Patents by Inventor Jin Su Kim

Jin Su Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11912010
    Abstract: A glass substrate comprises a glass clad layer fused to a glass core layer. The glass core layer comprises a core glass composition having an average core coefficient of thermal expansion (CTEcore) and the glass clad layer comprises a clad glass composition having an average clad coefficient of thermal expansion (CTEclad) that is less than the CTEcore. A maximum tensile stress in the glass core layer is less than 15 MPa.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: February 27, 2024
    Assignee: CORNING INCORPORATED
    Inventors: Petr Gorelchenko, Jin Su Kim, Lu Zhang
  • Patent number: 11917855
    Abstract: A display device includes a substrate, a transistor on the substrate, a pixel electrode connected to the transistor, a bank layer disposed on the pixel electrode and defining a pixel opening overlapping the pixel electrode, an emission layer in the pixel opening, a common electrode on the emission layer and the bank layer, an encapsulation layer on the common electrode, a sensing electrode on the encapsulation layer, a first insulating layer disposed on the encapsulation layer and overlapping the pixel opening, a second insulating layer on the first insulating layer, and a third insulating layer surrounding the first insulating layer. A refractive index of the first insulating layer, a refractive index of the second insulating layer, and a refractive index of the third insulating layer are different from one another, and the refractive index of the first insulating layer is greater than the refractive index of the third insulating layer.
    Type: Grant
    Filed: February 3, 2022
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jin-Su Byun, Jong Beom Hong, Woong Sik Kim, Jung Min Choi
  • Patent number: 11887282
    Abstract: A noise removing circuit includes an image combiner suitable for generating a high dynamic range (HDR) image by combining images having different exposure times; a detailed image generator suitable for generating a detailed image from the HDR image; an image strength evaluator suitable for evaluating strength of the detailed image; and a noise coring component suitable for performing a noise coring operation for removing noise from a region of the detailed image in which a signal to noise ratio (SNR) has decreased using a low threshold and a saturation threshold when the strength of the detailed image is less than a reference value.
    Type: Grant
    Filed: March 30, 2023
    Date of Patent: January 30, 2024
    Assignee: SK hynix Inc.
    Inventors: Dong Ik Kim, Jin Su Kim, Chang Ki Min, Seong Hee Park
  • Patent number: 11875993
    Abstract: A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a core glass having a core glass coefficient of thermal expansion ?core, the first clad layer and the second clad layer each comprising a clad glass having a clad glass coefficient of thermal expansion ?clad, where ?clad>?core; affixing integrated circuit devices to the second clad layer of the laminate sheet or wafer; forming a fan-out layer on or above the integrated circuit devices; and removing some of the first clad layer to decrease warp of the sheet or wafer with integrated circuit devices and a fan-out layer thereon. A method of producing a laminate sheet or wafer having a selected CTE is also disclosed.
    Type: Grant
    Filed: October 17, 2022
    Date of Patent: January 16, 2024
    Assignee: CORNING INCORPORATED
    Inventors: Jin Su Kim, Yu Xiao
  • Publication number: 20230402337
    Abstract: In some embodiments, a method comprises forming a pilot hole or damage track through a laminate glass structure using a laser. The laminate glass structure comprising a first layer and a second layer adjacent to the first layer. The first layer is formed from a first glass composition. The second layer is formed from a second glass composition different from the first glass composition. After forming the pilot hole, the laminate glass structure is exposed to etching conditions that etch the first glass composition at a first etching rate and the second glass composition at a second etching rate, wherein the first etch rate is different from the second etch rate, to form an etched hole.
    Type: Application
    Filed: November 9, 2021
    Publication date: December 14, 2023
    Inventors: Jin Su Kim, Daniel Wayne Levesque, Jr., Aize Li, Heather Nicole Vanselous
  • Patent number: 11843868
    Abstract: An electronic apparatus includes: an image sensor for acquiring an image including normal pixel values that are sensed during a first exposure time and short exposure pixel values that are sensed during a second exposure time that is shorter than the first exposure time; and a processor configured to acquire flag information that indicates that a selected region, among a plurality of regions of the image, is one of a motion region and a normal region by using an exposure ratio of the first exposure time and the second exposure time and by using a short exposure pixel value and normal pixel values, which are included in the selected region, and configured to output a restoration image including a restoration pixel value that is corrected from the short exposure pixel value that is included in the selected region, based on the flag information.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: December 12, 2023
    Assignee: SK hynix Inc.
    Inventors: Tae Hyun Kim, Jin Su Kim, Jong Hyun Bae
  • Publication number: 20230390248
    Abstract: The present invention relates to a composition for enhancing tumor penetration of an anticancer drug, comprising losartan as an active ingredient, and a use thereof, wherein in the composition, losartan decomposes collagen and hyaluronic acid, which are main components of the extracellular matrix, to enhance the penetration of various anticancer drugs, including an antibody for cancer treatment, into the center of a tumor and uniformly distribute the various anticancer drugs, thereby improving a cancer treatment effect of an anticancer drug.
