Abstract: Some forms include an electronic package that includes a photo-detecting receiver IC and a receiver IC. The electronic package includes a mold that encloses the photo-detecting receiver IC and the receiver IC. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching one another. Other forms include an optical module that includes a substrate and an electronic package mounted on the substrate. The electronic package includes a photo-detecting receiver IC and a receiver IC that are enclosed within a mold. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching. Other forms include a method that includes forming a mold that includes a photo-detecting receiver IC and a receiver IC that are adjacent to one another without touching. The photo-detecting receiver IC includes optical components that are exposed on a surface of the mold.

Abstract: Disclosed is a system for estimating a snow depth including: an optical disdrometer for acquiring information on diameters of snow particles and particle number concentration; a laser snow depth gauge for measuring the height of snow accumulated through a laser beam type sensor to provide an observed stop depth; an estimated snow depth equation calculator for determining an optimal index for the diameters of the snow particles provided by the optical disdrometer, substituting the optimal index for a snow depth calculation equation as a first mathematical equation to calculate a computed snow depth, obtaining correlation between the observed snow depth and the computed snow depth, and calculating a regression equation between the observed snow depth and the computed snow depth as an estimated snow depth equation; and a snow depth estimator for estimating the snow depth on the basis of the estimated snow depth equation, and the first mathematical equation.

Abstract: In one embodiment, a microelectronic package structure comprises a substrate comprising at least one waveguide, a first instrument integrated circuit coupled to the substrate, a photonic engine coupled to the substrate and comprising an integrated circuit body, a transmit die, and a receive die. The photonic engine is positioned adjacent the at least one waveguide such that optical signals may be exchanged between the at least one waveguide and the transmit die and the at least one waveguide and the receive die. Other embodiments may be described.

Abstract: A nonvolatile memory device includes multiple memory cells including first memory cells and second memory cells. A method of programming the nonvolatile memory device includes: performing first programming to apply a programming forcing voltage to a bit line of each of the first memory cells; and dividing the second memory cells into a first cell group, a second cell group, and a third cell group, based on a threshold voltage of the second memory cells after performing the first programming. The method also includes performing second programming to apply a programming inhibition voltage to the bit line of each of the first memory cells and a bit line of each of memory cells of the first cell group. A level of the programming forcing voltage is lower than that of the programming inhibition voltage.

Abstract: A method is provided for operating a memory device. The method includes counting, from among memory cells, a number of first off-cells with respect to a first reading voltage and a number of second off-cells with respect to a second reading voltage, comparing the number of first off-cells and the number of second off-cells, and determining, based on a result of the comparing, whether a programming error exists in a storage region in which the memory cells are included.

Abstract: In one embodiment, a microelectronic package structure comprises a substrate comprising at least one waveguide, a first instrument integrated circuit coupled to the substrate, a photonic engine coupled to the substrate and comprising an integrated circuit body, a transmit die. and a receive die. The photonic engine is positioned adjacent the at least one waveguide such that optical signals may be exchanged between the at least one waveguide and the transmit die and the at least one waveguide and the receive die. Other embodiments may be described.

Abstract: A method is provided for operating a memory device. The method includes counting, from among memory cells, a number of first off-cells with respect to a first reading voltage and a number of second off-cells with respect to a second reading voltage, comparing the number of first off-cells and the number of second off-cells, and determining, based on a result of the comparing, whether a programming error exists in a storage region in which the memory cells are included.

Abstract: Optoelectronic device modules having a silicon photonics transmitter die connected to a silicon interposer are described. In an example, the optoelectronic device module includes a silicon photonics transmitter die connected to a silicon interposer, and the silicon interposer is disposed between the silicon photonics transmitter die and a substrate. The silicon interposer provides an electrical interconnect between the silicon photonics transmitter die and the substrate, and reduces a likelihood that a hybrid silicon laser on the silicon photonics transmitter die will be damaged during module operation.

Abstract: A memory device includes a memory cell array including a plurality of memory cells; a counting circuit configured to obtain a counting result by performing a counting operation on data read from the plurality of memory cells; and a control logic configured to perform a data restoring operation based on the counting result without involvement of a memory controller.

Abstract: Embodiments herein may include apparatuses, systems, and processes related to a photonic die package with an edge lens that includes a photonic integrated circuit (IC) die, a lens coupled to the photonic IC die and disposed at an edge of the package to provide an optical path at the edge of the package for photon signals generated or received by the photonic IC die, and an electronic IC die coupled to the photonic IC die, where the electronic IC die is to process electrical signals received from the photonic IC die, and where the electronic IC die and the photonic IC die are in a stack formation to facilitate thermal energy conduction from the electronic IC die to the photonic IC die. Other embodiments may be described and/or claimed.

