Patents by Inventor Jin Won Choi

Jin Won Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100299638
    Abstract: A function execution method and apparatus thereof for displaying one or more sub-functions included in a function selected by a first touch on a trace according to a second touch input based upon the first and the second touches inputted with a timing difference, and executing the relevant sub-function selected among the displayed one or more sub-functions. For this purpose, a function execution method according to the present invention is performed by comprising: detecting a first touch input touched on a display unit; detecting a drag created by a second touch inputted while maintaining the first touch; and displaying one or more sub-functions included in a function selected by the first touch along a trace of the detected drag on the display unit.
    Type: Application
    Filed: September 10, 2009
    Publication date: November 25, 2010
    Inventor: Jin-Won CHOI
  • Publication number: 20100271792
    Abstract: An electronic component package and a method of manufacturing the same are disclosed. The method can include: providing a board, on which a multiple number of pads are formed; forming a solder resist layer, in which an opening superimposing over all of the pads is formed, on the board; forming metal posts over the pads, respectively; mounting an electronic component on the board by bonding the electrodes to the metal posts; and forming an underfill resin layer in the opening such that the underfill resin layer is interposed between the electronic component and the board. The solder resist layer may function as a dam that prevents the underfill resin layer from leaking in lateral directions during the subsequent underfill process so that the additional processes, such as dispensing, etc., that were required for forming a separate dam can be omitted, and the process time and costs can be reduced.
    Type: Application
    Filed: November 4, 2009
    Publication date: October 28, 2010
    Inventors: Jin-Won Choi, Soon-Jin Cho, Hueng-Jae Oh, Seung-Wan Kim, Seon-Jae Mun
  • Publication number: 20100270067
    Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. In accordance with an embodiment of the present invention, the method includes providing a substrate having a pad formed thereon, forming a resist on the substrate, in which the resist has an opening formed therein such that the pad is exposed, forming a metal post inside the opening such that the metal post is electrically connected to the pad, forming a through-hole in the resist by removing a portion of the resist such that the through-hole surrounds the metal post, and forming a solder layer inside the through-hole and on an upper surface of the metal post so as to cover an exposed surface of the metal post.
    Type: Application
    Filed: November 3, 2009
    Publication date: October 28, 2010
    Inventors: Jin-Won CHOI, Tae-Joon Chung, Dong-Gyu Lee, Seok-Hwan Ahn, Seung-Wan Kim
  • Patent number: 7736952
    Abstract: A wafer packaging method is disclosed. An aspect of the invention is to provide a wafer packaging method comprising; attaching tape onto one side of a carrier, the carrier having a through-hole formed therein; attaching a wafer onto the tape exposed inside the through-hole such that at least one electrode of the wafer is exposed; and performing a packaging process on the carrier such that the wafer is packaged.
    Type: Grant
    Filed: January 25, 2008
    Date of Patent: June 15, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Soon-Jin Cho, Jin-Won Choi, Seung-Hyun Cho, Chung-Woo Cho, Dong-Gyu Lee, Seok-Hwan Ahn
  • Publication number: 20100132998
    Abstract: The invention relates to a substrate having a metal post and a method of manufacturing the same, in which a round solder bump part formed on a metal post melts and flows down along a lateral surface of the metal post by being subjected twice to a reflow process, thus forming a solder bump film for preventing oxidation and corrosion of the metal post.
    Type: Application
    Filed: February 27, 2009
    Publication date: June 3, 2010
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Gyu Lee, Jin Won Choi, Young Gwan Ko, Seon Jae Mun, Tae Joon Chung
  • Publication number: 20100116534
    Abstract: Disclosed is a printed circuit board having a flow preventing dam and a manufacturing method thereof The printed circuit board includes a base substrate having a solder pad, a solder bump formed on the solder pad of the base substrate, and a flow preventing dam formed on a peripheral area of the base substrate using a dry film resist. The flow preventing dam can prevent the outflow of an underfill solution and can be simply formed.
    Type: Application
    Filed: February 27, 2009
    Publication date: May 13, 2010
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Won Choi, Seung Wan Kim
  • Publication number: 20100044084
    Abstract: Provided is a printed circuit board (PCB) including a substrate that has a pad formed thereon; solder resist that is disposed on the substrate so as to expose the pad; a post that is disposed on the post; a surface-treatment layer that is disposed on the post; and a bump that is disposed on the surface-treatment layer.
    Type: Application
    Filed: October 23, 2008
    Publication date: February 25, 2010
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Gyu LEE, Seon Jae MUN, Jin Won CHOI, Tae Joon CHUNG
  • Patent number: 7663826
    Abstract: A method and an apparatus for copying data of a disc drive are provided. The method includes: determining whether the first disc drive has a predetermined jumper pin connection by identifying which of a plurality of jumper pins in a jumper block of the first disc drive are connected, the jumper block being used to determine an operation mode of the first disc drive; transmitting a copy command from the first disc drive to the second disc drive if the first disc drive has the predetermined jumper pin connection; and copying data recorded in the first disc drive to the second disc drive in response to the copy command. Accordingly, it is possible to copy data recorded in a first hard disc drive (HDD) to a second HDD without the aid of an additional host.
