Abstract: An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

Abstract: A polycarbonate resin including a unit of Chemical Formula 1, a method for preparing the same, a polycarbonate resin composition including the same, and a molded article including the polycarbonate resin composition are described: wherein all the variables are described herein.

Abstract: A resin including a unit represented by Chemical Formula 1, a method for preparing the same, a resin composition including the same, and a molded article including the resin composition is described: wherein all the variables are described herein.

Abstract: A method of manufacturing a semiconductor device includes sequentially stacking a mold layer and a supporter layer on a substrate, forming a plurality of capacitor holes passing through the mold layer and supporter layer, forming a plurality of lower electrodes filling the capacitor holes, forming a supporter mask pattern having a plurality of mask holes on the supporter layer and the lower electrodes, and forming a plurality of supporter holes by patterning the supporter layer. Each of the plurality of lower electrodes has a pillar shape, and each of the mask holes is between four adjacent lower electrodes and has a circular shape.

Abstract: Provided is an electronic apparatus and a method thereof. The method includes identifying pickup item information, identifying at least one storage place corresponding to the pickup item information among a plurality of storage places in the item storage center based on information on or regarding an item group located at each of the plurality of storage places, and providing information on the identified storage place and the pickup item information to a manager terminal, wherein the item group comprises at least one same item corresponding to an item group, and at least a portion of a plurality of item groups comprising a same item are stored in different storage places in the item storage center.

Abstract: A semiconductor device including: a first transistor which include a first gate stack on a substrate; and a second transistor which includes a second gate stack on the substrate, wherein the first gate stack includes a first ferroelectric material layer disposed on the substrate, a first work function layer disposed on the first ferroelectric material layer and a first upper gate electrode disposed on the first work function layer, wherein the second gate stack includes a second ferroelectric material layer disposed on the substrate, a second work function layer disposed on the second ferroelectric material layer and a second upper gate electrode disposed on the second work function layer, wherein the first work function layer includes the same material as the second work function layer, and wherein an effective work function of the first gate stack is different from an effective work function of the second gate stack.

Abstract: The present disclosure discloses a preview vehicle height control system and a method of controlling the same. The system includes a monitoring device configured to detect the road surface condition of a driving path of a vehicle, an active suspension configured to adjust a vehicle height, a memory configured to store a plurality of data maps distinguished based on a type of bump, each data map having a vehicle dynamic characteristic as an input and a tuning factor as an output, and a controller configured to derive the tuning factor based on a data map, among the plurality of data maps of the memory, corresponding to the bump detected by the monitoring device, derive a target vehicle height in a form of a Gaussian distribution by substituting the tuning factor, and control the active suspension to follow the derived target vehicle height.

Abstract: A cleaning composition for removing post-etch or post-ash residues from a semiconductor substrate, and a cleaning method using the same are disclosed. The cleaning composition can comprise water; a fluorine compound; an alkanolamine compound; and a corrosion inhibitor. The corrosion inhibitor is a mixture of a first corrosion inhibitor and a second corrosion inhibitor. When using the cleaning composition, it is possible to efficiently remove the residues of various aspects existing on a surface of the substrate or the semiconductor device without damage to a substrate or a semiconductor device including various metal layers, insulating layers, etc. Accordingly, when a highly integrated and miniaturized semiconductor device is manufactured, it may be advantageously applied to the removal of residues generated on the surface of the substrate or the semiconductor device.

Abstract: The present invention provides a Streptomyces sp. SNC087 strain (KCCM12505P) that is isolated from seawater and produces staurosporine, a method for producing staurosporine using the same, a method for culturing the same, and a pure culture medium of the same.

Abstract: A resin, a method for preparing the same, a resin composition including the same, and a molded article including the resin composition are disclosed in herein. In some embodiments, a resin includes a unit of Chemical Formula 1 and a unit of Chemical Formula 2: wherein, in Chemical Formulae 1 and 2, Ar1, Ar2, R1, r1, X1 to X4, X9, X10, Z1, Z2, Z5, La, La?, a, b, p, t, m, n, L11, l11, X11 to X16, Z11 to Z13, Lb, Lb?, a?, b?, p?, C?, m? and n? are defined herein.

Abstract: A resin, a method for preparing the same, a resin composition including the same, and a molded article including the resin composition are disclosed herein. In some embodiments, the resin includes a unit of Chemical Formula 1 and a unit of Chemical Formula 2 wherein, in Chemical Formulae 1 and 2, Ar1, Ar2, R1 to R3, r1 to r3, L1, L2, X1 to X10, X?9, X?10, Z1 to Z6, La, La?, La?, La??, a, b, c, d, p, q, t, t?, m, n, m? and n? are defined herein.

Abstract: The present disclosure discloses a preview vehicle height control system and a method of controlling the same. The system includes a monitoring device configured to detect the road surface condition of a driving path of a vehicle, an active suspension configured to adjust a vehicle height, a memory configured to store a plurality of data maps distinguished based on a type of bump, each data map having a vehicle dynamic characteristic as an input and a tuning factor as an output, and a controller configured to derive the tuning factor based on a data map, among the plurality of data maps of the memory, corresponding to the bump detected by the monitoring device, derive a target vehicle height in a form of a Gaussian distribution by substituting the tuning factor, and control the active suspension to follow the derived target vehicle height.

Abstract: A resin includes a unit represented by Chemical Formula 1, a method for preparing the same, a resin composition including the same, and a molded article including the resin composition in Chemical Formula 1, Ar1, Ar2, R1, r1, X1 to X4, Z1, Z2, a and b are described herein.

Abstract: An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

Abstract: An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

Abstract: The present invention provides a Streptomyces sp. SNC087 strain (KCCM12505P) that is isolated from seawater and produces staurosporine, a method for producing staurosporine using the same, a method for culturing the same, and a pure culture medium of the same.

Abstract: Semiconductor package with one or more optical die(s) embedded therein is disclosed. The optical die(s) may have one or more overlying interconnect layers. Electrical contact to the optical die may be via the one or more overlying interconnect layers. An optical waveguide may be disposed next to the optical die and embedded within the semiconductor package. An optical fiber may be optically coupled to the optical waveguide.

Abstract: Semiconductor package with one or more optical die(s) embedded therein is disclosed. The optical die(s) may have one or more overlying interconnect layers. Electrical contact to the optical die may be via the one or more overlying interconnect layers. An optical waveguide may be disposed next to the optical die and embedded within the semiconductor package. An optical fiber may be optically coupled to the optical waveguide.