Patents by Inventor Jin Su Kim

Jin Su Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230241421
    Abstract: The present invention relates to a low-intensity focused ultrasound therapeutic device. According to one aspect of the present invention, provided is a low-intensity focused ultrasound therapeutic device which employs a single element ultrasound transducer having a focal region, a focal distance and output intensity that can be provide safer treatment for the deep brain of a patient.
    Type: Application
    Filed: December 10, 2020
    Publication date: August 3, 2023
    Applicant: NEUROSONA Co., Ltd.
    Inventors: Nam Kuy CHO, Jin Su KIM, Min Su YOO, Yun Seob YANG
  • Publication number: 20230237624
    Abstract: A noise removing circuit includes an image combiner suitable for generating a high dynamic range (HDR) image by combining images having different exposure times; a detailed image generator suitable for generating a detailed image from the HDR image; an image strength evaluator suitable for evaluating strength of the detailed image; and a noise coring component suitable for performing a noise coring operation for removing noise from a region of the detailed image in which a signal to noise ratio (SNR) has decreased using a low threshold and a saturation threshold when the strength of the detailed image is less than a reference value.
    Type: Application
    Filed: March 30, 2023
    Publication date: July 27, 2023
    Inventors: Dong Ik KIM, Jin Su KIM, Chang Ki MIN, Seong Hee PARK
  • Patent number: 11697617
    Abstract: A laminated glass article comprises a core layer comprising a core glass composition, and a cladding layer directly adjacent to the core layer and comprising a clad glass composition. A stress of the cladding layer increases with increasing distance from an outer surface of the cladding layer from a compressive stress to a tensile stress, transitions to a compressive stress as a step-change at an interface region between the core layer and the cladding layer, and increases with increasing distance from the interface region to a center of the core layer from the compressive stress to a tensile stress.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: July 11, 2023
    Assignee: CORNING INCORPORATED
    Inventors: Douglas Clippinger Allan, Vladislav Yuryevich Golyatin, Petr Gorelchenko, Jason Thomas Harris, Jin Su Kim, Peter Joseph Lezzi, Rostislav Vatchev Roussev, Natesan Venkataraman
  • Publication number: 20230212637
    Abstract: The present invention relates to: a biomarker composition for predicting the prognosis of brain disease caused by microplastic exposure; and a use thereof. More particularly, it was confirmed that polyethylene microspheres (PS) in a mouse animal model orally administered with the PS penetrate brain tissue to change the level of metabolites inside the brain tissue and the diversity of intestinal microorganisms, thereby causing brain disease, and thus the present invention is intended to provide a biomarker composition for predicting the prognosis of brain disease caused by microplastic exposure, and a method for predicting the prognosis of brain disease using same.
    Type: Application
    Filed: July 5, 2021
    Publication date: July 6, 2023
    Applicant: KOREA INSTITUTE OF RADIOLOGICAL & MEDICAL SCIENCES
    Inventors: Jin Su KIM, Hyeongi KIM, Javeria ZAHEER, Yong Jin LEE, Kyung Jun KANG, In Ok KO
  • Patent number: 11671571
    Abstract: Disclosed is an image sensing device including a first module suitable for generating a plurality of interpolated images separated for each color channel, based on a raw image and a plurality of first convolution layers, a second module suitable for generating a plurality of refined images separated for each color channel, based on the plurality of interpolated images and a plurality of second convolution layers, and a third module suitable for generating at least one output image corresponding to the raw image, based on the plurality of refined images and a plurality of third convolution layers.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: June 6, 2023
    Assignee: SK hynix Inc.
    Inventor: Jin Su Kim
  • Patent number: 11664285
    Abstract: An electronic package assembly includes a glass substrate including an upper glass cladding layer, a lower glass cladding layer, a glass core layer coupled to the upper glass cladding layer and the lower glass cladding layer, where the upper glass cladding layer and the lower glass cladding layer have a higher etch rate in an etchant than the glass core layer, a first cavity positioned within one of the upper glass cladding layer or the lower glass cladding layer, and a second cavity positioned within one of the upper glass cladding layer or the lower glass cladding layer, a microprocessor positioned within the first cavity, and a micro-electronic component positioned within the second cavity.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: May 30, 2023
    Assignee: CORNING INCORPORATED
    Inventors: Jin Su Kim, Scott Christopher Pollard
  • Patent number: 11651476
    Abstract: A noise removing circuit includes an image combiner suitable for generating a high dynamic range (HDR) image by combining images having different exposure times; a detailed image generator suitable for generating a detailed image from the HDR image; an image strength evaluator suitable for evaluating strength of the detailed image; and a noise coring component suitable for performing a noise coring operation for removing noise from a region of the detailed image in which a signal to noise ratio (SNR) has decreased using a low threshold and a saturation threshold when the strength of the detailed image is less than a reference value.
