan Kevin Lie, Athens Okoren
  • Patent number: 12106988
    Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: October 1, 2024
    Assignee: Daewon Semiconductor Packaging Industrial Company
    Inventors: Sunna Chung, Ryan Park, Jin Chae, Matthew Stanton Whitlock, Jonathan Kevin Lie, Athens Okoren
  • Publication number: 20230005771
    Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.
    Type: Application
    Filed: February 18, 2022
    Publication date: January 5, 2023
    Inventors: Sunna Chung, Ryan Park, Jin Chae, Matthew Stanton Whitlock, Jonathan Kevin Lie, Athens Okoren
  • Patent number: 11257700
    Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: February 22, 2022
    Assignee: Daewon Semiconductor Packaging Industrial Company
    Inventors: Sunna Chung, Ryan Park, Jin Chae, Matthew Whitlock, Jonathan Lie, Athens Okoren
  • Publication number: 20190067062
    Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.
    Type: Application
    Filed: August 29, 2018
    Publication date: February 28, 2019
    Inventors: Sunna Chang, Ryan Park, Jin Chae, Matthew Whitlock, Jonathan Lie, Athens Okoren
  • Publication number: 20190067064
    Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.
    Type: Application
    Filed: August 29, 2018
    Publication date: February 28, 2019
    Inventors: Sunna Chang, Ryan Park, Jin Chae, Matthew Whitlock, Jonathan Lie, Athens Okoren
  • Publication number: 20070138904
    Abstract: A flat-type single phase brushless direct current (BLDC) motor includes a rotor rotatably fixed to a shaft and having a permanent magnet attached to a lower side thereof; a stator plate installed below the rotor; a plurality of stator cores installed on the stator plate to face the permanent magnet, the stator cores including soft magnetic powder and arranged to be asymmetric with respect to a rotation radial direction of the rotor so as to determine a rotational direction of the rotor; and a multiplicity of coils each being wounded around corresponding one of the stator cores to form a magnetic field toward the permanent magnet.
    Type: Application
    Filed: December 20, 2006
    Publication date: June 21, 2007
    Applicant: DAEWOO ELECTRONICS Corporation
    Inventor: Jin Chae