Patents by Inventor Jin Su Kim

Jin Su Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12252437
    Abstract: A method of forming a glass laminate includes providing a substrate having a core layer and at least one cladding layer; heat treating the substrate at a temperature such that the at least one cladding layer is phase-separated after the heat treating; and etch treating the substrate for at least 10 sec. A phase-separated glass laminate includes a substrate having a core layer and at least one phase-separated cladding layer, such that the glass laminate has a % transmission of at least 96%, and the at least one cladding layer comprises a grain size in a range of 10 nm to 1 ?m, or a graded glass index of greater than 5 nm.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: March 18, 2025
    Assignee: CORNING INCORPORATED
    Inventors: Venkatesh Botu, Attila Lang de Falussy, Jin Su Kim, Karl William Koch, III, Aize Li, James Patrick Trice
  • Patent number: 12228575
    Abstract: The present invention relates to a biomarker composition for predicting the prognosis of cancer malignancy induced by exposure to microplastics and use thereof, and more particularly, it was confirmed that the expression level of CD44, E-cadherin, N-cadherin, PD-L1, NPAS2, NR1D1, DNMT1, SLC7A2, PCDH7 and CLDN7 was changed in cancer cell lines and animal models treated with polystyrene microspheres which are the one type of microplastic for 4 weeks, and malignancy was induced due to an increase in proliferation, migration and invasion of cancer cells by the change in the expression level of the gene, and 5-year overall survival rates in gastric cancer patients decreased and thus the genes may be provided as a biomarker composition for predicting the prognosis of cancer malignancies by exposure to microplastics.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: February 18, 2025
    Assignee: KOREA INSTITUTE OF RADIOLOGICAL & MEDICAL SCIENCES
    Inventors: Jin Su Kim, Hyeongi Kim, Javeria Zaheer
  • Patent number: 12225823
    Abstract: A technology of fabricating a piezoelectric composite applicable to an ultrasonic transducer is disclosed. According to one aspect of the present disclosure, a support member formed with a plurality of through holes is located on one surface of an electrode plate, and lower surfaces of piezoelectric pillars having shapes respectively corresponding to the through holes are adhered onto the one surface of the electrode plate to form the piezoelectric pillars. Further, according to an additional aspect, the plurality of piezoelectric pillars having shapes corresponding to the through holes of the support member are formed by sintering a piezoelectric pellet molded in a pillar shape.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: February 11, 2025
    Assignee: NEUROSONA Co., Ltd.
    Inventors: Nam Kuy Cho, Jin Su Kim, Jung Ho Ko, Man Soon Yoon, Young Min Park
  • Publication number: 20250017678
    Abstract: According to an aspect of the present disclosure, a cart for optical coherence tomography includes a rotary catheter unit; a main body including a receiving member configured to receive the rotary catheter unit; a mobile unit coupled to a lower part of the main body and configured to move the main body on the ground; and a display unit connected to an upper part of the main body and configured to output information generated by the rotary catheter unit. Wherein the display unit is located inside at least two side surfaces of the main body.
    Type: Application
    Filed: January 22, 2024
    Publication date: January 16, 2025
    Inventors: Joo Soo KIM, Dong Kwon JANG, Soon Won JEONG, Sang Won WOO, Jin Su KIM, Tae Sung KIM
  • Publication number: 20240400434
    Abstract: Methods for manufacturing glass articles having a target effective coefficient of thermal expansion CTETeff averaged over a temperature range comprise selecting a glass core composition having an average core glass coefficient of thermal expansion CTEcore that is greater than the target effective CTETeff and a glass clad composition having an average clad glass coefficient of thermal expansion CTEclad that is less than the target effective CTETeff; and manufacturing a glass laminate comprising a glass core layer formed from the glass core composition and two or more glass cladding layers fused to the glass core layer, each of the two or more glass cladding layers formed from the glass clad composition such that a ratio of a thickness of the glass core layer to a total thickness of the two or more glass cladding layers is selected to produce the glass laminate having an effective coefficient of thermal expansion CTEeff that is within ±0.5 ppm/° C. of the target effective CTETeff.
    Type: Application
    Filed: August 12, 2024
    Publication date: December 5, 2024
    Inventors: Heather Debra Boek, Timothy Michael Gross, Jin Su Kim, Jesse Kohl, HungCheng Lu, Yu Xiao, Liying Zhang, Lu Zhang
  • Publication number: 20240351312
    Abstract: A laminated glass article comprises a core layer comprising a core glass composition having an average core coefficient of thermal expansion (CTEcore) and a clad layer directly adjacent to the core layer and comprising a clad glass composition having an average clad coefficient of thermal expansion (CTEclad) that is less than the CTEcore such that the clad layer is in compression and the core layer is in tension. A compressive stress of the clad layer increases with increasing distance from the outer surface of the clad layer, transitions to a minimum tensile stress as a step-change at an interface region between the core layer and the clad layer, and a magnitude of the tensile stress increases continuously to a maximum tensile stress in the core layer. Other stress profiles, and methods of preparing laminated glass articles are also disclosed.
    Type: Application
    Filed: July 2, 2024
    Publication date: October 24, 2024
    Inventors: Jason Thomas Harris, Jin Su Kim, Peter Joseph Lezzi, Natesan Venkataraman
  • Patent number: 12103888
    Abstract: A method for forming a via in a glass article includes forming one or more cavities within a glass substrate by exposing the glass substrate to an etchant, the glass substrate including a glass cladding layer and a glass central core layer, where the glass cladding layer has an etch rate in the etchant that is different than an etch rate of the glass central core layer, and where the one or more cavities extend through the glass central core layer terminating at the glass cladding layer, depositing a metallic material within the one or more cavities, and removing the glass cladding layer.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: October 1, 2024
    Assignee: CORNING INCORPORATED
    Inventors: Hoon Kim, Jin Su Kim
  • Publication number: 20240319458
    Abstract: Integrated circuit packages having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a glass substrate, an optical channel, and redistribution layers. The integrated circuit package further includes an integrated circuit chip positioned on the glass substrate and in optical communication with the optical channel and in electrical continuity with the redistribution layers.
    Type: Application
    Filed: June 7, 2024
    Publication date: September 26, 2024
    Inventors: Lars Martin Otfried Brusberg, Jin Su Kim, Aramais Robert Zakharian
  • Patent number: 12084798
    Abstract: The present invention relates to an apparatus for manufacturing a fibrous web, a fibrilla fiber aggregate, or a nonwoven fabric by using a woven fabric, a method for manufacturing a fibrous web, a fibrilla fiber aggregate, or a nonwoven fabric by using the apparatus, and a fibrous web, a fibrilla fiber aggregate, or a nonwoven fabric manufactured by the method, especially, a fibrous web, a fibrilla fiber aggregate, or a nonwoven fabric for use in a hemostatic agent or an anti-adhesive agent.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: September 10, 2024
    Assignee: SAMYANG HOLDINGS CORPORATION
    Inventors: Hye Sung Yoon, Jin Su Kim
  • Patent number: 12084373
    Abstract: Methods for manufacturing glass articles having a target effective coefficient of thermal expansion CTETeff averaged over a temperature range comprise selecting a glass core composition having an average core glass coefficient of thermal expansion CTEcore that is greater than the target effective CTETeff and a glass clad composition having an average clad glass coefficient of thermal expansion CTEclad that is less than the target effective CTETeff; and manufacturing a glass laminate comprising a glass core layer formed from the glass core composition and two or more glass cladding layers fused to the glass core layer, each of the two or more glass cladding layers formed from the glass clad composition such that a ratio of a thickness of the glass core layer to a total thickness of the two or more glass cladding layers is selected to produce the glass laminate having an effective coefficient of thermal expansion CTEeff that is within ±0.5 ppm/° C. of the target effective CTETeff.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: September 10, 2024
    Assignee: CORNING INCORPORATED
    Inventors: Heather Debra Boek, Timothy Michael Gross, Jin Su Kim, Jesse Kohl, Hung Cheng Lu, Yu Xiao, Liying Zhang, Lu Zhang
  • Patent number: 12076971
    Abstract: A laminated glass structure for an electronic device includes: a core glass layer having a first coefficient of thermal expansion (CTE); and a plurality of clad glass layers, each having a CTE that is lower than or equal to the first CTE of the core glass layer. A first of the clad glass layers is laminated to a first surface of the core glass layer and a second of the clad layers is laminated to a second surface of the core glass layer. Further, the total thickness of the core glass layer and the clad glass layers ranges from about 0.1 mm to about 3 mm. In addition, each of the first of the clad layers and the core glass layer comprises a loss tangent of 0.006 or less for signals having a frequency of 1 GHz to about 100 GHz.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: September 3, 2024
    Assignee: CORNING INCORPORATED
    Inventors: Jin Su Kim, Dean Michael Thelen
  • Patent number: 12064938
    Abstract: A laminated glass article comprises a core layer comprising a core glass composition having an average core coefficient of thermal expansion (CTEcore) and a clad layer directly adjacent to the core layer and comprising a clad glass composition having an average clad coefficient of thermal expansion (CTEclad) that is less than the CTEcore such that the clad layer is in compression and the core layer is in tension. A compressive stress of the clad layer increases with increasing distance from the outer surface of the clad layer, transitions to a minimum tensile stress as a step-change at an interface region between the core layer and the clad layer, and a magnitude of the tensile stress increases continuously to a maximum tensile stress in the core layer. Other stress profiles, and methods of preparing laminated glass articles are also disclosed.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: August 20, 2024
    Assignee: CORNING INCORPORATED
    Inventors: Jason Thomas Harris, Jin Su Kim, Peter Joseph Lezzi, Natesan Venkataraman
  • Publication number: 20240273685
    Abstract: An image signal processor and an image signal processing method are disclosed. The image signal processor includes a local white balance gain (LWBG) calculator configured to calculate a first gain representing a ratio between red pixel data and green pixel data and a second gain representing a ratio between blue pixel data and green pixel data, a local white balance gain (LWBG) corrector configured to generate a first correction gain and a second correction gain by filtering each of the first gain and the second gain, and a demosaicing corrector configured to correct each of the red pixel data, the green pixel data, and the blue pixel data using the first correction gain and the second correction gain.
