Abstract: Disclosed is a coil component and method of manufacturing the coil component. The coil component includes a core magnetic layer, coil conductors formed on two opposing surfaces of the core magnetic layer, and outer magnetic layers laminated on the core magnetic layer and covering the coil conductors.

Abstract: A coil-embedded substrate and a method of manufacturing the same are provided. The coil-embedded substrate includes a substrate having a hollow portion disposed therein, a coil conductor disposed in the substrate and having a spiral shape winding about the hollow portion, a magnetic core disposed in the hollow portion, and a cover layer covering the substrate and the hollow portion.

Abstract: The present invention relates to a via structure having an open stub and a printed circuit board having the same. In accordance with an embodiment of the present invention, a via structure having an open stub including: a signal transmission via passing through an insulating layer; upper and lower via pads for connecting first and second transmission lines, which are respectively formed on and under the insulating layer, and the signal transmission via; and at least one open stub connected to an outer periphery of each via pad to have a shunt capacitance with each ground pattern formed on and under the insulating layer is provided. Further, a printed circuit board with a via having an open stub is provided.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a core layer having a first circuit wiring layer formed on one surface or both surfaces thereof; an insulating layer laminated, as at least one layer, on one surface or both surfaces of the core layer; and a second circuit wiring layer formed on one surface of the insulating layer, wherein a conductive core is included in upper and lower insulating layers contacting the second circuit wiring layer requiring an electromagnetic wave shielding, or the conductive core is included in the insulating layer or the core layer contacting the first circuit wiring layer requiring the electromagnetic wave shielding.

Abstract: The present invention relates to a circuit board. A circuit board in accordance with an embodiment of the present invention includes a base substrate; an interlayer insulating layer covering the base substrate; a via structure passing through at least the interlayer insulating layer of the base substrate and the interlayer insulating layer in the vertical direction; and an etch stop pattern disposed on the interlayer insulating layer in the horizontal direction to surround the via structure and made of an insulating material.

Abstract: Embodiments of the invention provide a copper clad laminate, and more particularly, to a copper clad laminate and a method for manufacturing the same capable of increasing a peel strength by adding a stress relaxation filler to an insulating layer of a copper clad laminate, along with an inorganic filler. To improve an adhesion of a substrate, the stress relaxation filler is distributed into the resin, along with the inorganic filler, and is entirely distributed into the varnish, and is more effectively added to the vicinity of a bonded interface between the insulating layer and the copper clad layer, thereby improving the overall adhesion.

Abstract: Disclosed herein are a common mode filter and a method for manufacturing the same. The common mode filter includes a first insulator sheet; a first circuit layer having a first-layered first coil and a first-layered second coil alternately and separately arranged; a second insulator sheet laminated on the first circuit layer; and a second circuit layer having a second-layered first coil and a second-layered second coil alternately and separately arranged, the second-layered first coil being connected to the first-layered first coil and the second-layered second coil being connected to the first-layered second coil through the plurality of penetration holes.

Abstract: A semiconductor memory device includes a memory block configured to include memory cells coupled to word lines and a peripheral circuit configured to perform a first program operation, a program verifying operation and a second program verifying operation for memory cells coupled to a word line selected from the word lines, and supply program allowable voltages having different levels to selected bit lines of program allowable cells located between program inhibition cells in the first program operation and the second program operation.

Abstract: Disclosed herein are a method of forming an amorphous alloy film and a printed wiring board manufactured by the same. The amorphous alloy film may be formed on a copper foil as one of rust-proofing treatment methods of the copper foil to thereby simultaneously show and improve corrosion-resistance and conductivity, and the amorphous alloy film may be formed by the sputtering deposition method, such that high melting point materials may be manufactured as a thin film at a relatively low temperature and the amorphous alloy film having strong adhesion strength with a substrate may be obtained.

Abstract: Disclosed herein is a circuit board including: a core layer including a via hole; a metal film covering an inner wall of the via hole; a circuit pattern connected to the metal film on the core layer; and a plug surrounded by the metal film in the via hole and having a thickness thinner than a thickness of the core layer.

Abstract: Disclosed herein are a printed circuit board including: an insulating layer; and a metal circuit layer formed on at least one surface of the insulating layer, wherein the metal circuit layer has surface roughness on only its one surface, and a method of manufacturing the same.

Abstract: The present invention discloses a printed circuit board including a lower wiring layer, an insulating layer which buries the lower wiring layer, and an upper wiring layer formed on the insulating layer to improve reliability of interlayer electrical connection between the wiring layers, wherein the interlayer connection between the upper wiring layer and the lower wiring layer is performed by a via electrode which is provided between the upper wiring layer and the lower wiring layer and has an upper surface bonded to the upper wiring layer and a lower surface bonded to the lower wiring layer, wherein the lower surface of the via electrode is larger than the upper surface thereof.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board according to a preferred embodiment of the present invention includes a base substrate; a through via formed to penetrate through the base substrate; and circuit patterns formed on one side and the other side of the base substrate and formed to be thinner than an inner wall of the through via.

Abstract: Disclosed herein is an interposer-embedded printed circuit board, including: a substrate including a cavity formed in one side thereof and having a predetermined height in a thickness direction of the substrate; an interposer disposed in the cavity and including a wiring region and an insulating region; and a circuit layer formed in the substrate and including a connection pattern connected with one side of the wiring region. The interposer-embedded printed circuit board is advantageous in that an interposer is embedded in a substrate, so that the thickness of a semiconductor package can be reduced, thereby keeping up with the trend of slimming the semiconductor package.

Abstract: The present invention relates to a circuit board. A circuit board in accordance with an embodiment of the present invention includes a base substrate; an interlayer insulating layer covering the base substrate; a via structure passing through at least the interlayer insulating layer of the base substrate and the interlayer insulating layer in the vertical direction; and an etch stop pattern disposed on the interlayer insulating layer in the horizontal direction to surround the via structure and made of an insulating material.

Abstract: Disclosed herein are a printed circuit board including a copper foil layer surface treated with Pb-free solder having the same height as that of a solder resist, and a surface treatment method of the printed circuit board. According to the present invention, the surface treatment of the package board or interposer board having an ultra-fine pitch (300 ?m or less) may be easily implemented by a cheap process. In addition, the surface treatment of the printed circuit board may be eco-friendly performed by using the Pb-free solder, and it may be easy to surface treat the package board or interposer board based on the organic material sensitive to a high temperature.

Abstract: Disclosed herein is a circuit board including: a core layer including a via hole; a metal film covering an inner wall of the via hole; a circuit pattern connected to the metal film on the core layer; and a plug surrounded by the metal film in the via hole and having a thickness thinner than a thickness of the core layer.

Abstract: There is provided an inductor, including a circuit board having an input and output terminal formed on a lower surface thereof, a connection pad formed on an upper surface thereof, and a via electrically connecting the input and output terminal and the connection pad, a coil having both ends joined to the connection pad and wound in a circular or a polygonal spiral shape in a longitudinal direction of the circuit board so as to have one or more turns, and a body stacked on the circuit board such that the coil and the connection pad are embedded therein.

Abstract: Disclosed herein is a printed circuit board, including: a base substrate; and a circuit pattern formed on the base substrate, including a conductive filler therein, and having roughness formed on a surface thereof.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a core layer having a first circuit wiring layer formed on one surface or both surfaces thereof; an insulating layer laminated, as at least one layer, on one surface or both surfaces of the core layer; and a second circuit wiring layer formed on one surface of the insulating layer, wherein a conductive core is included in upper and lower insulating layers contacting the second circuit wiring layer requiring an electromagnetic wave shielding, or the conductive core is included in the insulating layer or the core layer contacting the first circuit wiring layer requiring the electromagnetic wave shielding.