Abstract: Disclosed is an image sensing device including an inversion pipeline suitable for generating an original image based on a source image without real noise; a noise generator suitable for generating a noise image which corresponds to a real image, by applying noise values on which real noise values are modeled for each pixel, to the original image; and a pipeline suitable for generating a dataset image, which corresponds to the source image, based on the noise image.

Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

Abstract: Disclosed is an image sensing device including a first module suitable for generating a plurality of interpolated images separated for each color channel, based on a raw image and a plurality of first convolution layers, a second module suitable for generating a plurality of refined images separated for each color channel, based on the plurality of interpolated images and a plurality of second convolution layers, and a third module suitable for generating at least one output image corresponding to the raw image, based on the plurality of refined images and a plurality of third convolution layers.

Abstract: A glass substrate comprises a glass clad layer fused to a glass core layer. The glass core layer comprises a core glass composition having an average core coefficient of thermal expansion (CTEcore) and the glass clad layer comprises a clad glass composition having an average clad coefficient of thermal expansion (CTEclad) that is less than the CTEcore. A maximum tensile stress in the glass core layer is less than 15 MPa.

Abstract: A technology of fabricating a piezoelectric composite applicable to an ultrasonic transducer is disclosed. According to one aspect of the present disclosure, a support member formed with a plurality of through holes is located on one surface of an electrode plate, and lower surfaces of piezoelectric pillars having shapes respectively corresponding to the through holes are adhered onto the one surface of the electrode plate to form the piezoelectric pillars. Further, according to an additional aspect, the plurality of piezoelectric pillars having shapes corresponding to the through holes of the support member are formed by sintering a piezoelectric pellet molded in a pillar shape.

Abstract: The present invention relates to a low-intensity focused ultrasound therapeutic device. According to one aspect of the present invention, provided is a low-intensity focused ultrasound therapeutic device which employs a single element ultrasound transducer having a focal region, a focal distance and output intensity that can be provide safer treatment for the deep brain of a patient.

Abstract: Methods for manufacturing glass articles having a target effective coefficient of thermal expansion CTETeff averaged over a temperature range comprise selecting a glass core composition having an average core glass coefficient of thermal expansion CTEcore that is greater than the target effective CTETeff and a glass clad composition having an average clad glass coefficient of thermal expansion CTEclad that is less than the target effective CTETeff; and manufacturing a glass laminate comprising a glass core layer formed from the glass core composition and two or more glass cladding layers fused to the glass core layer, each of the two or more glass cladding layers formed from the glass clad composition such that a ratio of a thickness of the glass core layer to a total thickness of the two or more glass cladding layers is selected to produce the glass laminate having an effective coefficient of thermal expansion CTEeff that is within ±0.5 ppm/° C. of the target effective CTETeff.

Abstract: A wafer- or panel-level encapsulated package comprises a glass substrate comprising a glass cladding layer (105) fused to a glass core layer (110), the glass substrate comprising a cavity (425), wherein the glass cladding layer has a higher etch rate in an etchant than the glass core layer. The wafer- or panel-level encapsulated package further comprises a microelectronic component (700) disposed in the cavity, and an encapsulant (702) sealed to the glass substrate such that the microelectronic component is encapsulated within the cavity. Methods for forming the wafer- or panel-level encapsulated package, including etching a cavity into a glass substrate, depositing a microelectronic component into the cavity, and sealing an encapsulant to the glass substrate such that the microelectronic component is encapsulated within the cavity are also provided.

Abstract: A carrier assembly is configured to support a wafer, including during back end of line (BEOL) processing. The carrier assembly includes dual carriers. A first carrier includes a stepped structure so as to situate the wafer. A side of the wafer is bonded to the first carrier without adhesive. The first carrier is positioned atop the second carrier, so as to be mechanically supported by the second carrier. Each carrier is made by wet etching of laminated glass, without mechanical polishing.

Abstract: Structured glass articles include a glass substrate including a glass cladding layer fused to a glass core layer, a cavity formed in the glass substrate, and a shielding layer disposed within the cavity. In some embodiments, a passivation layer is disposed within the cavity such that the shielding layer is between the passivation layer and the glass substrate. A method for forming a glass fan-out includes depositing a shielding layer within a cavity in a glass substrate. The glass substrate includes a glass cladding layer fused to a glass core layer. A silicon chip may be deposited within the cavity. In some embodiments, the method also includes depositing a passivation layer within the cavity such that the shielding layer is between the passivation layer and the glass substrate.

Abstract: A laminated glass structure is provided that includes: a core glass layer having a first coefficient of thermal expansion (CTE); and a plurality of clad glass layers, each having a CTE that is lower than or equal to the first CTE of the core glass layer. A first of the clad layers is laminated to a first surface of the core glass layer and a second of the clad layers is laminated to a second surface of the core glass layer. Further, the total thickness of the core glass layer and the clad glass layers ranges from about 0.1 mm to about 3 mm. In addition, the laminated glass structure is characterized by a transmission power of at least 75% and at least 55% for signals at 28 GHz and 60 GHz, respectively, as calculated in a Three-Layer Model.

