Patents by Inventor Jin Su Kim

Jin Su Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and terminal device for encrypting message
    Patent number: 10791124
    Abstract: A method and device for securing data of a message is provided. A method for encrypting a message of a user terminal device includes: receiving a message via a message input window; displaying the received message; encrypting the message by using a key index and an encryption key corresponding to a chatting window for the message based on an instruction for transmitting the message to another chatting party being received; and transmitting the encrypted message to the other chatting party.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: September 29, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jun-bum Shin, Jin-su Kim, Kyoung-yong Lee, Sung-wook Kim, Hye-jin Shin
  • Optical member and lighting device using the same
    Patent number: 10767837
    Abstract: Provided are an optical member capable of implementing optical images having a desired shape and a lighting device using the optical member. The optical member can include a base substrate and a plurality of unit patterns sequentially arranged on a first surface of the base substrate and each having an inclined surface with respect to the first surface. Each unit pattern can be extended in a pattern extension direction, respectively. The plurality of unit patterns and the inclined surfaces thereof can be structurally arranged on the first surface of the base substrate such that any beam of incident light that strikes a unit pattern at a right angle to the pattern extension direction in which said unit pattern extends is guided away from the optical member.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: September 8, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Dong Hyun Lee, Jin Su Kim, Seung Jong Baek, Jae Hyuk Jang
  • Semiconductor package and antenna module including the same
    Patent number: 10763217
    Abstract: A semiconductor package and an antenna module including the same includes a frame having first and second through-holes, a semiconductor chip disposed in the first through-hole of the frame and having an active surface on which a connection pad is disposed and an inactive surface disposed on an opposite side of the active surface, a wiring chip disposed in the second through-hole of the frame and including a body portion and a plurality of through vias penetrating the body portion, an encapsulant encapsulating at least portions of the semiconductor chip and the wiring chip, and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad of the semiconductor chip and the through via of the wiring chip.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: September 1, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Koon Lee, Jin Su Kim
  • Semiconductor package
    Patent number: 10756021
    Abstract: A semiconductor package includes: a connection member having first and second surfaces opposing each other and including a redistribution layer; a support member disposed on the first surface of the connection member, including a cavity, and having an inner sidewall surrounding the cavity of which an upper region is chamfered; a semiconductor chip disposed on the connection member in the cavity and having connection pads electrically connected to the redistribution layer; at least one electronic component disposed between the semiconductor chip and the inner sidewall and having connection terminals electrically connected to the redistribution layer; and an encapsulant encapsulating the semiconductor chip and the at least one electronic component disposed in the cavity.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: August 25, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ki Ju Lee, Jin Su Kim
  • Semiconductor package
    Patent number: 10727212
    Abstract: A semiconductor package includes a connection structure including a first insulation layer, a second insulation layer, first and second wiring layers, and first and second connection vias. A core structure including a core member is on the first insulation layer. A first through-hole passes through the core member. Passive components are on the first insulation layer in the first through-hole and connected to the first wiring layer through the first connection via. A first encapsulant covers at least a portion of the passive components. A second through-hole passes through the core structure and the first insulation layer. A semiconductor chip is on the second insulation layer in the second through-hole and is connected to the second wiring layer through the second connection via. A second encapsulant covers at least a portion of the semiconductor chip.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: July 28, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seon Hee Moon, Myung Sam Kang, Young Gwan Ko, Chang Bae Lee, Jin Su Kim
  • Precision Structured Glass Articles, integrated circuit packages, optical devices, microfluidic devices, and Methods for Making the Same
    Publication number: 20200235020
    Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
    Type: Application
    Filed: July 24, 2018
    Publication date: July 23, 2020
    Inventors: Heather Debra Boek, Paul Bennett Dohn, Jin Su Kim, Aize Li, Hugh Michael McMahon, Jun Ro Yoon
  • METHOD FOR PROCESSING IMAGE SIGNAL, IMAGE SIGNAL PROCESSOR, AND IMAGE SENSOR CHIP
    Publication number: 20200228709
    Abstract: A method for processing an image signal, an image signal processor, and an image sensor chip are disclosed. A method for processing an image signal includes generating Bayer order status information indicating whether a Bayer order of a Bayer pattern image has been changed, based on translation information of gyro information, performing translation correction about the Bayer pattern image using the translation information, and performing interpolation about the Bayer pattern image in which the translation correction has been performed, based on the Bayer order status information.