    Type: Grant
    Filed: January 12, 2006
    Date of Patent: February 16, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jin-won Choi
  • Publication number: 20100000761
    Abstract: Provided is a lead pin for package boards including a disk-shaped head of which the diameter increases toward the middle portion thereof and that has a hexagonal vertical cross-sectional shape; and a connection pin that is formed so as to project from the center of the upper surface of the head.
    Type: Application
    Filed: September 15, 2008
    Publication date: January 7, 2010
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hueng Jae Oh, Jin Won Choi
  • Publication number: 20090297801
    Abstract: Disclosed herein is a method of manufacturing a heat radiation substrate, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.
    Type: Application
    Filed: December 26, 2007
    Publication date: December 3, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD
    Inventors: Seung Hyun Cho, Byoung Youl Min, Soon Jin Cho, Jin Won Choi
  • Patent number: 7595292
    Abstract: Novel biologically active compounds of the general formula (I) in which one of X and X? represents a polymer, and the other represents a hydrogen atom; each Q independently represents a linking group; W represents an electron-withdrawing moiety or a moiety preparable by reduction of an electron-withdrawing moiety; or, if X? represents a polymer, X-Q-W- together may represent an electron withdrawing group; and in addition, if X represents a polymer, X? and electron withdrawing group W together with the interjacent atoms may form a ring; each of Z1 and Z2 independently represents a group derived from a biological molecule, each of which is linked to A and B via a nucleophilic moiety; or Z1 and Z2 together represent a single group derived from a biological molecule which is linked to A and B via two nucleophilic moieties; A is a C1-5 alkylene or alkenylene chain; and B is a bond or a C1-4 alkylene or alkenylene chain; are formed by conjugating a suitable polymer to a suitable biologically active molecule via nuc
    Type: Grant
    Filed: July 12, 2004
    Date of Patent: September 29, 2009
    Assignee: Polytherics Limited
    Inventors: Stephen James Brocchini, Antony Robert Godwin, Elisa Pedone, Jin-Won Choi, Sunil Shaunak
  • Publication number: 20090205854
    Abstract: A printed circuit board for use in a package and to a method of manufacturing the printed circuit board. The method of manufacturing the printed circuit board can include: providing a substrate, on one side of which at least one solder pad and at least one guide pad are formed; forming a solder resist layer over the one side of the substrate; uncovering at least one portion of the solder resist layer such that the guide pad is exposed; applying a surface treatment on the exposed guide pad; uncovering at least one portion of the solder resist layer such that the solder pad is exposed; and forming a solder bump on the exposed solder pad. With this method, the amount of surface treatment applied can be minimized, for reduced costs, and the occurrence of undiffused layers can be avoided, for improved reliability in the final product.
    Type: Application
    Filed: July 16, 2008
    Publication date: August 20, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong-Gyu Lee, Jin-Won Choi, Ki-Young Yoo, Tae-Joon Chung
  • Publication number: 20090184420
    Abstract: A post bump and a method of forming the post bump are disclosed. The method of forming the post bump can include: forming a resist layer, in which an aperture is formed in correspondence to a position of an electrode pad, over a substrate, on which the electrode pad is formed; forming a metal post by filling a part of the aperture with a metallic material; filling a remaining part of the aperture with solder; reflowing the solder by applying heat; and removing the resist layer. This method can be utilized to prevent deviations in the plated solder and prevent the unnecessary flowing of the solder over the sides of the metal post during reflowing, so that the amount of solder used can be minimized.
    Type: Application
    Filed: June 19, 2008
    Publication date: July 23, 2009
    Applicant: SAMSUNG ELECTROMECHANICS CO., LTD.
    Inventors: Jin-Won Choi, Chang-Sup Ryu, Seung-Hyun Cho, Seung-Wan Kim
  • Publication number: 20090153997
    Abstract: A method of operating a hard disk drive (HDD) on the basis of a predicted new defect in a disk associated with the HDD is disclosed. The method includes detecting defects in a magnetic surface of the disk, defining a plurality of clusters by grouping the detected defects using a hierarchical clustering algorithm, calculating a curve fit for each one of the plurality of clusters, predicting a new defect likely to occur in the magnetic surface of the disk on the basis of the calculated curve fit; and writing data to the disk on the basis of the new defect prediction.