Abstract: A glass-ceramic that includes: SiO2 from about 35 mol % to about 80 mol %; B2O3 from about 10 mol % to about 50 mol %; P2O5 from about 10 mol % to about 50 mol %; and an optional addition of one or more of CaO, MgO and Bi2O3 from 0 mol % to about 5 mol %, wherein the glass-ceramic further comprises a boron-phosphate crystalline phase.

Abstract: A noise removing circuit includes an image combiner suitable for generating a high dynamic range (HDR) image by combining images having different exposure times; a detailed image generator suitable for generating a detailed image from the HDR image; an image strength evaluator suitable for evaluating strength of the detailed image; and a noise coring component suitable for performing a noise coring operation for removing noise from a region of the detailed image in which a signal to noise ratio (SNR) has decreased using a low threshold and a saturation threshold when the strength of the detailed image is less than a reference value.

Abstract: The present invention relates to a method of processing three-dimensional scan data for manufacture of dental prosthesis, the method identifies a position for an implant procedure on the basis of image data for an oral structure, and generates aligned image data by retrieving, from a library, data corresponding to a scan body or an abutment, only a part of which has been scanned, by replacing a part or the whole of the image data with the retrieved data, and by aligning a position and a direction of the image data. By using the method, user can easily identify an oral structure from the image data obtained by scanning partial shape of the scan body or the abutment, and the method provides feedback to the user so that the method guides the user to correct measurement. Therefore, the prosthesis can be manufactured more quickly due to reduced scan time.

Abstract: A semiconductor package includes a connection structure including a redistribution layer, a plurality of under bump metal layers electrically connected to the redistribution layer, a passivation layer which overlaps at least portions of side faces of the plurality of under bump metal layers, and includes a first trench disposed between under bump metal layers adjacent to each other, a surface mounting element which is on the under bump metal layers adjacent to each other, connected to the redistribution layer, and overlaps the first trench, and an underfill material layer that is between a portion of the passivation layer and the surface mounting element, and is in the first trench. The first trench extends in a first direction and includes a first sub-trench having a first width in a second direction, and a second sub-trench having a second width different from the first width in the second direction.

Abstract: A local tone mapping circuit includes an average value calculation unit suitable for calculating an average value of an absolute value of a difference between a center pixel data and a neighboring pixel data of the center pixel data; a range calculation unit suitable for calculating a range between a maximum value and a minimum value of the absolute value of a difference between the center pixel data and the neighboring pixel data; and a local tone mapping strength adjusting unit suitable for differently allocating a weighted value according to a distance between a center pixel and an edge pixel among neighboring pixels of the center pixel based on the range between the maximum value and the minimum value calculated by the range calculation unit and the average value calculated by the average value calculation unit, and adjusting a local tone mapping strength according to an allocated weighted value.

Abstract: A method for processing an image signal, an image signal processor, and an image sensor chip are disclosed. A method for processing an image signal includes generating Bayer order status information indicating whether a Bayer order of a Bayer pattern image has been changed, based on translation information of gyro information, performing translation correction about the Bayer pattern image using the translation information, and performing interpolation about the Bayer pattern image in which the translation correction has been performed, based on the Bayer order status information.

Abstract: The present invention relates to a method and system for providing a face adjustment image, the method comprising the steps of: (a) generating a matched image by superimposing a cephalometric image having a cranium image of a patient whose face is to be corrected with a three-dimensional facial image of the patient; and (b) displaying a predicted facial image on a screen by transforming soft skin tissues of the face according to the skeletal change in the cephalometric image. According to the present invention, the change in the soft skin tissues and the predicted facial image are displayed on a screen of a computer, a terminal or the like based on the skeletal change in cranium, teeth, prosthesis or the like supporting the soft skin tissues. Therefore, the change in the soft skin tissues can be predicted, thereby increasing the accuracy of a face correction operation, making it more accurate and convenient to plan the operation, and enhancing communication between the patient and medical staff.

Abstract: The present invention relates to a biomarker composition for predicting the prognosis of cancer malignancy induced by exposure to microplastics and use thereof, and more particularly, it was confirmed that the expression level of CD44, E-cadherin, N-cadherin, PD-L1, NPAS2, NR1D1, DNMT1, SLC7A2, PCDH7 and CLDN7 was changed in cancer cell lines and animal models treated with polystyrene microspheres which are the one type of microplastic for 4 weeks, and malignancy was induced due to an increase in proliferation, migration and invasion of cancer cells by the change in the expression level of the gene, and 5-year overall survival rates in gastric cancer patients decreased and thus the genes may be provided as a biomarker composition for predicting the prognosis of cancer malignancies by exposure to microplastics.

Abstract: Apparatus can comprise a cavity at least partially defined by a first major surface of a reference block and configured to receive a sample. The apparatus can comprise a first polarization-switching light source configured to emit a first polarization-switched light beam toward the cavity and a first detector configured to detect a corresponding signal. The apparatus can comprise a second polarization-switching light source configured to emit a second polarization-switched light beam toward the cavity and a second detector configured to detect a corresponding signal. The first reference block can be positioned between the second detector and the second reference block. Methods of determining an estimated stress profile can comprise determining a central tension from a measured retardation profile of the sample. Methods can comprise determining an initial stress profile from a refractive index profile of the sample. Methods can comprise scaling and adjusting stress profiles.