Abstract: There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

Abstract: Provided is a hybrid substrate with high density and low density substrate areas and a method of manufacturing the same. The hybrid substrate with high density and low density substrate areas includes a low density substrate layer having a cavity and a low density area, a high density substrate layer mounted in the cavity of the low density substrate layer and formed of a high density area having a higher pattern density than that of the low density area, an insulating support layer comprising a deposition area formed on upper portions, lower portions and the upper and lower portions of the high density substrate layer and the low density substrate layer, insulating layer vias passing through the deposition area of the insulating support layer and connected to patterns of the high density substrate layer and the low density substrate layer, and an outer pattern layer.

Abstract: Disclosed herein a solder injection head including: a bump material storing part having a bump material stored therein; a discharging part having one side connected to the bump material storing part and discharging the bump material to the outside; a heating part formed at at least one side of the discharging part and heating the bump material passing through the discharging part; and a press-fitting part press-fitting the bump material discharged to the outside and injecting the bump material onto a substrate.

Abstract: Disclosed herein is substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.

Abstract: Disclosed herein is a solder ball supplying apparatus including: a cartridge formed in a box shape and having a plurality of solder balls embedded therein; a vibration unit coupled to a lower portion of the cartridge; and a metal mask coupled integrally with a lower portion of the vibration unit and having a plurality of holes formed over the entire surface thereof.

Abstract: Disclosed herein are a mask for bumping solder balls on a circuit board and a solder ball bumping method using the same. The mask includes: a plurality of openings providing spaces into which the solder balls are inserted to thereby be seated on solder pads; and trenches providing introduction spaces for spreading a flux to portions at which the solder balls are seated on the solder pads and extended from at least one side of circumferences of the openings.

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, including: preparing a base substrate; disposing a mask having through-holes formed therein on one surface of the base substrate; inserting metal core balls into the through-holes of the mask, performing reflow treatment on the metal core balls, and removing the mask; and laminating an insulating layer on one surface of the base substrate.

Abstract: Disclosed is a substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.

Abstract: Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate.

Abstract: Disclosed herein a solder injection head including: a bump material storing part having a bump material stored therein; a discharging part having one side connected to the bump material storing part and discharging the bump material to the outside; a heating part formed at at least one side of the discharging part and heating the bump material passing through the discharging part; and a press-fitting part press-fitting the bump material discharged to the outside and injecting the bump material onto a substrate.

Abstract: Disclosed herein a packaging method including: (A) forming a plurality of pads and another circuit pattern on a substrate; (B) forming a second dry film pattern including opening exposing the pad; (C) mounting a solder coating ball in the opening of the second dry film pattern; (D) performing a reflow process on the solder coating ball in order to allow the solder coating ball to have a modified pattern; (E) delaminating the second dry film pattern; and (F) forming a solder pattern including the modified pattern of the solder coating ball in a solder to mount a chip on the substrate using the solder pattern.

Abstract: Disclosed herein is a solder ball supplying apparatus including: a cartridge formed in a box shape and having a plurality of solder balls embedded therein; a vibration unit coupled to a lower portion of the cartridge; and a metal mask coupled integrally with a lower portion of the vibration unit and having a plurality of holes formed over the entire surface thereof.

Abstract: A method of fabricating a package substrate including preparing a substrate having at least one conductive pad, forming an insulating layer having an opening to expose the conductive pad on the substrate, forming a separation barrier layer on the conductive pad inside the opening to be higher than the upper surface of the insulating layer along the side walls thereof, forming a post terminal on the separation barrier layer, and forming a solder bump on the post terminal.

Abstract: There is provided a method of manufacturing a substrate for flip chip, and a substrate for flip chip manufactured using the same. The method includes providing a base substrate including at least one conductive pad, forming a solder resist layer on the base substrate, the solder resist layer including a first opening exposing the conductive pad, forming a dry film on the solder resist layer, the dry film including a second opening connected with the first opening, forming a metal post in the first opening and a part of the second opening, filling the second opening above the metal post with solder paste, forming a solder cap by performing a reflow process on the filled solder paste, planarizing a surface of the solder cap, and removing the dry film. Accordingly, fine pitches and improve reliability can be achieved.

Abstract: Disclosed herein are a printed circuit board (PCB) and a method for manufacturing the same. The PCB includes a base substrate, a circuit layer formed on the base substrate and including a connection pad, a solder resist layer formed on an upper portion of the base substrate and having an opening exposing the connection pad, a metal post formed on upper portions of the connection pad and the solder resist layer and having a plurality of diameters, and a seed layer formed on the upper portion of the solder resist layer and inner walls of the opening along an interface of the metal post.

Abstract: There is provided a package substrate capable of controlling the degree of warpage thereof by improving the composition and formation of a post terminal and a method of fabricating the same. The package substrate includes a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a separation barrier layer provided on the conductive pad inside the opening and formed to be higher than the upper surface of the insulating layer along the side walls thereof; a post terminal provided on the separation barrier layer; and a solder bump provided on the post terminal.

Abstract: A lead pin for a package substrate includes a coupling pin, a head portion, and a flowing prevention portion. The coupling pin is to be inserted into a hole which is formed in an external substrate. The head portion is formed at one end of the coupling pin. The flowing prevention portion is formed on the top surface of the head portion and prevents a solder paste from flowing toward the coupling pin on the top surface of the head portion when the head portion is mounted on the package substrate.

Abstract: A method of manufacturing a printed circuit board having a flow preventing dam, including: applying a dry film resist on a base substrate having a solder pad, and then primarily exposing the dry film resist to light; secondarily exposing the primarily exposed dry film resist formed on a peripheral area of the base substrate to light, thus forming a flow preventing dam; removing the unexposed dry film resist to expose the solder pad, thus forming an opening; printing the opening with a solder paste, and then forming a solder bump through a reflow process; and removing the primarily exposed dry film resist.

Abstract: Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.

Abstract: Disclosed herein is a printed circuit board, including: a base substrate having a connection pad; a lead pin bonded to the connection pad; and a surface treatment layer formed at the exposed portions of the connection pad and the lead pin.