    Type: Grant
    Filed: January 18, 2021
    Date of Patent: May 16, 2023
    Assignee: SK hynix Inc.
    Inventors: Dong Ik Kim, Jin Su Kim, Chang Ki Min, Seong Hee Park
  • Patent number: 11599981
    Abstract: An image processing system includes: an image signal processor including a first neural network, and processing an input image by using the first neural network so as to generate a post-processed image; and a discriminator including a second neural network, and receiving a target image and the post-processed image, and discriminating the target image and the post-processed image into a real image and a fake image by using the second neural network, wherein the second neural network is trained to discriminate the target image as a real image and to discriminate the post-processed image as a fake image, and the first neural network is trained in such a manner that the post-processed image is discriminated as a real image by the second neural network.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: March 7, 2023
    Assignee: SK hynix Inc.
    Inventors: Tae Hyun Kim, Jin Su Kim, Jong Hyun Bae, Sung Joo Hong
  • Publication number: 20230053601
    Abstract: An image sensing device, and a method of operating the same, includes an image sensor and an image processor. The image sensor is configured to sense light sourced from a subject and generate an image layer. The image processor is configured to generate a feature map by performing a convolution operation on the image layer and a fixed-size kernel, generate a final feature map by performing convolution operations on a variable-size kernel and the feature map, and generate image data including channels in which the final feature map is classified for each color.
    Type: Application
    Filed: January 17, 2022
    Publication date: February 23, 2023
    Applicant: SK hynix Inc.
    Inventor: Jin Su KIM
  • Publication number: 20230044556
    Abstract: A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a core glass having a core glass coefficient of thermal expansion ?core, the first clad layer and the second clad layer each comprising a clad glass having a clad glass coefficient of thermal expansion ?clad, where ?clad>?core; affixing integrated circuit devices to the second clad layer of the laminate sheet or wafer; forming a fan-out layer on or above the integrated circuit devices; and removing some of the first clad layer to decrease warp of the sheet or wafer with integrated circuit devices and a fan-out layer thereon. A method of producing a laminate sheet or wafer having a selected CTE is also disclosed.
    Type: Application
    Filed: October 17, 2022
    Publication date: February 9, 2023
    Inventors: Jin Su Kim, Yu Xiao
  • Patent number: 11573078
    Abstract: Apparatus can comprise a cavity at least partially defined by a first major surface of a reference block and configured to receive a sample. The apparatus can comprise a first polarization-switching light source configured to emit a first polarization-switched light beam toward the cavity and a first detector configured to detect a corresponding signal. The apparatus can comprise a second polarization-switching light source configured to emit a second polarization-switched light beam toward the cavity and a second detector configured to detect a corresponding signal. The first reference block can be positioned between the second detector and the second reference block. Methods of determining an estimated stress profile can comprise determining a central tension from a measured retardation profile of the sample. Methods can comprise determining an initial stress profile from a refractive index profile of the sample. Methods can comprise scaling and adjusting stress profiles.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: February 7, 2023
    Assignee: CORNING INCORPORATED
    Inventors: William John Furnas, Jin Su Kim, Balamurugan Meenakshi Sundaram
  • Publication number: 20230020674
    Abstract: An electronic apparatus includes: an image sensor for acquiring an image including normal pixel values that are sensed during a first exposure time and short exposure pixel values that are sensed during a second exposure time that is shorter than the first exposure time; and a processor configured to acquire flag information that indicates that a selected region, among a plurality of regions of the image, is one of a motion region and a normal region by using an exposure ratio of the first exposure time and the second exposure time and by using a short exposure pixel value and normal pixel values, which are included in the selected region, and configured to output a restoration image including a restoration pixel value that is corrected from the short exposure pixel value that is included in the selected region, based on the flag information.
    Type: Application
    Filed: March 21, 2022
    Publication date: January 19, 2023
    Applicant: SK hynix Inc.
    Inventors: Tae Hyun KIM, Jin Su KIM, Jong Hyun BAE
  • Patent number: 11552944
    Abstract: Disclosed is a server for performing authentication or identification using biometric information including basic information and detailed information includes a storage for storing basic information and detailed information that are separately encrypted for each of a plurality of users, a communicator for communicating with an external device, and a processor configured to, based on separately encrypted basic information and detailed information being received from an external terminal device through the communicator, performing user authentication or user identification for the received basic information and detailed information by decrypting and comparing the stored encrypted basic information and the received encrypted basic information, and comparing the received detailed information with at least one piece of stored detailed information corresponding to a piece of basic information having a degree of similarity that is higher than or equal to a predetermined value and with the received basic information
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: January 10, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jun-bum Shin, Kyung-sun Cho, Jin-su Kim
  • Publication number: 20220414876
    Abstract: Provided is a method of setting a scan region, the method including: placing a target object on an upper surface of a jig of a three-dimensional scanner in such a manner that at least one portion of a target object image representing a shape of the target object is plotted on an input region; determining, by a control unit, a predetermined upper portion of the input region, as a scan region, from a jig image representing the shape of the jig; and generating, by the control unit, a three-dimensional model of the target object on the basis of the target object image resulting from scanning the scan region.
    Type: Application
    Filed: June 28, 2022
    Publication date: December 29, 2022
    Applicant: MEDIT CORP.
    Inventors: Jin Young KIM, Jin Su KIM
  • Patent number: 11527452
    Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: December 13, 2022
    Assignee: CORNING INCORPORATED
    Inventors: Heather Debra Boek, Paul Bennett Dohn, Jin Su Kim, Aize Li, Hugh Michael McMahon, Jun-Ro Yoon
  • Patent number: 11508575
    Abstract: A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a core glass having a core glass coefficient of thermal expansion ?core, the first clad layer and the second clad layer each comprising a clad glass having a clad glass coefficient of thermal expansion ?clad, where ?clad>?core; affixing integrated circuit devices to the second clad layer of the laminate sheet or wafer; forming a fan-out layer on or above the integrated circuit devices; and removing some of the first clad layer to decrease warp of the sheet or wafer with integrated circuit devices and a fan-out layer thereon. A method of producing a laminate sheet or wafer having a selected CTE is also disclosed.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: November 22, 2022
    Assignee: CORNING INCORPORATED
    Inventors: Jin Su Kim, Yu Xiao
  • Patent number: 11457162
    Abstract: A local tone mapping circuit includes an average value calculation unit suitable for calculating an average value of an absolute value of a difference between a center pixel data and a neighboring pixel data of the center pixel data; a range calculation unit suitable for calculating a range between a maximum value and a minimum value of the absolute value of a difference between the center pixel data and the neighboring pixel data; and a local tone mapping strength adjusting unit suitable for differently allocating a weighted value according to a distance between a center pixel and an edge pixel among neighboring pixels of the center pixel based on the range between the maximum value and the minimum value calculated by the range calculation unit and the average value calculated by the average value calculation unit, and adjusting a local tone mapping strength according to an allocated weighted value.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: September 27, 2022
    Assignee: SK hynix Inc.
    Inventors: Chang Ki Min, Jin Su Kim
  • Publication number: 20220274871
    Abstract: A laminated glass article comprises a core layer comprising a core glass composition, and a cladding layer directly adjacent to the core layer and comprising a clad glass composition. A stress of the cladding layer increases with increasing distance from an outer surface of the cladding layer from a compressive stress to a tensile stress, transitions to a compressive stress as a step-change at an interface region between the core layer and the cladding layer, and increases with increasing distance from the interface region to a center of the core layer from the compressive stress to a tensile stress.
    Type: Application
    Filed: July 31, 2020
    Publication date: September 1, 2022
    Inventors: Douglas Clippinger Allan, Vladislav Yuryevich Golyatin, Petr Gorelchenko, Jason Thomas Harris, Jin Su Kim, Peter Joseph Lezzi, Rostislav Vatchev Roussev, Natesan Venkataraman
  • Publication number: 20220278005
    Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
    Type: Application
    Filed: May 13, 2022
    Publication date: September 1, 2022
    Inventors: Heather Debra Boek, Paul Bennett Dohn, Jin Su Kim, Aize Li, Hugh Michael McMahon, Jun-Ro Yoon
  • Patent number: 11406733
    Abstract: The present invention relates to porous microparticles of a biodegradable polymer, and a polymer filler comprising the same.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: August 9, 2022
    Assignee: SAMYANG HOLDINGS CORPORATION
    Inventors: Jin Su Kim, Wang Soo Shin, Na Jeong Park, Young Joo Koh, Jun Bae Kim