    Type: Application
    Filed: November 1, 2019
    Publication date: July 16, 2020
    Inventors: Jae Ho An, Su Min Kim, Jin Su Kim, Tae Hyun Kim, Jae Yoon Yoo, Chang Hee Pyeoun
  • METHOD FOR PREPARING BIODEGRADABLE POLYMER MICROPARTICLES, AND BIODEGRADABLE POLYMER MICROPARTICLES PREPARED THEREBY
    Publication number: 20200207930
    Abstract: Provided are: a method for preparing biodegradable polymer microparticles and, particularly, porous microparticles of a biodegradable polymer; and biodegradable polymer microparticles prepared thereby, particularly, porous microparticles of a biodegradable polymer.
    Type: Application
    Filed: July 25, 2018
    Publication date: July 2, 2020
    Applicant: SAMYANG BIOPHARMACEUTICALS CORPORATION
    Inventors: Jin Su KIM, Wang Soo SHIN, Na Jeong PARK
  • ANTENNA MODULE
    Publication number: 20200185815
    Abstract: An antenna module includes an antenna substrate having a first surface and a second surface disposed to oppose each other, and including a substrate wiring layer having a first antenna pattern positioned in a first region, a second antenna pattern disposed in a second region adjacent to one side, and first and second feed patterns connected to the first and second antenna patterns, respectively; and a semiconductor package including a connection structure disposed on the second surface except for an area overlapping with the second region of the antenna substrate and redistribution layers electrically connected to the substrate wiring layer, and at least one semiconductor chip having connection pads connected to the redistribution layers. A region overlapping with the second feed pattern in each of the plurality of redistribution layers is provided as an opened region.
    Type: Application
    Filed: May 13, 2019
    Publication date: June 11, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Koon Lee, Jin Su Kim
  • FAN-OUT SEMICONDUCTOR PACKAGE
    Publication number: 20200126942
    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion having a stopper layer; a semiconductor chip having connection pads, an active surface on which the connection pads are disposed, and an inactive surface opposing the active surface, and disposed in the recess portion so that the inactive surface is connected to the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; and a connection member disposed on the frame and the active surface of the semiconductor chip and including a redistribution layer electrically connecting the wiring layers of the frame and the connection pads of the semiconductor chip to each other, wherein the stopper layer includes an insulating material.
    Type: Application
    Filed: November 27, 2019
    Publication date: April 23, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD
    Inventors: Jeong Ho LEE, Bong Ju CHO, Young Gwan KO, Jin Su Kim, Shang Hoon SEO, Jeong II LEE
  • POROUS MICROPARTICLES OF BIODEGRADABLE POLYMER, AND POLYMER FILLER COMPRISING SAME
    Publication number: 20200069839
    Abstract: The present invention relates to porous microparticles of a biodegradable polymer, and a polymer filler comprising the same.
    Type: Application
    Filed: August 10, 2017
    Publication date: March 5, 2020
    Applicant: SAMYANG BIOPHARMACEUTICALS CORPORATION
    Inventors: Jin Su KIM, Wang Soo SHIN, Na Jeong PARK, Young Joo KOH, Jun Bae KIM
  • SEMICONDUCTOR PACKAGE AND ANTENNA MODULE INCLUDING THE SAME
    Publication number: 20200066662
    Abstract: A semiconductor package includes a frame having a first through-hole, a semiconductor chip having an active surface on which a connection pad is disposed; a first encapsulant encapsulating at least a portion of the semiconductor chip; a second encapsulant disposed on at least a portion of the external side surface of the frame, and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad of the semiconductor chip. The frame includes an insulating layer, a wiring layer disposed on upper and lower surfaces of the insulating layer, a first metal layer on the external side wall of the insulating layer, a second metal layer on the internal side wall of the first through hole, and a via penetrating the upper and lower surfaces of the insulating layer.
    Type: Application
    Filed: February 21, 2019
    Publication date: February 27, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Koon LEE, Jin Su KIM
  • Electronic apparatus and controlling method thereof
    Patent number: 10567661
    Abstract: An electronic apparatus which prevents and/or reduces photographing of contents is provided. The electronic apparatus includes a camera and a processor configured to cause the electronic apparatus to turn off the display and/or control a display to display a UI for restricting photographing of the content in response to a predetermined object being detected in an image received by the camera.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: February 18, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jin-su Kim
  • SEMICONDUCTOR PACKAGE AND ANTENNA MODULE INCLUDING THE SAME
    Publication number: 20200035607
    Abstract: A semiconductor package and an antenna module including the same includes a frame having first and second through-holes, a semiconductor chip disposed in the first through-hole of the frame and having an active surface on which a connection pad is disposed and an inactive surface disposed on an opposite side of the active surface, a wiring chip disposed in the second through-hole of the frame and including a body portion and a plurality of through vias penetrating the body portion, an encapsulant encapsulating at least portions of the semiconductor chip and the wiring chip, and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad of the semiconductor chip and the through via of the wiring chip.
    Type: Application
    Filed: February 22, 2019
    Publication date: January 30, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Koon LEE, Jin Su KIM
  • LIGHT FIXTURE COVER AND LIGHT FIXTURE COMPRISING THE SAME
    Publication number: 20200018459
    Abstract: A strengthened glass cover for a light fixture includes a glass core layer, a first glass cladding layer fused to a first surface of the glass core layer, and a second glass cladding layer fused to a second surface of the glass core layer. A coefficient of thermal expansion (CTE) of the glass core layer is greater than a CTE of each of the first glass cladding layer and the second glass cladding layer, whereby the glass core layer is in tension and each of the first glass cladding layer and the second glass cladding layer is in compression. A light fixture includes a housing and the cover coupled to the housing.
    Type: Application
    Filed: November 28, 2017
    Publication date: January 16, 2020
    Inventors: Paul Bennett Dohn, Jin Su Kim
  • Fan-out semiconductor package
    Patent number: 10522497
    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion having a stopper layer; a semiconductor chip having connection pads, an active surface on which the connection pads are disposed, and an inactive surface opposing the active surface, and disposed in the recess portion so that the inactive surface is connected to the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; and a connection member disposed on the frame and the active surface of the semiconductor chip and including a redistribution layer electrically connecting the wiring layers of the frame and the connection pads of the semiconductor chip to each other, wherein the stopper layer includes an insulating material.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: December 31, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jeong Ho Lee, Bong Ju Cho, Young Gwan Ko, Jin Su Kim, Shang Hoon Seo, Jeong Il Lee
  • SEMICONDUCTOR PACKAGE
    Publication number: 20190378775
    Abstract: A semiconductor package may include a core member having first and second through-holes, a passive component disposed in the first through-hole of the core member, a semiconductor chip disposed in the second through-hole of the core member and having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, a first encapsulant encapsulating at least a portion of the passive component and having a first thermal conductivity, a second encapsulant encapsulating at least a portion of the semiconductor chip and having a second thermal conductivity higher than the first thermal conductivity, and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip.
    Type: Application
    Filed: October 24, 2018
    Publication date: December 12, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Koon LEE, Jin Su KIM
  • Fan-out semiconductor package
    Patent number: 10504825
    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion having a stopper layer; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is connected to the stopper layer; first metal bumps disposed on the connection pads; second metal bumps disposed on an uppermost wiring layer of the wiring layers; an encapsulant covering at least portions of each of the frame, the semiconductor chip, and the first and second metal bumps and filling at least portions of the recess portion; and a connection member disposed on the frame and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads and the uppermost wiring layer through the first and second metal bumps.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: December 10, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jeong Il Lee, Jeong Ho Lee, Jin Su Kim, Bong Ju Cho
  • SEMICONDUCTOR PACKAGE
    Publication number: 20190371731
    Abstract: A semiconductor package includes a support member including a resin body having a first surface and a second surface opposing each other and having a cavity, and at least one passive component embedded in the resin body and having a connection terminal exposed from the first surface; a first connection member disposed on the first surface of the resin body, and having a first redistribution layer on the first insulating layer and connected to the connection terminal; a second connection member disposed on the first connection member and covering the cavity, and having a second redistribution layer on the second insulating layer and connected to the first redistribution layer; and a semiconductor chip disposed on the second connection member in the cavity.
    Type: Application
    Filed: October 1, 2018
    Publication date: December 5, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myung Sam KANG, Jin Su KIM, Yong Jin PARK, Young Gwan KO, Yong Jin SEOL
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20190371732
    Abstract: A semiconductor device includes a semiconductor chip having an active surface having connection pads disposed thereon; an encapsulant encapsulating at least portions of the semiconductor chip, a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads, a passivation layer disposed on the connection member, and an under bump metallurgy (UBM) layer embedded in the passivation layer and electrically connected to the redistribution layer of the connection member. The UBM layer includes a UBM pad embedded in the passivation layer and having a recess portion, and a UBM via penetrating through a portion of the passivation layer and electrically connecting the redistribution layer of the connection member and the UBM pad to each other.
    Type: Application
    Filed: August 14, 2019
    Publication date: December 5, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Han Ul LEE, Jin Su KIM, Young Gwan KO