Abstract: Methods for fabricating semiconductor devices may provide enhanced performance and reliability by recovering quality of a low-k insulating film damaged by a plasma process. A method may include forming a first interlayer insulating film having a trench therein on a substrate, filling at least a portion of the trench with a metal wiring region, exposing a surface of the metal wiring region and a surface of the first interlayer insulating film to a plasma in a first surface treatment process, then exposing the surface of the first interlayer insulating film to a recovery gas containing a methyl group (—CH3) in a second surface treatment process, and then forming an etch stop layer on the metal wiring region and the first interlayer insulating film.

Abstract: Disclosed are a light emitting device package and a lighting apparatus. The light emitting device package includes a substrate, a light emitting structure disposed under the substrate and including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a first electrode connected to the first conductive type semiconductor layer exposed through at least one contact hole, a second electrode connected to the second conductive type semiconductor layer, a first insulating layer configured to extend from under the light emitting structure to a space between a side of the light emitting structure and the first electrode and configured to reflect light, and a reflective layer disposed under the first insulating layer.

Abstract: Semiconductor devices including an interconnection structure are provided. The devices may include an etch stop layer on a lower structure including a contact structure, a buffer layer on the etch stop layer, an intermetal insulating layer including a low-k dielectric material on the buffer layer. The intermetal insulating layer may include a first region having a first dielectric constant and a second region having a second dielectric constant different from the first dielectric constant. The device may also include interconnection structure including a plug portion electrically connected to the contact structure and an interconnection portion on the plug portion. The plug portion may include a first portion extending through the etch stop layer and a second portion that is in the intermetal insulating layer and has a width greater than a width of the first portion. The interconnection portion may include opposing lateral surfaces surrounded by the intermetal insulating layer.

Abstract: Provided are an automatic precipitation sampler system and an operation method thereof. The automatic precipitation sampler system, includes a main body having an water receiving port provided in the upper portion thereof, a driving unit disposed in the main body, a circular table disposed in the main body and rotating by the driving unit, a plurality of sample containers arranged at uniform intervals from each other at positions spaced away from the center of the circular table by a predetermined distance in the radial direction of the circular table, and a plurality of funnels arranged on top of each of the plurality of sample containers such that any one of the plurality of funnels is aligned with the water receiving port.

Abstract: A molding compound comprising a resin, a filler, and a carbon nano-tube dispersion is disclosed. The carbon nano-tube dispersion achieves a low average agglomeration size in the molding compound thereby providing desirable electro-mechanical properties and laser marking compatibility. A shallow laser mark may be formed in a mold cap with a maximum depth of less than 10 microns.

Abstract: A light-emitting device package of an embodiment includes a light-emitting structure including first and second conductive semiconductor layers and an active layer disposed between the first and second conductive semiconductor layers; a light-transmitting electrode layer disposed on the second conductive semiconductor layer; a passivation layer disposed on the second conductive semiconductor layer and a mesa-exposed portion of the first conductive semiconductor layer; a reflection layer disposed from the top of the light-transmitting electrode layer to the top of the passivation layer in a horizontal direction perpendicular to the thickness direction of the light-emitting structure; and a conductive capping layer disposed on the reflection layer.

Abstract: In one embodiment, a microelectronic package structure comprises a substrate comprising at least one waveguide, a first instrument integrated circuit coupled to the substrate, a photonic engine coupled to the substrate and comprising an integrated circuit body, a transmit die. and a receive die. The photonic engine is positioned adjacent the at least one waveguide such that optical signals may be exchanged between the at least one waveguide and the transmit die and the at least one waveguide and the receive die. Other embodiments may be described.

Abstract: Optoelectronic packaging assemblies are provided that are useful for optical data, transfer In high performance computing applications, board to board in data centers, memory to CPU, switch/FPGA (field programmable gate array) for chip to chip interconnects, and memory extension. The packaging assemblies provide fine pitch flip chip interconnects and chip stacking assemblies with good thermo-mechanical reliability. Underfill dams and optical overhang regions and are provided for optical interconnection.

Abstract: Various example embodiments of the present disclosure provide an electronic device including: a housing including a substantially circular opening and a first surface facing in a first direction; a wearing structure configured to enable the electronic device to be removably worn on a part of a human body and connected to the housing; a display disposed in the opening; an annulus installed on the first surface and configured to be rotatable along a periphery of the opining, the annulus including a second surface facing a second direction opposite the first direction; at least one spacer interposed between a part of the first surface and the second surface of the annulus; and a circuit configured to detect a rotation of the annular member and to change the display at least in part based on the rotation.

Abstract: Disclosed is a system for estimating a snow depth including: an optical disdrometer for acquiring information on diameters of snow particles and particle number concentration; a laser snow depth gauge for measuring the height of snow accumulated through a laser beam type sensor to provide an observed stop depth; an estimated snow depth equation calculator for determining an optimal index for the diameters of the snow particles provided by the optical disdrometer, substituting the optimal index for a snow depth calculation equation as a first mathematical equation to calculate a computed snow depth, obtaining correlation between the observed snow depth and the computed snow depth, and calculating a regression equation between the observed snow depth and the computed snow depth as an estimated snow depth equation; and a snow depth estimator for estimating the snow depth on the basis of the estimated snow depth equation, and the first mathematical equation.