Abstract: Provided is a polycarbonate resin having a relaxation time of 2 seconds to 15 seconds at 250° C. and a residual phenol content of 3,000 ppm or less.

Abstract: A module comprising: a module substrate; a system-on-chip die coupled to the module substrate; a thermal interface material layer coupled to the system-on-chip die; a stiffener structure positioned around the system-on-chip die and coupled to the module substrate; and a lid having a first portion coupled to the thermal interface material layer, a second portion coupled to the stiffener structure and a recessed region formed around the first portion and having a reduced thickness relative to the first portion and the second portion.

Abstract: Provided is a polycarbonate resin having a high shear viscosity of 10 Pa·s to 260 Pa·s at 250° C.

Abstract: Provided are a polycarbonate resin including a unit of Chemical Formula 1, a method for preparing the same, a polycarbonate resin composition including the same, and a molded article including the polycarbonate resin composition, where all the variables are described herein.

Abstract: Integrated circuit (IC) structures, electronic modules, and methods of fabrication are described in which direct bonded interfaces are removed at corners or edges to counteract the potential for non-bonding or delamination. This can be accomplished during singulation, in which a side recess is formed through an entire thickness of an electronic component and into a direct bonded die, followed by final singulation of the IC structure.

Abstract: A polycarbonate resin including a unit of Chemical Formula 1, a method for preparing the same, a polycarbonate resin composition including the same, and a molded article including the polycarbonate resin composition are disclosed herein. In some embodiments, a polycarbonate resin including a unit of Chemical Formula 1: Ar1 and Ar2 are each independently an aryl group, or a heteroaryl group, R1 is hydrogen, deuterium, a halogen group, a cyano group, an alkyl group, a cycloalkyl group, an alkoxy group, a silyl group, an aryl group, or a heteroaryl group, r1 is 1 or 2, X1 to X4 are each independently O or S, Z1 and Z2 are each independently an alkylene group, or a cycloalkylene group, and a and b are each independently an integer from 1 to 10.

Abstract: A polycarbonate resin including a unit of Chemical Formula 1 and a unit of Chemical Formula 2, a method for preparing the same, a polycarbonate resin composition including the same, and a molded article are disclosed herein: Ar1 and Ar2 are independently an aryl group, or a heteroaryl group, R1 is hydrogen, deuterium, a halogen group, a cyano group, an alkyl group, a cycloalkyl group, an alkoxy group, a silyl group, an aryl group, or a heteroaryl group, R2 and R3 are different from each other, r1 is 1 or 2, r2 and r3 are each an integer from 1 to 4, L1 and L2 are independently an arylene group, X1 to X8 are independently O or S, Z1 to Z4 are independently an alkylene group, or a cycloalkylene group, and a, b, c and d are independently an integer from 1 to 10.

Abstract: Semiconductor package with one or more optical die(s) embedded therein is disclosed. The optical die(s) may have one or more overlying interconnect layers. Electrical contact to the optical die may be via the one or more overlying interconnect layers. An optical waveguide may be disposed next to the optical die and embedded within the semiconductor package. An optical fiber may be optically coupled to the optical waveguide.

Abstract: A resin including a unit of Chemical Formula 1, a method for preparing the same, a resin composition including the same, and a molded article including the resin composition are described: wherein all the variables are described herein.

Abstract: Semiconductor package with one or more optical die(s) embedded therein is disclosed. The optical die(s) may have one or more overlying interconnect layers. Electrical contact to the optical die may be via the one or more overlying interconnect layers. An optical waveguide may be disposed next to the optical die and embedded within the semiconductor package. An optical fiber may be optically coupled to the optical waveguide.

Abstract: An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

Abstract: An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

Abstract: A polycarbonate resin including a unit of Chemical Formula 1, a method for preparing the same, a polycarbonate resin composition including the same, and a molded article including the polycarbonate resin composition are described: wherein all the variables are described herein.

Abstract: A resin including a unit represented by Chemical Formula 1, a method for preparing the same, a resin composition including the same, and a molded article including the resin composition is described: wherein all the variables are described herein.

Abstract: The present disclosure discloses a preview vehicle height control system and a method of controlling the same. The system includes a monitoring device configured to detect the road surface condition of a driving path of a vehicle, an active suspension configured to adjust a vehicle height, a memory configured to store a plurality of data maps distinguished based on a type of bump, each data map having a vehicle dynamic characteristic as an input and a tuning factor as an output, and a controller configured to derive the tuning factor based on a data map, among the plurality of data maps of the memory, corresponding to the bump detected by the monitoring device, derive a target vehicle height in a form of a Gaussian distribution by substituting the tuning factor, and control the active suspension to follow the derived target vehicle height.

Abstract: The present invention provides a Streptomyces sp. SNC087 strain (KCCM12505P) that is isolated from seawater and produces staurosporine, a method for producing staurosporine using the same, a method for culturing the same, and a pure culture medium of the same.

Abstract: A resin, a method for preparing the same, a resin composition including the same, and a molded article including the resin composition are disclosed in herein. In some embodiments, a resin includes a unit of Chemical Formula 1 and a unit of Chemical Formula 2: wherein, in Chemical Formulae 1 and 2, Ar1, Ar2, R1, r1, X1 to X4, X9, X10, Z1, Z2, Z5, La, La?, a, b, p, t, m, n, L11, l11, X11 to X16, Z11 to Z13, Lb, Lb?, a?, b?, p?, C?, m? and n? are defined herein.

Abstract: A resin, a method for preparing the same, a resin composition including the same, and a molded article including the resin composition are disclosed herein. In some embodiments, the resin includes a unit of Chemical Formula 1 and a unit of Chemical Formula 2 wherein, in Chemical Formulae 1 and 2, Ar1, Ar2, R1 to R3, r1 to r3, L1, L2, X1 to X10, X?9, X?10, Z1 to Z6, La, La?, La?, La??, a, b, c, d, p, q, t, t?, m, n, m? and n? are defined herein.

Abstract: The present disclosure discloses a preview vehicle height control system and a method of controlling the same. The system includes a monitoring device configured to detect the road surface condition of a driving path of a vehicle, an active suspension configured to adjust a vehicle height, a memory configured to store a plurality of data maps distinguished based on a type of bump, each data map having a vehicle dynamic characteristic as an input and a tuning factor as an output, and a controller configured to derive the tuning factor based on a data map, among the plurality of data maps of the memory, corresponding to the bump detected by the monitoring device, derive a target vehicle height in a form of a Gaussian distribution by substituting the tuning factor, and control the active suspension to follow the derived target vehicle height.