Patents by Inventor Jin-Gu Kim

Jin-Gu Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11183765
    Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: November 23, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hak Gu Kim, Ho Kyung Kang, Seong Jong Cheon, Young Sik Hur, Jin Seon Park, Yong Duk Lee
  • Patent number: 11170764
    Abstract: An electronic device and method for utilizing same are disclosed, the electronic device including a touch screen display disposed in the housing and exposed through a first portion of the housing; a microphone disposed in the housing and exposed through a second portion of the housing; at least one speaker disposed in the housing and exposed through a third portion of the housing; a communication circuit disposed in the housing; a processor disposed in the housing and electrically connected to the display, the microphone, the speaker, and the communication circuit; and a memory disposed in the housing, electrically connected to the processor, and configured to store application programs including a first application program, a second application program and a third application program, the second application program and the third application program include at least one common function.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: November 9, 2021
    Inventors: Kyoung Gu Woo, Ho Jun Jaygarl, Kyu Young Kim, Jin Woong Kim, Hyun Jin Park, Jae Yung Yeo
  • Patent number: 11160855
    Abstract: The present invention relates to new immunogenic compositions comprising conjugated Streptococcus pneumoniae capsular saccharide antigens (glycoconjugates) and uses thereof. Immunogenic compositions of the present invention will typically comprise at least one glycoconjugate from a S. pneumoniae serotype not found in PREVNAR®, SYNFLORIX® and/or PREVNAR 13®. The invention also relates to vaccination of human subjects, in particular infants and elderly, against pneumoccocal infections using said novel immunogenic compositions.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: November 2, 2021
    Assignee: Pfizer Inc.
    Inventors: Emilio Anthony Emini, Wendy Jo Watson, Avvari Krishna Prasad, Mingming Han, Jin-Hwan Kim, Jianxin Gu, Yu-ying Yang, Rajesh Kumar Kainthan, David Cooper, Michael William Pride, Kathrin Ute Jansen
  • Publication number: 20210326798
    Abstract: A system for attendance pre-assignment. The system may include a memory storing instructions and at least processor configured to execute the instructions to perform operations.
    Type: Application
    Filed: May 21, 2021
    Publication date: October 21, 2021
    Inventors: Wenting MO, Ying QIN, Xingzhu GU, Jin Hyun KIM, Xiufang ZHU
  • Patent number: 11146499
    Abstract: An electronic device is provided. The electronic device includes a processor configured to receive first data packets via a first modem, store the first data packets in a first data buffer assigned to a first area of a volatile memory, receive second data packets via a second modem, store the second data packets in a second data buffer assigned to a second area of the volatile memory, and deliver the first data packets and the second data packets from the first data buffer and the second data buffer to an upper layer in an order in which the first data packets and the second data packets are received. The second data packets include the same internet protocol (IP) destination address as the first data packets.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: October 12, 2021
    Inventors: Jin Mo Sung, Tae Gu Kim, Joon Young Heo, Min Jung Kim
  • Publication number: 20210311338
    Abstract: Provided are a wavelength conversion layer and a display device. A color conversion element comprises: a wavelength conversion layer; one or more low refractive layers which are disposed on and/or under the wavelength conversion layer and have a lower refractive index than the wavelength conversion layer; and one or more capping layers which are disposed between the wavelength conversion layer and the low refractive layers and/or on a surface opposite to a surface of each of the low refractive layers which faces the wavelength conversion layer.
    Type: Application
    Filed: June 16, 2021
    Publication date: October 7, 2021
    Inventors: Taek Joon LEE, Young Gu KIM, Keun Chan OH, Sun Young CHANG, Hye Lim JANG, Baek Kyun JEON, Jin Soo JUNG, Kyung Seon TAK, Jae Jin LYU, Moon Jung BAEK
  • Publication number: 20210312370
    Abstract: A system for attendance assignment. The system may include a memory storing instructions and at least processor configured to execute the instructions to perform operations. The operations may include retrieving, from a database, a plurality of delivery routes and a plurality of delivery sub-routes, wherein the delivery sub-routes are part of the delivery routes; calculating, based on the retrieval, a number of packages allocated to the delivery sub-routes; receiving, as input, a number and a type of workers available for deliveries, wherein the type including at least one of classification characteristics or efficiency characteristics; assigning, based on the calculated number of packages and the received input, the workers to a plurality of groups, wherein the groups correspond to different delivery routes or sub-routes; and comparing, based on the assignment, the assigned workers against the delivery routes or the delivery sub-routes.
