Abstract: A method of manufacturing a printed circuit board having a flow preventing dam, including: applying a dry film resist on a base substrate having a solder pad, and then primarily exposing the dry film resist to light; secondarily exposing the primarily exposed dry film resist formed on a peripheral area of the base substrate to light, thus forming a flow preventing dam; removing the unexposed dry film resist to expose the solder pad, thus forming an opening; printing the opening with a solder paste, and then forming a solder bump through a reflow process; and removing the primarily exposed dry film resist

Abstract: A method of manufacturing a heat radiation substrate having a metal core, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.

Abstract: Disclosed is a spatial modelling system. The spatial modelling system comprises: a modelling module for generating modelling information about a space in accordance with input from a user; a space syntax module for perceiving the space on the basis of the modelling information generated by the modelling module, and generating information about the space syntax of at least one portion of the space; and a control module for displaying the results of an analysis of the space syntax of the at least one portion of the space, on the basis of information about the space syntax obtained by analysis by means of the space syntax module.

Abstract: Disclosed is a printed circuit board having a flow preventing dam and a manufacturing method thereof. The printed circuit board includes a base substrate having a solder pad, a solder bump formed on the solder pad of the base substrate, and a flow preventing dam formed on a peripheral area of the base substrate using a dry film resist. The flow preventing dam can prevent the outflow of an underfill solution and can be simply formed.

Abstract: There is provided a package substrate capable of controlling the degree of warpage thereof by improving the composition and formation of a post terminal and a method of fabricating the same. The package substrate includes a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a separation barrier layer provided on the conductive pad inside the opening and formed to be higher than the upper surface of the insulating layer along the side walls thereof; a post terminal provided on the separation barrier layer; and a solder bump provided on the post terminal.

Abstract: A storage system includes a plurality of data processing devices connected in series. One of the data processing devices either accesses a first data storage device or transmits an access command output from a host to an next data processing device in the series according to the access command. The data processing device determines whether to access a second data storage device according to the received access command.

Abstract: There is provided a package substrate allowing for enhanced reliability by improving the structure of a solder bump and a method of fabricating the same. The package substrate includes: a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a post terminal provided on the conductive pad inside the opening; and a solder bump provided on the post terminal and having an angle between a bottom surface and a side surface thereof ranging from 80° to 120°.

Abstract: Disclosed is a lead pin for a semiconductor package. The lead pin includes a coupling pin inserted into a hole formed in an external device, a head portion disposed at one end of the coupling pin, and a step portion formed in a stepped manner between the coupling pin and the head portion, the step portion having a smaller size than the head portion.

Abstract: A method of operating a hard disk drive (HDD) on the basis of a predicted new defect in a disk associated with the HDD is disclosed. The method includes detecting defects in a magnetic surface of the disk, defining a plurality of clusters by grouping the detected defects using a hierarchical clustering algorithm, calculating a curve fit for each one of the plurality of clusters, predicting a new defect likely to occur in the magnetic surface of the disk on the basis of the calculated curve fit; and writing data to the disk on the basis of the new defect prediction.

Abstract: The present invention provides a pharmaceutical formulation comprising an immediate-release compartment containing an angiotensin-2 receptor blocker (ARB) as a pharmacologically active ingredient and an extended-release compartment containing a non-dihydropyridine calcium channel blocker as a pharmacologically active ingredient. Since the disclosed formulation enables the release of the two ingredients at a different time, it reduces side effects and increases the effects of the drug more than the case of separately administering the ingredients each at the same time. In addition, the formulation maximizes the effects of drug at the time of day when the complication risk of cardiovascular system diseases is highest.

Abstract: A method of manufacturing a heat radiation substrate having a metal core, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.

Abstract: There is provided a method of manufacturing a substrate for flip chip, and a substrate for flip chip manufactured using the same. The method includes providing a base substrate including at least one conductive pad, forming a solder resist layer on the base substrate, the solder resist layer including a first opening exposing the conductive pad, forming a dry film on the solder resist layer, the dry film including a second opening connected with the first opening, forming a metal post in the first opening and a part of the second opening, filling the second opening above the metal post with solder paste, forming a solder cap by performing a reflow process on the filled solder paste, planarizing a surface of the solder cap, and removing the dry film. Accordingly, fine pitches and improve reliability can be achieved.

Abstract: A lead pin for a package substrate includes a coupling pin, a head portion, and a flowing prevention portion. The coupling pin is to be inserted into a hole which is formed in an external substrate. The head portion is formed at one end of the coupling pin. The flowing prevention portion is formed on the top surface of the head portion and prevents a solder paste from flowing toward the coupling pin on the top surface of the head portion when the head portion is mounted on the package substrate.

Abstract: There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate.

Abstract: Provided is a lead pin for package boards including a disk-shaped head of which the diameter increases toward the middle portion thereof and that has a hexagonal vertical cross-sectional shape; and a connection pin that is formed so as to project from the center of the upper surface of the head.

Abstract: Disclosed herein is a method of manufacturing a heat radiation substrate, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.

Abstract: Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate that is bonded to a package substrate by interposing a solder paste between the lead pin for the package substrate and the package substrate, the lead pin for the package substrate including: a cylindrical connection pin; and a head part that is formed on one end of the connection pin, wherein the head part includes a disk shaped flange part, and a round part that is formed on one surface of the flange part and is configured to include first and second curved surfaces having different radii of curvature, the first and second curved surfaces each having different radii of curvature selected from a range of 1:0.1 to 1:5 as compared to a diameter of the connection pin.

Abstract: A post bump formed over an electrode pad of a substrate for electrically connecting to an external device, the post bump including a metal post formed over the electrode pad; and a solder formed over the metal post and shaped as a dome, the dome occupying a space defined by imaginary lines extending from a perimeter of the metal post along an axial direction of the metal post.

Abstract: Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.

Abstract: Disclosed is a substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided.