Abstract: A method of making a fiber optic connector adapted to receive a fiber bearing unit involves coupling at least one high precision piece, having holes configured to accept an array of optical fibers, to a low precision piece to form a unit, inserting optical fibers into the unit and housing the unit within a fiber optic connector housing. A commercial fiber optic connector of a style constructed to accept a ferrule-like unit therein has a connector housing, at least 36 optical fibers, a low precision piece, and at least one high precision slice having at least 36 fiber holes each adapted to accept one of the optical fibers, the low precision piece and the at least one high precision slice being contained substantially within the connector housing and forming the ferrule like unit.

Abstract: A method of integrating a chip with a topside active optical chip is described. The topside active optical chip has at least one optical laser device, having an active side including an optically active region, a laser cavity having a height, an optically inactive region, a bonding side opposite the active side, and a device thickness. The method involves bonding the optical chip to the electronic chip; applying a substrate to the active side, the substrate having a substrate thickness over the active region in the range of between a first amount and a second amount, and applying an anti-reflection without a special patterning or distinguishing between the at least one optical laser device and any other device. A hybrid electro-optical chip is also described as having an electronic chip; and a topside active optical chip. The hybrid electro-optical chip having been created by one of the methods herein. A module is also described.

Abstract: An optical unit has multiple optical devices, a collimated coupler disposed relative to the multiple optical devices so that laser light can be transferred between at least two of the multiple optical devices and the collimated coupler without crosstalk, and a fused glass collimator, disposed within the collimated coupler, having multiple optical fibers arranged in a predetermined arrangement relative to the multiple optical devices so that the number of optical fibers is always equal to or greater than the number of optical devices on a use basis.

Abstract: A method for creating a hybridized chip by combining a bottom active optical device and an electronic chip when at least some of the active device contacts are not aligned with at least some of the electronic chip contacts. The method involves adding an insulating layer, having a thickness, a first side and a second side, to the bottom active optical device by affixing the first side to the surface, openings in the insulating layer extending from the second side to the first side at points substantially coincident with the active device contacts, making the sidewalls electrically conductive, and connecting the points and the electronic chip contacts with an electrically conductive material. A hybridized chip has at least one bottom active optical device coupled to an electronic chip, the hybridized chip having been created using a described method. A method of connecting two chips, each having electrically corresponding contacts to be joined together but are physically mismatched relative to each other.

Abstract: In a semiconductor device comprising photo-transceiver arrays constructed on silicon substrates with underlying supporting CMOS circuitry in the substrate interfacing with a source of software control, a method is provided for mapping and reconfiguring the global data transfer channel map of optical interconnect lines and intra-nodal routing links. An initial mapping procedure identifies all possible connections. The silicon circuitry provides for sensing optical connections and light levels, for testing or sensing of routing links, and for controlling gain and power, as well as forming and reforming routing links between detectors and emitters. A rule-based routing, mapping and re-mapping scheme, utilizing over-sampling techniques and effectuated by the silicon circuitry and software, accommodates limited misalignment of mating photo-arrays, faults occurring in data transmission channels after the initial mapping, and provides additional security, performance and power management capabilities.

Abstract: A commercial fiber optic connector of a style constructed to accept a ferrule-like unit therein has optical fibers, each having a first part and a second part separated by lengths, a low precision piece having a peripheral shape of a part of the ferrule like unit, two high precision slices each having fiber holes therein. A chamber separates the two high precision pieces defining a volume therebetween. The optical fibers have their first parts within the fiber holes in one of the high precision slices, their second parts within the fiber holes in the other of the high precision slices, and at least some of their length within the volume. The low precision piece and the two high precision slices collectively form the ferrule like unit and the ferrule like unit is contained substantially within the connector housing.

Abstract: A multi-wavelength laser array has a group of multiple lasers, each of the lasers in the group being constructed to emit at a specified wavelength within a range, the specified wavelength of one laser being different from the specified wavelength of the other lasers in the group. The lasers in the group are individually selectable so that, when emission at a particular wavelength is called for, a laser capable of providing the particular wavelength will be selected.

Abstract: A coupler adapter has a base and at least one alignment feature disposed upon the base. The at least one alignment feature is constructed for aligning a multi-fiber bundle to an opto-electronic module to permit transmission of optical signals between the multi-fiber bundle and optical devices within the opto-electronic module when the opto-electronic module is larger in span than a spacing of alignment elements used in a commercial connector that holds the multi-fiber bundle.

Abstract: A method of creating a hybridized chip using a top active optical device combined with an electronic chip having electronic chip contacts, when at least some of the active device contacts are not aligned with at least some of the electronic chip contacts, each of the at least some active device contacts having an electrically corresponding electronic chip contact. The method involves creating sidewalls defining openings in the substrate, extending from the first side at the active device contacts to a bottom of the substrate opposite the first side, at points substantially coincident with the active device contacts; making the sidewalls electrically conductive; and connecting the points and the electronic chip contacts with an electrically conductive material. A hybridized chip has at least one top active optical device coupled to an electronic chip, the hybridized chip having been created using a described method.

