Patents by Inventor Jin Yong An

Jin Yong An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090205005
    Abstract: Disclosed is a method of providing additional content in a digital broadcast reception apparatus, the method including receiving a locator of additional content from a broadcast server while a user watches a broadcast program, receiving an instruction to insert the additional content from the broadcast server, receiving and reproducing the additional content from a content providing server designated by the locator, and switching back to the broadcast program. Thus, it is not necessary to allocate a separate channel and/or to switch channels for providing additional content.
    Type: Application
    Filed: February 12, 2009
    Publication date: August 13, 2009
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung-wook Ahn, Gyung-pyo Hong, Kwang-hyuk Kim, Jin-yong Ahn, Hue-yin Kim, Young-suk Kim, Hae-su Gwon, Sang-woong Lee
  • Patent number: 7574003
    Abstract: Disclosed herein are a recording medium, an apparatus for forming the recording medium, and an apparatus and method for reproducing the recording medium. CPI (Copy Protection-related Information), identification information (CPI_Flag) indicative of recording or non-recording of the CPI, and/or a plurality of contents specific information (CSI) with different formats are recorded in a PIC (Permanent Information & Control data) zone of a high-density optical disc such as a BD-ROM (Blu-ray Disc-ROM). A formatting operation and mastering operation are performed under the condition that control data including the CPI, CPI_Flag and/or CSI is separated from main data. An optical disc device judges whether the optical disc has been illegally copied, with reference to the CPI, CPI_Flag and/or CSI read from the optical disc, and compulsorily stops a data playback operation upon judging that the disc has been illegally copied.
    Type: Grant
    Filed: February 19, 2004
    Date of Patent: August 11, 2009
    Assignee: LG Electronics Inc.
    Inventors: Jin Yong Kim, Sang Woon Suh
  • Patent number: 7573791
    Abstract: The present invention provides a method of recording identification information in an optical disc, by which specified disc identification information can be uniformly applicable to efficiently cope with the recording/reproducing of the optical disc. The present invention includes the step of recording disc identification information in a management area of the optical disc wherein the disc identification information identifies a disc type identified according to a disc thickness.
    Type: Grant
    Filed: August 16, 2004
    Date of Patent: August 11, 2009
    Assignee: LG Electronics Inc.
    Inventor: Jin Yong Kim
  • Publication number: 20090196111
    Abstract: A page buffer circuit of a memory device including a plurality of Multi-Level Cells (MLCs) connected to at least a pair of bit lines includes a Most Significant Bit (MSB) latch, a Least Significant Bit (LSB) latch, a data I/O circuit, an inverted output circuit, a MSB verification circuit, and a LSB verification circuit. The MSB latch is configured to sense a voltage of a sensing node in response to a control signal and store an upper sensing data, and output an inverted upper sensing data, or store an input data and output an inverted input data. The LSB latch is configured to sense a voltage of the sensing node in response to the control signal, and store and output a lower sensing data, or store and output an input data received through the MSB latch. The data I/O circuit is connected to the MSB latch and a data I/O line, and is configured to perform the input and output of a sensing data or the input and output of a program data.
    Type: Application
    Filed: April 7, 2009
    Publication date: August 6, 2009
    Applicant: Hynix Semiconductor Inc.
    Inventor: Jin-Yong Seong
  • Publication number: 20090196099
    Abstract: A page buffer circuit of a memory device including a plurality of Multi-Level Cells (MLCs) connected to at least a pair of bit lines includes a Most Significant Bit (MSB) latch, a Least Significant Bit (LSB) latch, a data I/O circuit, an inverted output circuit, a MSB verification circuit, and a LSB verification circuit. The MSB latch is configured to sense a voltage of a sensing node in response to a control signal and store an upper sensing data, and output an inverted upper sensing data, or store an input data and output an inverted input data. The LSB latch is configured to sense a voltage of the sensing node in response to the control signal, and store and output a lower sensing data, or store and output an input data received through the MSB latch. The data I/O circuit is connected to the MSB latch and a data I/O line, and is configured to perform the input and output of a sensing data or the input and output of a program data.
    Type: Application
    Filed: April 7, 2009
    Publication date: August 6, 2009
    Applicant: Hynix Semiconductor Inc.