    Type: Application
    Filed: October 15, 2021
    Publication date: December 7, 2023
    Applicant: KOREA INSTITUTE OF RADIOLOGICAL & MEDICAL SCIENCES
    Inventors: Jin Su KIM, Hyeongi KIM, Javeria ZAHEER
  • Publication number: 20230383346
    Abstract: The present invention relates to a biomarker composition for predicting the prognosis of brain diseases caused by microplastic exposure and a use thereof, wherein it was confirmed that polyethylene microspheres (PS) in a mouse animal model orally administered with the PS penetrate brain tissue to change the level of gene expression inside the brain tissue, thereby causing brain diseases, and thus the present invention is intended to provide: a biomarker composition for predicting the prognosis of brain diseases caused by microplastic exposure, the biomarker composition using a gene in which the expression level in an individual suspected of exposure to PS is identified; and a method for predicting the prognosis of brain diseases using the biomarker composition.
    Type: Application
    Filed: October 12, 2021
    Publication date: November 30, 2023
    Applicant: KOREA INSTITUTE OF RADIOLOGICAL & MEDICAL SCIENCES
    Inventors: Jin Su KIM, Hyeongi KIM, Javeria ZAHEER
  • Publication number: 20230364606
    Abstract: A method for manufacturing a microfluidic device includes depositing a bonding layer on a surface of a second glass layer of a glass substrate having a first glass layer and the second glass layer fused to the first glass layer, such that a masked region of the surface is covered by the bonding layer, and an exposed region of the surface is uncovered by the bonding layer; removing a portion of the second glass layer corresponding to the exposed region of the surface to form a flow channel in the glass substrate; and bonding a cover to the glass substrate with the bonding layer.
    Type: Application
    Filed: July 27, 2023
    Publication date: November 16, 2023
    Inventors: Ye Fang, Jin Su Kim, Aize Li
  • Publication number: 20230295038
    Abstract: A laminated glass article comprises a core layer comprising a core glass composition, and a cladding layer directly adjacent to the core layer and comprising a clad glass composition. A stress of the cladding layer increases with increasing distance from an outer surface of the cladding layer from a compressive stress to a tensile stress, transitions to a compressive stress as a step-change at an interface region between the core layer and the cladding layer, and increases with increasing distance from the interface region to a center of the core layer from the compressive stress to a tensile stress.
    Type: Application
    Filed: May 24, 2023
    Publication date: September 21, 2023
    Inventors: Douglas Clippinger Allan, Vladislav Yuryevich Golyatin, Petr Gorelchenko, Jason Thomas Harris, Jin Su Kim, Peter Joseph Lezzi, Rostislav Vatchev Roussev, Natesan Venkataraman
  • Patent number: 11764117
    Abstract: Wafer level encapsulated packages includes a wafer, a glass substrate hermetically sealed to the wafer, and an electronic component. The glass substrate includes a glass cladding layer fused to a glass core layer and a cavity formed in the glass substrate. The electronic component is encapsulated within the cavity. In various embodiments, the floor of the cavity is planar and substantially parallel to a plane defined by a top surface of the glass cladding layer. The glass cladding layer has a higher etch rate in an etchant than the glass core layer. In various embodiments, the wafer level encapsulated package is substantially optically transparent. Methods for forming the wafer level encapsulated package and electronic devices formed from the wafer level encapsulated package are also described.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: September 19, 2023
    Assignee: CORNING INCORPORATED
    Inventors: Robert Alan Bellman, Jin Su Kim
  • Patent number: 11752500
    Abstract: A method for manufacturing a microfluidic device (100) includes depositing a bonding layer (106) on a surface of a second glass layer (104a) of a glass substrate having a first glass layer (102) and the second glass layer (104a) fused to the first glass layer (102), such that a masked region of the surface is covered by the bonding layer, and an exposed region of the surface is uncovered by the bonding layer; removing a portion of the second glass layer corresponding to the exposed region of the surface to form a flow channel (112) in the glass substrate; and bonding a cover (108) to the glass substrate with the bonding layer (106).
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: September 12, 2023
    Assignee: CORNING INCORPORATED
    Inventors: Ye Fang, Jin Su Kim, Aize Li
  • Publication number: 20230271875
    Abstract: A method of forming a glass laminate includes providing a substrate having a core layer and at least one cladding layer; heat treating the substrate at a temperature such that the at least one cladding layer is phase-separated after the heat treating; and etch treating the substrate for at least 10 sec. A phase-separated glass laminate includes a substrate having a core layer and at least one phase-separated cladding layer, such that the glass laminate has a % transmission of at least 96%, and the at least one cladding layer comprises a grain size in a range of 10 nm to 1 ?m, or a graded glass index of greater than 5 nm.