Abstract: A pump laser capable of delivering at least a specified amount of output power is described. The pump laser has an array of N semiconductor lasers each having a first wavelength and an individual available output power (P) such that the product of N times P is equal to or greater than the specified amount of output power. The pump laser also has a coupler configured to couple light emitted by the individual lasers in the array to an individual optical fiber.

Abstract: An optical unit has multiple optical devices, a collimated coupler disposed relative to the multiple optical devices so that laser light can be transferred between at least two of the multiple optical devices and the collimated coupler without crosstalk, and a fused glass collimator, disposed within the collimated coupler, having multiple optical fibers arranged in a predetermined arrangement relative to the multiple optical devices so that the number of optical fibers is always equal to or greater than the number of optical devices on a use basis.

Abstract: A method of integrating a chip with a topside active optical chip is described. The topside active optical chip has at least one optical laser device, having an active side including an optically active region, a laser cavity having a height, an optically inactive region, a bonding side opposite the active side, and a device thickness. The method involves bonding the optical chip to the electronic chip; applying a substrate to the active side, the substrate having a substrate thickness over the active region in the range of between a first amount and a second amount, and applying an anti-reflection without a special patterning or distinguishing between the at least one optical laser device and any other device. A hybrid electro-optical chip is also described as having an electronic chip; and a topside active optical chip. The hybrid electro-optical chip having been created by one of the methods herein. A module is also described.

Abstract: A unit has an array of lasers having an emission surface through which beams can be emitted in a substantially vertical direction so as to define an emission side, drive electronics connected to a side opposite to the emission side of the array of lasers, and an array of modulators, located on the emission side of the array of lasers and connected to the drive electronics.

Abstract: A ferrule has a body, peripherally dimensioned for receipt within a commercially available fiber optic connector, the body has a forward portion comprising a front side and a rear side, the front side defining a face of the ferrule, the rear side defining an inner surface. The forward portion has a large format array of fiber holes, each of the fiber holes in the array extending between the front side and the rear side and being sized to accept an optical fiber inserted therein, and the forward portion having a thickness, T, less than 3000 microns but at least a minimum thickness sufficient to support optical fibers inserted into the fiber holes. An optical connector, having a ferrule, and a fiber optic cable assembly are also described.

Abstract: A unit is made up of an electronic integrated circuit, a MEMS device, and an active optical device, electrically coupled to the electronic integrated circuit and located between the electronic integrated circuit and the MEMS device. Tthe MEMS device is electrically coupled to the electronic integrated circuit and positioned to affect the behavior of light, relative to the active optical device, based upon the position of an element in the MEMS device as controlled by the electronic integrated circuit.

Abstract: A high rate optical correlator is implemented on a substrate in which all of the optical devices are referenced to the flat surface of the substrate for optical alignment purposes by mounting the devices thereon. With the substrate surface as a reference point, alignment of the optical pieces is achieved to within a wavelength to eliminate the possibility of a “no correlation” result due to optical misalignment of the optical pieces. Additionally for the active elements, namely the laser, detector and spatial light modulators, interconnection of these devices and to drive sources is accomplished via direct coupling through the substrate so that the devices can communicate with each other through the silicon, thus to eliminate wire bonding and reduce pin count for the approximate 100,000 optical interconnects for a 256/256 array. Moreover, an epoxy frame which is milled at its top surface is used to mount an optical element over an active element for the alignment thereof.

Abstract: An electro-optical transceiver system with controlled lateral light leakage and a method of making such a system includes a plurality of emitter devices and detector devices including at least one of each, arranged in a planar array for transmitting and receiving, respectively, energy in a predetermined wavelength and a blocking medium disposed interstitially of the devices and being absorbing at the predetermined wavelength for blocking energy at the predetermined wavelength laterally leaking from an emitter device to one or more detector devices.

Abstract: An electro-optical transceiver system with controlled lateral light leakage and a method of making such a system includes a plurality of emitter devices and detector devices including at least one of each, arranged in a planar array for transmitting and receiving, respectively, energy in a predetermined wavelength and a blocking medium disposed interstitially of the devices and being absorbing at the predetermined wavelength for blocking energy at the predetermined wavelength laterally leaking from an emitter device to one or more detector devices.

Abstract: An optical transmission device wherein each device has a single dedicated channel for receiving data and destination addressing is not required. The device is formed by constructing an array of transmitter/receiver pairs (transceivers) with a processing means and a gate controller. The network is configured such that transmission on any particular receiver reserved channel results in data being sent to a predetermined node having that particular receiver reserved channel. Data passes through other nodes without pausing to check the address information in the header when the data arrives at a node as is not in the dedicated receiver reserved channel.

Abstract: An electro-optical transceiver system with controlled lateral light leakage and a method of making such a system includes a plurality of emitter devices and detector devices including at least one of each, arranged in a planar array for transmitting and receiving, respectively, energy in a predetermined wavelength and a blocking medium disposed interstitially of the devices and being absorbing at the predetermined wavelength for blocking energy at the predetermined wavelength laterally leaking from an emitter device to one or more detector devices.