    Type: Application
    Filed: June 22, 2021
    Publication date: October 7, 2021
    Inventors: Wenting MO, Ying QIN, Xingzhu GU, Jin Hyun KIM, Xiufang ZHU
  • Patent number: 11133592
    Abstract: A radio frequency module is provided. The module includes a core member, a front-end integrated circuit (FEIC), a first connection member, a second connection member disposed on an upper surface of the core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the second connection member, and configured to input or output a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, through a wiring layer, a substrate disposed on a lower surface of the first connection member; and an electrical connection structure configured to electrically connect the first connection member and the substrate. The FEIC is configured to input or output the first RF signal and a second RF signal which has a power different from a power of the first RF signal.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: September 28, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ho Kyung Kang, Seong Jong Cheon, Hak Gu Kim, Young Sik Hur, Jin Seon Park, Yong Duk Lee
  • Patent number: 11126940
    Abstract: A system for attendance assignment. The system may include a memory storing instructions and at least processor configured to execute the instructions to perform operations. The operations may include retrieving, from a database, a plurality of delivery routes and a plurality of delivery sub-routes, wherein the delivery sub-routes are part of the delivery routes; calculating, based on the retrieval, a number of packages allocated to the delivery sub-routes; receiving, as input, a number and a type of workers available for deliveries, wherein the type including at least one of classification characteristics or efficiency characteristics; assigning, based on the calculated number of packages and the received input, the workers to a plurality of groups, wherein the groups correspond to different delivery routes or sub-routes; and comparing, based on the assignment, the assigned workers against the delivery routes or the delivery sub-routes.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: September 21, 2021
    Assignee: Coupang Corp.
    Inventors: Wenting Mo, Ying Qin, Xingzhu Gu, Jin Hyun Kim, Xiufang Zhu
  • Publication number: 20210287595
    Abstract: A display apparatus includes a display panel, a driving controller and a data driver. The driving controller processes input image data according to a variable input frequency and generates a data signal having a varied frame length. The data driver converts the data signal into a data voltage and outputs the data voltage to the display panel. The driving controller determines a variable frequency mode and generates an asymmetric data signal including a positive data signal and a negative data signal which are asymmetric with respect to a common voltage for a same grayscale value in the variable frequency mode.
    Type: Application
    Filed: March 11, 2021
    Publication date: September 16, 2021
    Inventors: Tae Hyeong AN, Hoi Sik MOON, Yoon Gu KIM, Jin Pil KIM, Jae Sung BAE, Nam Jae LIM, Ik Hyun AHN, Seung Young CHOI
  • Patent number: 11112451
    Abstract: A test method for a semiconductor device includes: loading a test tray having semiconductor devices of first and second lots arranged thereon into a test chamber; storing lot information of each of the semiconductor devices; performing a test program on each of the semiconductor devices; obtaining ID information of each of the semiconductor devices; matching the ID information with the lot information to generate lot sorting information; and sorting the semiconductor devices based on results of the test program and the lot sorting information.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: September 7, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chul-Min Lee, Tae-Kyung Ko, Jin-Seong Kim, Hyeong-Gon Son, Seung-Woo Hong, Dong-Gu Lee, Sang-Jae Rhee
  • Patent number: 11110160
    Abstract: The invention provides eTEC linked glycoconjugates comprising a saccharide covalently conjugated to a carrier protein through a (2-((2-oxoethyl)thio)ethyl)carbamate (eTEC) spacer, immunogenic compositions comprising such glycoconjugates, and methods for the preparation and use of such glycoconjugates and immunogenic compositions.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: September 7, 2021
    Assignee: Pfizer Inc.
    Inventors: Jianxin Gu, Jin-hwan Kim, Avvari Krishna Prasad, Yu-ying Yang
  • Publication number: 20210263345
    Abstract: A display device including a first substrate, a pixel disposed on the first substrate and including first, second and third sub-pixel electrodes adjacent to each other, a second substrate spaced from the first substrate, a color conversion layer disposed on the second substrate and with a first wavelength conversion layer overlapping with the first sub pixel electrode and a second wavelength conversion layer overlapping with the second sub pixel electrode, a transmissive layer including a first sub-transmissive layer overlapping with the third sub-pixel electrode and a second sub-transmissive layer disposed between the first wavelength conversion layer and the second wavelength conversion layer, and a planarization layer disposed on the color conversion layer and the transmissive layer. A method of manufacturing a display device having a flatter planarization layer with reduced variations in thickness is also disclosed.