    Type: Application
    Filed: June 23, 2008
    Publication date: June 18, 2009
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hristov Stoev YOULIAN, Jin-won CHOI, Nam-guk KIM
  • Publication number: 20090087950
    Abstract: A wafer packaging method is disclosed. An aspect of the invention is to provide a wafer packaging method comprising; attaching tape onto one side of a carrier, the carrier having a through-hole formed therein; attaching a wafer onto the tape exposed inside the through-hole such that at least one electrode of the wafer is exposed; and performing a packaging process on the carrier such that the wafer is packaged.
    Type: Application
    Filed: January 25, 2008
    Publication date: April 2, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soon-Jin Cho, Jin-Won Choi, Seung-Hyun Cho, Chung-Woo Cho, Dong-Gyu Lee, Seok-Hwan Ahn
  • Publication number: 20090025581
    Abstract: This invention relates to a mask for screen printing, which includes a mask body composed of a plurality of pattern areas having holes for screen printing and a peripheral area surrounding the outside of the pattern areas; and a protrusion portion formed in the peripheral area of a back surface of the mask body, and to a screen printing method using the same.
    Type: Application
    Filed: December 26, 2007
    Publication date: January 29, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soon Jin Cho, Seon Jae Mun, Jin Won Choi
  • Publication number: 20060210526
    Abstract: Novel biologically active compounds of the general formula (I) in which one of X and X? represents a polymer, and the other represents a hydrogen atom; each Q independently represents a linking group; W represents an electron-withdrawing moiety or a moiety preparable by reduction of an electron-withdrawing moiety; or, if X? represents a polymer, X-Q-W- together may represent an electron withdrawing group; and in addition, if X represents a polymer, X? and electron withdrawing group W together with the interjacent atoms may form a ring; each of Z1 and Z2 independently represents a group derived from a biological molecule, each of which is linked to A and B via a nucleophilic moiety; or Z1 and Z2 together represent a single group derived from a biological molecule which is linked to A and B via two nucleophilic moieties; A is a C1-5 alkylene or alkenylene chain; and B is a bond or a C1-4 alkylene or alkenylene chain; are formed by conjugating a suitable polymer to a suitable biologically active molecule via nuc
    Type: Application
    Filed: July 12, 2004
    Publication date: September 21, 2006
    Inventors: Stephen Brocchini, Antony Godwin, Elisa Pedone, Jin-Won Choi, Sunil Shaunak
  • Publication number: 20060158761
    Abstract: A method and an apparatus for copying data of a disc drive are provided. The method includes: determining whether the first disc drive has a predetermined jumper pin connection by identifying which of a plurality of jumper pins in a jumper block of the first disc drive are connected, the jumper block being used to determine an operation mode of the first disc drive; transmitting a copy command from the first disc drive to the second disc drive if the first disc drive has the predetermined jumper pin connection; and copying data recorded in the first disc drive to the second disc drive in response to the copy command. Accordingly, it is possible to copy data recorded in a first hard disc drive (HDD) to a second HDD without the aid of an additional host.
    Type: Application
    Filed: January 12, 2006
    Publication date: July 20, 2006
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Jin-won Choi
  • Publication number: 20050182897
    Abstract: A method to partition a hard disc drive which conceals part of a storage region in a hard disc drive from the outside to thereby heighten a security of data, and a hard disc drive configured for the HDD partitioning method. The hard disc drive partitioning method includes receiving a section table having information on the number, passwords, starting positions, lengths, and activation or non-activation of sections each having a master boot record and file allocation information; and storing the section table in the storage region which may be accessed only by the hard disc drive, in which the hard disc drive may access only the activated section among the sections. Here, the hard disc drive allows only activated section to be accessed among the sections.
    Type: Application
    Filed: February 17, 2005
    Publication date: August 18, 2005
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Jin-won Choi
  • Patent number: 6258186
    Abstract: A method for manufacturing a hot rolled galvanized steel sheet at a high speed, with the pickling skipped, is disclosed, in which an intermediate rapid cooling is carried out at a predetermined temperature so as to make the wüstite component of the scales become 20% or more after a hot rolling, then a reducing heat-treatment is carried out, and then the steel sheet is dipped into a zinc bath containing a predetermined amount of Al, thereby realizing a superior coating adherence and a superior productivity. The hot rolled steel sheet is cooled at a usual cooling rate, and is coiled. Then an intermediate rapid cooling is carried out on the hot rolled steel sheet (thus coiled) to an intermediate rapid cooling temperature of 300-500° C. so as to make a wüstite component of scales become 20% or more. Then a reducing heat treatment is carried out at a temperature of 550-700° C. for 30-300 seconds under a 20% (or more) hydrogen atmosphere.
    Type: Grant
    Filed: December 28, 1999
    Date of Patent: July 10, 2001
    Assignee: Pohang Iron & Steel Co., Ltd.
    Inventor: Jin Won Choi