    Type: Application
    Filed: May 5, 2021
    Publication date: August 31, 2023
    Inventors: Venkatesh Botu, Attila Lang de Falussy, Jin Su Kim, Karl William Koch, III, Aize Li, James Patrick Trice
  • Publication number: 20230254464
    Abstract: Disclosed is an image sensing device including a first module suitable for generating a plurality of interpolated images separated for each color channel, based on a raw image and a plurality of first convolution layers, a second module suitable for generating a plurality of refined images separated for each color channel, based on the plurality of interpolated images and a plurality of second convolution layers, and a third module suitable for generating at least one output image corresponding to the raw image, based on the plurality of refined images and a plurality of third convolution layers.
    Type: Application
    Filed: April 14, 2023
    Publication date: August 10, 2023
    Inventor: Jin Su KIM
  • Publication number: 20230241421
    Abstract: The present invention relates to a low-intensity focused ultrasound therapeutic device. According to one aspect of the present invention, provided is a low-intensity focused ultrasound therapeutic device which employs a single element ultrasound transducer having a focal region, a focal distance and output intensity that can be provide safer treatment for the deep brain of a patient.
    Type: Application
    Filed: December 10, 2020
    Publication date: August 3, 2023
    Applicant: NEUROSONA Co., Ltd.
    Inventors: Nam Kuy CHO, Jin Su KIM, Min Su YOO, Yun Seob YANG
  • Publication number: 20230237624
    Abstract: A noise removing circuit includes an image combiner suitable for generating a high dynamic range (HDR) image by combining images having different exposure times; a detailed image generator suitable for generating a detailed image from the HDR image; an image strength evaluator suitable for evaluating strength of the detailed image; and a noise coring component suitable for performing a noise coring operation for removing noise from a region of the detailed image in which a signal to noise ratio (SNR) has decreased using a low threshold and a saturation threshold when the strength of the detailed image is less than a reference value.
    Type: Application
    Filed: March 30, 2023
    Publication date: July 27, 2023
    Inventors: Dong Ik KIM, Jin Su KIM, Chang Ki MIN, Seong Hee PARK
  • Patent number: 11697617
    Abstract: A laminated glass article comprises a core layer comprising a core glass composition, and a cladding layer directly adjacent to the core layer and comprising a clad glass composition. A stress of the cladding layer increases with increasing distance from an outer surface of the cladding layer from a compressive stress to a tensile stress, transitions to a compressive stress as a step-change at an interface region between the core layer and the cladding layer, and increases with increasing distance from the interface region to a center of the core layer from the compressive stress to a tensile stress.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: July 11, 2023
    Assignee: CORNING INCORPORATED
    Inventors: Douglas Clippinger Allan, Vladislav Yuryevich Golyatin, Petr Gorelchenko, Jason Thomas Harris, Jin Su Kim, Peter Joseph Lezzi, Rostislav Vatchev Roussev, Natesan Venkataraman
  • Publication number: 20230212637
    Abstract: The present invention relates to: a biomarker composition for predicting the prognosis of brain disease caused by microplastic exposure; and a use thereof. More particularly, it was confirmed that polyethylene microspheres (PS) in a mouse animal model orally administered with the PS penetrate brain tissue to change the level of metabolites inside the brain tissue and the diversity of intestinal microorganisms, thereby causing brain disease, and thus the present invention is intended to provide a biomarker composition for predicting the prognosis of brain disease caused by microplastic exposure, and a method for predicting the prognosis of brain disease using same.
    Type: Application
    Filed: July 5, 2021
    Publication date: July 6, 2023
    Applicant: KOREA INSTITUTE OF RADIOLOGICAL & MEDICAL SCIENCES
    Inventors: Jin Su KIM, Hyeongi KIM, Javeria ZAHEER, Yong Jin LEE, Kyung Jun KANG, In Ok KO
  • Patent number: 11671571
    Abstract: Disclosed is an image sensing device including a first module suitable for generating a plurality of interpolated images separated for each color channel, based on a raw image and a plurality of first convolution layers, a second module suitable for generating a plurality of refined images separated for each color channel, based on the plurality of interpolated images and a plurality of second convolution layers, and a third module suitable for generating at least one output image corresponding to the raw image, based on the plurality of refined images and a plurality of third convolution layers.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: June 6, 2023
    Assignee: SK hynix Inc.
    Inventor: Jin Su Kim
  • Patent number: 11664285
    Abstract: An electronic package assembly includes a glass substrate including an upper glass cladding layer, a lower glass cladding layer, a glass core layer coupled to the upper glass cladding layer and the lower glass cladding layer, where the upper glass cladding layer and the lower glass cladding layer have a higher etch rate in an etchant than the glass core layer, a first cavity positioned within one of the upper glass cladding layer or the lower glass cladding layer, and a second cavity positioned within one of the upper glass cladding layer or the lower glass cladding layer, a microprocessor positioned within the first cavity, and a micro-electronic component positioned within the second cavity.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: May 30, 2023
    Assignee: CORNING INCORPORATED
    Inventors: Jin Su Kim, Scott Christopher Pollard