    Type: Application
    Filed: May 11, 2021
    Publication date: August 26, 2021
    Inventors: Jin Soo JUNG, Young Gu KIM, Taek Joon LEE, Hye Lim JANG, Baek Kyun JEON
  • Patent number: 11101461
    Abstract: A composite cathode active material, a method of preparing the composite cathode active material, a cathode including the composite cathode active material, and a lithium battery including the cathode. The composite cathode active material includes a lithium intercalatable material; and a garnet oxide, wherein an amount of the garnet oxide is about 1.9 wt % or less, based on a total weight of the composite cathode active material.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: August 24, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jun-young Mun, Jae-myung Lee, Gue-sung Kim, Yoon-sok Kang, Myung-hoon Kim, Jun-ho Park, Jin-hwan Park, Jae-gu Yoon, Byung-jin Choi
  • Patent number: 11101840
    Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: August 24, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hak Gu Kim, Ho Kyung Kang, Seong Jong Cheon, Young Sik Hur, Jin Seon Park, Yong Duk Lee
  • Publication number: 20200350262
    Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including a dummy metal layer; a first semiconductor chip disposed in the first through-hole and having a first active surface having first connection pads disposed thereon and a first inactive surface opposing the first active surface; a first encapsulant covering at least portions of the core member and the first semiconductor chip and filling at least portions of the first through-hole; and a first connection member disposed on the core member and the first active surface of the first semiconductor chip and including a first redistribution layer electrically connected to the first connection pads, wherein the dummy metal layer is electrically insulated from signal patterns of the first redistribution layer.
    Type: Application
    Filed: July 21, 2020
    Publication date: November 5, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seon Hee Moon, Myung Sam Kang, Jin Gu Kim
  • Patent number: 10748856
    Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including a dummy metal layer; a first semiconductor chip disposed in the first through-hole and having a first active surface having first connection pads disposed thereon and a first inactive surface opposing the first active surface; a first encapsulant covering at least portions of the core member and the first semiconductor chip and filling at least portions of the first through-hole; and a first connection member disposed on the core member and the first active surface of the first semiconductor chip and including a first redistribution layer electrically connected to the first connection pads, wherein the dummy metal layer is electrically insulated from signal patterns of the first redistribution layer.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: August 18, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seon Hee Moon, Myung Sam Kang, Jin Gu Kim
  • Publication number: 20190287924
    Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including a dummy metal layer; a first semiconductor chip disposed in the first through-hole and having a first active surface having first connection pads disposed thereon and a first inactive surface opposing the first active surface; a first encapsulant covering at least portions of the core member and the first semiconductor chip and filling at least portions of the first through-hole; and a first connection member disposed on the core member and the first active surface of the first semiconductor chip and including a first redistribution layer electrically connected to the first connection pads, wherein the dummy metal layer is electrically insulated from signal patterns of the first redistribution layer.
    Type: Application
    Filed: August 14, 2018
    Publication date: September 19, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seon Hee MOON, Myung Sam KANG, Jin Gu KIM
  • Patent number: 10315577
    Abstract: The present invention relates to a side mirror for a vehicle, the side mirror being provided on a vehicle for facilitating the checking of road situations on the left, right, and rear sides. The side mirror for a vehicle comprises a mirror housing which is mounted on the exterior of the vehicle, and a mirror part which is supported by the mirror housing, and is divided into multiple mirror areas which are in aspherical form respectively across the horizontal direction from the internal side, which is close to the vehicle, to the external side, which is far from the vehicle. In the mirror part, the respective optical powers of the mirror areas gradually increase from the internal side to the external side so as to have the same optical power at the borders of the mirror areas, and the optical power rate for at least one of the mirror areas is constant.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: June 11, 2019
    Assignee: BULLSONE CO., LTD
    Inventors: Jin-Gu Kim, Sung-Koo Lee, Jin-Wook Baek, Gang Lee, Ho-Cheol Lee
  • Patent number: 10312195
    Abstract: A fan-out semiconductor package includes: a semiconductor chip; an encapsulant encapsulating at least portions of the semiconductor chip; and a first connection member disposed on the semiconductor chip and including a first redistribution layer electrically connected to the connection pads and a second redistribution layer electrically connected to the connection pads and disposed on the first redistribution layer. The first redistribution layer includes a first pattern having a plurality of degassing holes, the second redistribution layer includes a second pattern having a first line portion having a first line width and a second line portion connected to the first line portion and having a second line width greater than the first line width, and the second line portion overlaps at least one of the plurality of degassing holes when being projected in a direction perpendicular to the active surface.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: June 4, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Hyun Lee, Jin Gu Kim, Chang Bae Lee, Jin Su Kim