    Inventor: Jin-Yong Seong
  • Patent number: 7571077
    Abstract: A method for evaluating an anti-contamination level on a surface of optical recording medium is disclosed. The method includes forming an artificial fingerprint on the surface by contacting a stamp having an artificial material adhered thereto on an optical recording medium, and measuring a symbol error rate (SER) of the formed artificial fingerprint, to determine a sensitivity of the fingerprint and determining whether the optical recording medium is of good quality or bad quality depending upon the measured SER.
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: August 4, 2009
    Assignee: LG Electronics, Inc.
    Inventors: Hun Seo, Seung Yoon Lee, Jin Hong Kim, Jin Yong Kim
  • Publication number: 20090185420
    Abstract: A page buffer circuit with reduced size and methods for reading and programming data is provided. In the reading operation, the page buffer circuit reads out a data bit by alternatively using a higher bit register or a lower bit register regardless of whether the data bit read from the multi-level cell is a higher bit or a lower bit, thereby reducing the circuit area and improves the performance of operation.
    Type: Application
    Filed: March 23, 2009
    Publication date: July 23, 2009
    Applicant: Hynix Semiconductor Inc.
    Inventors: Jin Yong Seong, Sam Kyu Won
  • Publication number: 20090185419
    Abstract: A page buffer circuit with reduced size and methods for reading and programming data is provided. In the reading operation, the page buffer circuit reads out a data bit by alternatively using a higher bit register or a lower bit register regardless of whether the data bit read from the multi-level cell is a higher bit or a lower bit, thereby reducing the circuit area and improves the performance of operation.
    Type: Application
    Filed: March 23, 2009
    Publication date: July 23, 2009
    Applicant: Hynix Semiconductor Inc.
    Inventors: Jin Yong Seong, Sam Kyu Won
  • Patent number: 7564760
    Abstract: In a recordable optical disc including at least one recording layer, writing speed information and per writing speed write strategy information are recorded within disc control information, so that standardized disc control information can be uniformly applied to data recording and reproduction. At least one disc control information is recorded within the management area in per applicable writing speed order, and at least one disc information is recorded within a same writing speed in per recording layer order.
    Type: Grant
    Filed: July 1, 2004
    Date of Patent: July 21, 2009
    Assignee: LG Electronics, Inc.
    Inventors: Jin Yong Kim, Sang Woon Suh
  • Patent number: 7564116
    Abstract: A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.
    Type: Grant
    Filed: January 18, 2008
    Date of Patent: July 21, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Yong Ahn, Cheol Seong Hwang, Sung Kun Kim, Chang Sup Ryu, Suk-Hyeon Cho, Ho Sik Jeon
  • Patent number: 7561496
    Abstract: A recording medium, such as a high-density and/or read-only recording medium, such as BD-ROM, which includes copy protection information for preventing illegal copying of the contents recorded on the recording medium, and to methods and apparatuses for forming, recording, and reproducing data on the recording medium.
    Type: Grant
    Filed: May 20, 2004
    Date of Patent: July 14, 2009
    Assignee: LG Electronics Inc.
    Inventors: Jin Yong Kim, Jung Bae Park
  • Publication number: 20090173727
    Abstract: A butt-joint welding method is disclosed, which is capable of improving welding productivity by reducing the number of welding passes by weaving a welding wire in submerged arc welding. The welding method includes arranging two parent metals having 10-35 mm thickness at an interval of 8-20 mm to face each other, attaching a backing material to rear sides of the two parent metals, the rear sides facing each other, so that the backing material seals a space between the parent metals through surface-contact with the rear sides, performing flux cored arc welding or compositely performing the flux cored arc welding and submerged arc welding 1-3 times on an upper layer of the backing material, and welding the two parent metals while weaving a submerged arc welding wire transversely.
    Type: Application
    Filed: September 9, 2008
    Publication date: July 9, 2009
    Applicant: DAEWOO SHIPBUILDING & MARINE ENGINEERING CO., LTD.
    Inventors: Kwang Hee Yun, Jin Yong Kim, Tae Min Hong
  • Patent number: 7558175
    Abstract: A recording medium, such as a high-density and/or read-only recording medium including a data area including at least two data sections and a linking area to link neighboring data sections, the linking area including at least one physical address, and to methods and apparatuses for forming, recording, and reproducing the recording medium.
    Type: Grant
    Filed: January 9, 2004
    Date of Patent: July 7, 2009
    Assignee: LG Electronics Inc.