    Type: Application
    Filed: January 10, 2024
    Publication date: August 15, 2024
    Applicant: SK hynix Inc.
    Inventor: Jin Su KIM
  • Publication number: 20240259949
    Abstract: Disclosed herein non-infrastructure ultra-wideband wireless positioning method and system using latency communication and overhear. The method includes: receiving a ranging message transmitted from other active devices; measuring a location of an active device by using data obtained from the ranging message; checking a remaining amount of power of the active device and creating a ranging message by using the remaining amount of power of the active device and the obtained data; and transmitting the created ranging message to the other active devices. When a request of device change is received from a first passive device based on a remaining amount of power of a passive device overhearing the ranging message and the remaining amount of power of the active device, a response for changing the first passive device to an active device is provided, and the active device itself changes from an active device to a passive device.
    Type: Application
    Filed: January 24, 2024
    Publication date: August 1, 2024
    Inventors: Young Bae KO, Jin Su KIM
  • Patent number: 12043575
    Abstract: A laminated glass article comprises a core layer comprising a core glass composition, and a cladding layer directly adjacent to the core layer and comprising a clad glass composition. A stress of the cladding layer increases with increasing distance from an outer surface of the cladding layer from a compressive stress to a tensile stress, transitions to a compressive stress as a step-change at an interface region between the core layer and the cladding layer, and increases with increasing distance from the interface region to a center of the core layer from the compressive stress to a tensile stress.
    Type: Grant
    Filed: May 24, 2023
    Date of Patent: July 23, 2024
    Assignee: CORNING INCORPORATED
    Inventors: Douglas Clippinger Allan, Vladislav Yuryevich Golyatin, Petr Gorelchenko, Jason Thomas Harris, Jin Su Kim, Peter Joseph Lezzi, Rostislav Vatchev Roussev, Natesan Venkataraman
  • Publication number: 20240242386
    Abstract: An image processing device for performing an image blurring method includes an image preprocessor configured to determine an in-focus area and an out-of-focus area for sub-images of an externally received image, the sub-images generated based on pixel values of the externally received image. The image processor is also configured to calculate disparity values between the sub-images in the out-of-focus area. The image processing device further includes an image combiner configured to perform a blur operation on the out-of-focus area depending on a strength of the blur operation determined based on the disparity values and to sum sub-images on which the blur operation is performed.
    Type: Application
    Filed: July 10, 2023
    Publication date: July 18, 2024
    Applicant: SK hynix Inc.
    Inventors: Tae Hyun KIM, Jin Su KIM, Jong Hyun BAE
  • Publication number: 20240236506
    Abstract: An image signal processor for reducing noise of an image and performing a sharpening process of the image, and a method for processing an image signal are disclosed. The image signal processor includes an input image selection circuit configured to select a first image and a second image obtained by binning the first image as a first input or a second input, and an integrated filtering circuit configured to perform a filtering operation for a selected image by selecting the input image selection circuit in response to an input order of the first input and the second input, and thus output one of a noise-removed image and a sharpened image.
    Type: Application
    Filed: July 17, 2023
    Publication date: July 11, 2024
    Inventor: Jin Su KIM
  • Publication number: 20240236505
    Abstract: A device for correcting artifacts included in images includes an image processor. The image processor includes an acquirer configured to acquire image data including first pixel data, second pixel data, third pixel data, and fourth pixel data arranged in a 2×2 array. The image processor also includes a guide image generator configured to acquire a first guide image based on an average value of the first pixel data and the fourth pixel data that are located in a diagonal direction. The image processor further includes an image operating component configured to output a result image generated using a high-frequency component, included in the first guide image, and the image data.
    Type: Application
    Filed: July 5, 2023
    Publication date: July 11, 2024
    Applicant: SK hynix Inc.
    Inventors: Jin Su KIM, Tae Hyun KIM, Jong Hyun BAE, Sang Woo AHN
  • Patent number: 12035080
    Abstract: Disclosed is an image sensing device including a first module suitable for generating a plurality of interpolated images separated for each color channel, based on a raw image and a plurality of first convolution layers, a second module suitable for generating a plurality of refined images separated for each color channel, based on the plurality of interpolated images and a plurality of second convolution layers, and a third module suitable for generating at least one output image corresponding to the raw image, based on the plurality of refined images and a plurality of third convolution layers.
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: July 9, 2024
    Assignee: SK hynix Inc.
    Inventor: Jin Su Kim
  • Patent number: 12032216
    Abstract: Integrated circuit packages (100) having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a structured glass article (120) including a glass substrate (122), an optical channel (132), and redistribution layers. The integrated circuit package (100) further includes an integrated circuit chip (160) positioned on the glass substrate (122) and in optical communication with the optical channel (132) and in electrical continuity with the redistribution layers (136).
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: July 9, 2024
    Assignee: CORNING INCORPORATED
    Inventors: Lars Martin Otfried Brusberg, Jin Su Kim, Aramais Robert Zakharian