    Inventors: Jin Yong Kim, Sang Woon Suh
  • Publication number: 20090168518
    Abstract: A chip select controller for a non-volatile memory device includes a first chip enable signal transfer unit, a second chip enable signal transfer unit, a first chip select pad, a second chip select pad, a third chip select pad and a chip select unit. The first chip enable signal transfer unit buffers first and second chip enable signals according to a control signal. The second chip enable signal transfer unit buffers third and fourth chip enable signals according to the control signal. The first chip select pad is configured to transfer a first chip select signal. The second chip select pad is configured to transfer a second chip select signal. The third chip select pad is configured to transfer the second chip select signal. The chip select unit addresses a specific chip according to the first chip select signal and the second chip select signal.
    Type: Application
    Filed: April 14, 2008
    Publication date: July 2, 2009
    Applicant: Hynix Semiconductor Inc.
    Inventor: Jin Yong SEONG
  • Publication number: 20090169837
    Abstract: A package substrate and a method of manufacturing the package substrate are disclosed. The method of manufacturing the package substrate may include stacking a second metal layer in which at least one hole is formed over a first metal layer, stacking a barrier layer over the first metal layer exposed in the hole and over the second metal layer, forming at least one bump by filling the hole with a conductive metal, stacking an insulation layer over the bump and forming a circuit pattern over the insulation layer, and removing the first metal layer, the second metal layer, and the barrier layer.
    Type: Application
    Filed: June 30, 2008
    Publication date: July 2, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin-Yong An, Chang-Sup Ryu, Jong-Kuk Hong
  • Publication number: 20090152486
    Abstract: A pressure adjusting valve for a vehicle fuel line includes a diaphragm disposed in a housing and dividing the interior of the housing into first and second compartments. A valve plate is provided in the second compartment and attached to the diaphragm. A return unit is provided in the second compartment. An elastic member provides an elastic force to the diaphragm toward the second compartment. An elastic force adjusting unit controls the elastic force of the elastic member.
    Type: Application
    Filed: August 18, 2008
    Publication date: June 18, 2009
    Applicant: Hyundai Motor Company
    Inventors: Ha Dong Bong, Jin Yong Kim, Seunghwan Hwang, Il Joong Hwang, Tae Yeol Shin, Kwangsoon Choi, Sangmin Lee
  • Publication number: 20090151802
    Abstract: An impulse charger for motor vehicle engines include impulse valves driven using driving force continuously generated by a driving apparatus so as to be instantaneously opened and closed at a high speed by a link unit in which link members are interconnected, and in which the impulse valves for all cylinders are simultaneously driven. Thus, the impulse charger provides simple drive control, reduction in necessary components, and an efficient mounting space, guarantees easy manufacturing and mounting at a low cost, and prevents noise from being generated when the impulse valves are operated.
    Type: Application
    Filed: November 29, 2008
    Publication date: June 18, 2009
    Applicant: Hyundai Motor Company
    Inventors: In Sang RYU, Jin Yong Kong, Yong Yun Hwang, Seong Hyuk Kang, Woo Tae Kim, Seung Woo Lee
  • Publication number: 20090151160
    Abstract: A method of manufacturing a printed circuit board having solder balls. The method may include: stacking a second carrier, in which at least one hole is formed, over one side of a first carrier; forming at least one solder bump by filling the hole with a conductive material; forming a circuit pattern layer, which is electrically connected with the solder bump, on the second carrier; and exposing the solder bump by removing the first carrier and the second carrier. Using this method, uniform hemispherical solder balls with fine pitch can be formed as a part of the manufacturing process, without having to attach the solder balls separately. Carriers may be used to serve as supports during the manufacturing process, whereby deformations can be prevented in the board.
    Type: Application
    Filed: June 19, 2008
    Publication date: June 18, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Shuhichi Okabe, Jin-Yong An, Seok-Kyu Lee, Soon-Oh Jung, Jong-Kuk Hong, Hae-Nam Seo
  • Publication number: 20090152233
    Abstract: Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer.
    Type: Application
    Filed: February 9, 2009
    Publication date: June 18, 2009
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Hyeon CHO, Chang Sup RYU, Jin Soo JEONG, Jin Yong AHN
  • Publication number: 20090147488
    Abstract: Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer.
    Type: Application
    Filed: February 9, 2009
    Publication date: June 11, 2009
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Hyeon Cho, Chang Sup Ryu, Jin Soo Jeong, Jin Yong Ahn